KR100855302B1 - 프로브 카드 및 접속체 본딩 방법 - Google Patents

프로브 카드 및 접속체 본딩 방법 Download PDF

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Publication number
KR100855302B1
KR100855302B1 KR1020070016403A KR20070016403A KR100855302B1 KR 100855302 B1 KR100855302 B1 KR 100855302B1 KR 1020070016403 A KR1020070016403 A KR 1020070016403A KR 20070016403 A KR20070016403 A KR 20070016403A KR 100855302 B1 KR100855302 B1 KR 100855302B1
Authority
KR
South Korea
Prior art keywords
substrate structure
connection
socket
contact
probe card
Prior art date
Application number
KR1020070016403A
Other languages
English (en)
Korean (ko)
Other versions
KR20080076457A (ko
Inventor
이정훈
Original Assignee
주식회사 파이컴
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 파이컴 filed Critical 주식회사 파이컴
Priority to KR1020070016403A priority Critical patent/KR100855302B1/ko
Priority to PCT/KR2008/000890 priority patent/WO2008100101A1/en
Priority to TW97105354A priority patent/TWI363456B/zh
Priority to CN2008800049720A priority patent/CN101611486B/zh
Priority to JP2009549529A priority patent/JP2010519508A/ja
Publication of KR20080076457A publication Critical patent/KR20080076457A/ko
Application granted granted Critical
Publication of KR100855302B1 publication Critical patent/KR100855302B1/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020070016403A 2007-02-16 2007-02-16 프로브 카드 및 접속체 본딩 방법 KR100855302B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020070016403A KR100855302B1 (ko) 2007-02-16 2007-02-16 프로브 카드 및 접속체 본딩 방법
PCT/KR2008/000890 WO2008100101A1 (en) 2007-02-16 2008-02-15 Probe card including a plurality of connectors and method of bonding the connectors to a substrate of the probe card
TW97105354A TWI363456B (en) 2007-02-16 2008-02-15 Probe card including a plurality of connectors and method of bonding the connectors to a substrate of the probe card
CN2008800049720A CN101611486B (zh) 2007-02-16 2008-02-15 包括多个连接器的探针卡和将连接器结合至探针卡的基板的方法
JP2009549529A JP2010519508A (ja) 2007-02-16 2008-02-15 プローブカード及び接続体のボンディング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070016403A KR100855302B1 (ko) 2007-02-16 2007-02-16 프로브 카드 및 접속체 본딩 방법

Publications (2)

Publication Number Publication Date
KR20080076457A KR20080076457A (ko) 2008-08-20
KR100855302B1 true KR100855302B1 (ko) 2008-08-29

Family

ID=39690273

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070016403A KR100855302B1 (ko) 2007-02-16 2007-02-16 프로브 카드 및 접속체 본딩 방법

Country Status (5)

Country Link
JP (1) JP2010519508A (zh)
KR (1) KR100855302B1 (zh)
CN (1) CN101611486B (zh)
TW (1) TWI363456B (zh)
WO (1) WO2008100101A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101384714B1 (ko) * 2014-01-14 2014-04-15 윌테크놀러지(주) 반도체 검사장치

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101676731A (zh) * 2008-09-17 2010-03-24 汉民测试系统科技股份有限公司 电路测试装置的电路板结构
KR101525170B1 (ko) * 2009-08-07 2015-06-03 솔브레인이엔지 주식회사 프로브 카드
KR101421048B1 (ko) * 2014-02-07 2014-07-23 윌테크놀러지(주) 능동소자 칩이 탑재된 반도체 검사 장치
CN108872651B (zh) * 2017-05-08 2021-05-07 旺矽科技股份有限公司 探针卡
IT201900024946A1 (it) * 2019-12-20 2021-06-20 Technoprobe Spa Testa di misura con un contatto migliorato tra sonde di contatto e fori guida
KR102261798B1 (ko) * 2020-04-03 2021-06-07 (주)화이컴 프로브 카드 제조용 지그, 이를 포함하는 프로브 정렬 시스템 및 이를 이용하여 제조된 프로브 카드
US11879934B2 (en) 2021-06-11 2024-01-23 Mediatek Inc. Test kit for testing a device under test
JP2023076046A (ja) * 2021-11-22 2023-06-01 株式会社日本マイクロニクス プローブ格納治具、プローブ格納システムおよびプローブ格納方法
EP4273559A1 (en) * 2022-05-03 2023-11-08 MediaTek Inc. Test kit for testing a device under test
KR102456905B1 (ko) * 2022-05-31 2022-10-20 주식회사 프로이천 평탄도조절이 가능한 프로브카드

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003331953A (ja) * 2002-05-13 2003-11-21 Japan Electronic Materials Corp 基板間接続装置及びそれを用いたプローブカード
JP2004138452A (ja) * 2002-10-16 2004-05-13 Japan Electronic Materials Corp プローブカード
KR100443999B1 (ko) * 2003-02-28 2004-08-21 주식회사 파이컴 인쇄회로기판용 상호 접속체, 이의 제조방법 및 이를구비한 상호 접속 조립체

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7102367B2 (en) * 2002-07-23 2006-09-05 Fujitsu Limited Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof
US6917102B2 (en) * 2002-10-10 2005-07-12 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
JP2005010052A (ja) * 2003-06-19 2005-01-13 Japan Electronic Materials Corp プローブカード

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003331953A (ja) * 2002-05-13 2003-11-21 Japan Electronic Materials Corp 基板間接続装置及びそれを用いたプローブカード
JP2004138452A (ja) * 2002-10-16 2004-05-13 Japan Electronic Materials Corp プローブカード
KR100443999B1 (ko) * 2003-02-28 2004-08-21 주식회사 파이컴 인쇄회로기판용 상호 접속체, 이의 제조방법 및 이를구비한 상호 접속 조립체

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101384714B1 (ko) * 2014-01-14 2014-04-15 윌테크놀러지(주) 반도체 검사장치

Also Published As

Publication number Publication date
WO2008100101A1 (en) 2008-08-21
TW200840150A (en) 2008-10-01
KR20080076457A (ko) 2008-08-20
CN101611486B (zh) 2012-09-26
JP2010519508A (ja) 2010-06-03
CN101611486A (zh) 2009-12-23
TWI363456B (en) 2012-05-01

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