CN103409082A - 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法 - Google Patents

电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法 Download PDF

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Publication number
CN103409082A
CN103409082A CN2013103506129A CN201310350612A CN103409082A CN 103409082 A CN103409082 A CN 103409082A CN 2013103506129 A CN2013103506129 A CN 2013103506129A CN 201310350612 A CN201310350612 A CN 201310350612A CN 103409082 A CN103409082 A CN 103409082A
Authority
CN
China
Prior art keywords
circuit
connection material
electrode
film
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013103506129A
Other languages
English (en)
Chinese (zh)
Inventor
竹田津润
渡边伊津夫
后藤泰史
山口一夫
藤井正规
藤井绫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004002308A external-priority patent/JP4380328B2/ja
Priority claimed from JP2004002305A external-priority patent/JP4380327B2/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN103409082A publication Critical patent/CN103409082A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
CN2013103506129A 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法 Pending CN103409082A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004002308A JP4380328B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2004002305A JP4380327B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2004-002305 2004-01-07
JP2004-002308 2004-01-07

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNA200580001944XA Division CN1906265A (zh) 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法

Publications (1)

Publication Number Publication Date
CN103409082A true CN103409082A (zh) 2013-11-27

Family

ID=34752086

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2013103506129A Pending CN103409082A (zh) 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法
CN201010245654.2A Expired - Lifetime CN101944659B (zh) 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201010245654.2A Expired - Lifetime CN101944659B (zh) 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法

Country Status (7)

Country Link
US (1) US20100025089A1 (https=)
EP (1) EP1702968A4 (https=)
KR (4) KR100996035B1 (https=)
CN (2) CN103409082A (https=)
SG (1) SG158842A1 (https=)
TW (4) TW200951201A (https=)
WO (1) WO2005066298A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105295812A (zh) * 2014-07-22 2016-02-03 日立化成株式会社 连接材料和太阳能电池模块

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4967482B2 (ja) * 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
CN102447168A (zh) * 2006-11-10 2012-05-09 日立化成工业株式会社 粘接膜、以及电路部件的连接结构和连接方法
JP5316410B2 (ja) * 2007-08-02 2013-10-16 日立化成株式会社 回路部材の接続構造
WO2009057376A1 (ja) * 2007-10-29 2009-05-07 Hitachi Chemical Company, Ltd. 回路接続材料、接続構造体及びその製造方法
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
CN102870208B (zh) * 2010-04-01 2015-07-01 株式会社村田制作所 电子部件及其制造方法
WO2014084173A1 (ja) * 2012-11-28 2014-06-05 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
GB2518363A (en) 2013-09-18 2015-03-25 Novalia Ltd Circuit board assembly
DE102013219688B3 (de) * 2013-09-30 2015-02-05 Robert Bosch Gmbh Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung
CN110214353B (zh) * 2017-01-27 2021-04-02 昭和电工材料株式会社 绝缘被覆导电粒子、各向异性导电膜、各向异性导电膜的制造方法、连接结构体和连接结构体的制造方法
US10733136B1 (en) * 2019-03-01 2020-08-04 Western Digital Technologies, Inc. Vertical surface mount type C USB connector

Citations (2)

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US5162087A (en) * 1990-09-03 1992-11-10 Soken Chemical & Engineering Co., Ltd. Anisotropic conductive adhesive compositions
CN1398279A (zh) * 2000-02-09 2003-02-19 日立化成工业株式会社 树脂组合物、使用该树脂组合物的电路元件连接用粘接剂及电路板

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US4999460A (en) * 1989-08-10 1991-03-12 Casio Computer Co., Ltd. Conductive connecting structure
JP3004042B2 (ja) * 1990-10-12 2000-01-31 綜研化学株式会社 金属含有樹脂粒子およびその用途
JP2748705B2 (ja) * 1991-02-14 1998-05-13 日立化成工業株式会社 回路の接続部材
JPH07105716A (ja) * 1993-10-05 1995-04-21 Soken Kagaku Kk 被覆粒子および異方導電性接着剤
JPH07133466A (ja) * 1993-11-09 1995-05-23 Soken Kagaku Kk 接着方法
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EP0744884A3 (en) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Method of manufacturing a multilayer printed circuit board
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JP4469089B2 (ja) * 1999-02-08 2010-05-26 日立化成工業株式会社 回路接続用フィルム状異方導電性接着剤、電極の接続構造及び電極の接続方法
TWI291982B (https=) * 1999-08-25 2008-01-01 Hitachi Chemical Co Ltd
JP4752107B2 (ja) * 2000-11-29 2011-08-17 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4788036B2 (ja) * 2000-11-29 2011-10-05 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4852785B2 (ja) * 2000-11-29 2012-01-11 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5162087A (en) * 1990-09-03 1992-11-10 Soken Chemical & Engineering Co., Ltd. Anisotropic conductive adhesive compositions
CN1398279A (zh) * 2000-02-09 2003-02-19 日立化成工业株式会社 树脂组合物、使用该树脂组合物的电路元件连接用粘接剂及电路板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105295812A (zh) * 2014-07-22 2016-02-03 日立化成株式会社 连接材料和太阳能电池模块

Also Published As

Publication number Publication date
SG158842A1 (en) 2010-02-26
TW200942596A (en) 2009-10-16
KR20080065314A (ko) 2008-07-11
WO2005066298A1 (ja) 2005-07-21
TWI320427B (https=) 2010-02-11
CN101944659A (zh) 2011-01-12
KR100865204B1 (ko) 2008-10-23
KR100996035B1 (ko) 2010-11-22
EP1702968A4 (en) 2010-08-25
KR20070012337A (ko) 2007-01-25
CN101944659B (zh) 2016-08-17
KR20090074778A (ko) 2009-07-07
TW200945373A (en) 2009-11-01
TW200951201A (en) 2009-12-16
US20100025089A1 (en) 2010-02-04
KR20090064461A (ko) 2009-06-18
KR100981483B1 (ko) 2010-09-10
TWI320575B (https=) 2010-02-11
KR100908370B1 (ko) 2009-07-20
TW200525005A (en) 2005-08-01
TWI323276B (https=) 2010-04-11
EP1702968A1 (en) 2006-09-20

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Application publication date: 20131127

RJ01 Rejection of invention patent application after publication