KR100865204B1 - 회로접속재료, 이것을 이용한 필름상 회로접속재료,회로부재의 접속구조 및 그 제조방법 - Google Patents

회로접속재료, 이것을 이용한 필름상 회로접속재료,회로부재의 접속구조 및 그 제조방법 Download PDF

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Publication number
KR100865204B1
KR100865204B1 KR1020067015544A KR20067015544A KR100865204B1 KR 100865204 B1 KR100865204 B1 KR 100865204B1 KR 1020067015544 A KR1020067015544 A KR 1020067015544A KR 20067015544 A KR20067015544 A KR 20067015544A KR 100865204 B1 KR100865204 B1 KR 100865204B1
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KR
South Korea
Prior art keywords
circuit
connection
electrodes
film
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020067015544A
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English (en)
Korean (ko)
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KR20070012337A (ko
Inventor
준 다케타츠
이츠오 와타나베
야스시 고토우
카즈오 야마구치
마사키 후지이
아야 후지이
Original Assignee
히다치 가세고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004002305A external-priority patent/JP4380327B2/ja
Priority claimed from JP2004002308A external-priority patent/JP4380328B2/ja
Application filed by 히다치 가세고교 가부시끼가이샤 filed Critical 히다치 가세고교 가부시끼가이샤
Publication of KR20070012337A publication Critical patent/KR20070012337A/ko
Application granted granted Critical
Publication of KR100865204B1 publication Critical patent/KR100865204B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
KR1020067015544A 2004-01-07 2005-01-06 회로접속재료, 이것을 이용한 필름상 회로접속재료,회로부재의 접속구조 및 그 제조방법 Expired - Lifetime KR100865204B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004002305A JP4380327B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2004002308A JP4380328B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JPJP-P-2004-00002305 2004-01-07
JPJP-P-2004-00002308 2004-01-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020087014740A Division KR100908370B1 (ko) 2004-01-07 2005-01-06 회로접속재료용 피복입자

Publications (2)

Publication Number Publication Date
KR20070012337A KR20070012337A (ko) 2007-01-25
KR100865204B1 true KR100865204B1 (ko) 2008-10-23

Family

ID=34752086

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020067015544A Expired - Lifetime KR100865204B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 이것을 이용한 필름상 회로접속재료,회로부재의 접속구조 및 그 제조방법
KR1020097008205A Expired - Lifetime KR100996035B1 (ko) 2004-01-07 2005-01-06 필름상 회로접속재료, 회로부재의 접속구조물 및 그 제조방법
KR1020087014740A Expired - Lifetime KR100908370B1 (ko) 2004-01-07 2005-01-06 회로접속재료용 피복입자
KR1020097008206A Expired - Lifetime KR100981483B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 회로부재의 접속구조 및 그 제조방법

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020097008205A Expired - Lifetime KR100996035B1 (ko) 2004-01-07 2005-01-06 필름상 회로접속재료, 회로부재의 접속구조물 및 그 제조방법
KR1020087014740A Expired - Lifetime KR100908370B1 (ko) 2004-01-07 2005-01-06 회로접속재료용 피복입자
KR1020097008206A Expired - Lifetime KR100981483B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 회로부재의 접속구조 및 그 제조방법

Country Status (7)

Country Link
US (1) US20100025089A1 (https=)
EP (1) EP1702968A4 (https=)
KR (4) KR100865204B1 (https=)
CN (2) CN103409082A (https=)
SG (1) SG158842A1 (https=)
TW (4) TW200942596A (https=)
WO (1) WO2005066298A1 (https=)

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JP4967482B2 (ja) * 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
CN101536260B (zh) * 2006-11-10 2012-01-11 日立化成工业株式会社 粘接膜、以及电路部件的连接结构和连接方法
EP2178094A4 (en) * 2007-08-02 2013-02-20 Hitachi Chemical Co Ltd SWITCHING CONNECTING MATERIAL AND CONNECTING STRUCTURE OF A SWITCHING ELEMENT AND CONNECTION METHOD OF A SWITCHING ELEMENT ON THE SWITCHING CONNECTING MATERIAL
WO2009057376A1 (ja) * 2007-10-29 2009-05-07 Hitachi Chemical Company, Ltd. 回路接続材料、接続構造体及びその製造方法
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
CN102870208B (zh) * 2010-04-01 2015-07-01 株式会社村田制作所 电子部件及其制造方法
JP5530571B1 (ja) * 2012-11-28 2014-06-25 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
GB2518363A (en) * 2013-09-18 2015-03-25 Novalia Ltd Circuit board assembly
DE102013219688B3 (de) * 2013-09-30 2015-02-05 Robert Bosch Gmbh Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung
CN105295812B (zh) * 2014-07-22 2021-03-02 昭和电工材料株式会社 连接材料和太阳能电池模块
CN113053562B (zh) * 2017-01-27 2023-03-31 昭和电工材料株式会社 绝缘被覆导电粒子、各向异性导电膜及其制造方法、连接结构体及其制造方法
US10733136B1 (en) * 2019-03-01 2020-08-04 Western Digital Technologies, Inc. Vertical surface mount type C USB connector

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04115407A (ja) * 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JPH07133466A (ja) * 1993-11-09 1995-05-23 Soken Kagaku Kk 接着方法

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US4999460A (en) * 1989-08-10 1991-03-12 Casio Computer Co., Ltd. Conductive connecting structure
JP3004042B2 (ja) * 1990-10-12 2000-01-31 綜研化学株式会社 金属含有樹脂粒子およびその用途
JP2748705B2 (ja) * 1991-02-14 1998-05-13 日立化成工業株式会社 回路の接続部材
JPH07105716A (ja) * 1993-10-05 1995-04-21 Soken Kagaku Kk 被覆粒子および異方導電性接着剤
TW277152B (https=) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
KR100235082B1 (ko) * 1995-04-04 1999-12-15 우찌가사끼 이사오 접착제, 접착 필름 및 접착제-부착 금속박
EP0744884A3 (en) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Method of manufacturing a multilayer printed circuit board
KR100261793B1 (ko) * 1995-09-29 2000-07-15 니시무로 타이죠 고강도 고신뢰성 회로기판 및 그 제조방법
JP4469089B2 (ja) * 1999-02-08 2010-05-26 日立化成工業株式会社 回路接続用フィルム状異方導電性接着剤、電極の接続構造及び電極の接続方法
TWI278501B (en) * 1999-08-25 2007-04-11 Hitachi Chemical Co Ltd Adhesive film for connecting wiring terminals
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JP4752107B2 (ja) * 2000-11-29 2011-08-17 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4788036B2 (ja) * 2000-11-29 2011-10-05 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4852785B2 (ja) * 2000-11-29 2012-01-11 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
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JPH04115407A (ja) * 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JPH07133466A (ja) * 1993-11-09 1995-05-23 Soken Kagaku Kk 接着方法

Also Published As

Publication number Publication date
KR100908370B1 (ko) 2009-07-20
EP1702968A1 (en) 2006-09-20
TW200942596A (en) 2009-10-16
KR100996035B1 (ko) 2010-11-22
KR100981483B1 (ko) 2010-09-10
SG158842A1 (en) 2010-02-26
TWI320575B (https=) 2010-02-11
CN101944659B (zh) 2016-08-17
US20100025089A1 (en) 2010-02-04
KR20090074778A (ko) 2009-07-07
TWI323276B (https=) 2010-04-11
EP1702968A4 (en) 2010-08-25
KR20070012337A (ko) 2007-01-25
TW200951201A (en) 2009-12-16
KR20090064461A (ko) 2009-06-18
TWI320427B (https=) 2010-02-11
TW200945373A (en) 2009-11-01
KR20080065314A (ko) 2008-07-11
CN101944659A (zh) 2011-01-12
WO2005066298A1 (ja) 2005-07-21
CN103409082A (zh) 2013-11-27
TW200525005A (en) 2005-08-01

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