KR100854803B1 - 기판 처리 장치 및 덮개 지지 장치 - Google Patents

기판 처리 장치 및 덮개 지지 장치 Download PDF

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Publication number
KR100854803B1
KR100854803B1 KR1020060127316A KR20060127316A KR100854803B1 KR 100854803 B1 KR100854803 B1 KR 100854803B1 KR 1020060127316 A KR1020060127316 A KR 1020060127316A KR 20060127316 A KR20060127316 A KR 20060127316A KR 100854803 B1 KR100854803 B1 KR 100854803B1
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KR
South Korea
Prior art keywords
processing chamber
chamber
lid
processing apparatus
substrate
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KR1020060127316A
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English (en)
Korean (ko)
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KR20070063450A (ko
Inventor
아키라 고다시마
신이치 미야노
다케히로 가토
Original Assignee
도쿄엘렉트론가부시키가이샤
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20070063450A publication Critical patent/KR20070063450A/ko
Application granted granted Critical
Publication of KR100854803B1 publication Critical patent/KR100854803B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020060127316A 2005-12-14 2006-12-13 기판 처리 장치 및 덮개 지지 장치 KR100854803B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00360934 2005-12-14
JP2005360934A JP4355314B2 (ja) 2005-12-14 2005-12-14 基板処理装置、及び該装置の蓋釣支装置

Publications (2)

Publication Number Publication Date
KR20070063450A KR20070063450A (ko) 2007-06-19
KR100854803B1 true KR100854803B1 (ko) 2008-08-27

Family

ID=38165943

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KR1020060127316A KR100854803B1 (ko) 2005-12-14 2006-12-13 기판 처리 장치 및 덮개 지지 장치

Country Status (3)

Country Link
JP (1) JP4355314B2 (ja)
KR (1) KR100854803B1 (ja)
CN (1) CN100474506C (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101016044B1 (ko) * 2010-07-01 2011-02-23 강우성 반도체 장비의 리드를 위한 자동 유지보수장치
KR20160035377A (ko) * 2014-09-23 2016-03-31 주식회사 선익시스템 챔버장비 유지보수 시스템

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9184072B2 (en) * 2007-07-27 2015-11-10 Mattson Technology, Inc. Advanced multi-workpiece processing chamber
KR101007711B1 (ko) * 2008-05-19 2011-01-13 주식회사 에스에프에이 플라즈마 처리장치
KR101413526B1 (ko) * 2008-07-30 2014-07-02 (주)소슬 기판 처리 장치
JP5154491B2 (ja) * 2009-03-30 2013-02-27 住友重機械工業株式会社 チャンバーライン
CN101673810B (zh) * 2009-09-03 2011-06-22 东莞宏威数码机械有限公司 腔盖启闭机构
JP5526988B2 (ja) * 2010-04-28 2014-06-18 東京エレクトロン株式会社 基板処理装置及び基板処理システム
JP5585238B2 (ja) * 2010-06-24 2014-09-10 東京エレクトロン株式会社 基板処理装置
JP5575558B2 (ja) * 2010-06-30 2014-08-20 東京エレクトロン株式会社 処理装置
TWI415208B (zh) * 2010-09-21 2013-11-11 Sumitomo Heavy Industries Chamber line
CN102433539B (zh) * 2010-09-29 2014-07-09 住友重机械工业株式会社 腔系列
JP2013229373A (ja) * 2012-04-24 2013-11-07 Tokyo Electron Ltd 基板処理装置及びそのメンテナンス方法
KR102293092B1 (ko) 2013-11-12 2021-08-23 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치
JP6293499B2 (ja) * 2014-01-27 2018-03-14 株式会社日立ハイテクノロジーズ 真空処理装置
EP3220413B1 (de) * 2016-03-15 2022-01-26 Integrated Dynamics Engineering GmbH Serviceeinrichtung
KR102091781B1 (ko) * 2016-12-20 2020-03-20 주식회사 원익아이피에스 기판처리장치
LT3422396T (lt) * 2017-06-28 2021-09-10 Meyer Burger (Germany) Gmbh Substrato transportavimo įrenginys, valymo įrenginys su padėklu, pritaikytu minėto įrenginio substrato laikikliui, ir substrato apdorojimo naudojant minėtą substrato transportavimo įrenginį bei valymo įrenginį būdas
JP6475877B2 (ja) * 2018-02-14 2019-02-27 株式会社日立ハイテクノロジーズ 真空処理装置
CN111863655B (zh) * 2019-04-26 2024-04-12 北京北方华创微电子装备有限公司 开盖机构及半导体加工设备
JP7365822B2 (ja) * 2019-08-22 2023-10-20 東京エレクトロン株式会社 基板処理システム
KR102371550B1 (ko) * 2020-08-31 2022-03-07 주식회사 엔이아이디 반도체 제조를 지원하는 제어 시스템을 조립하는 방법 및 시스템

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08225152A (ja) * 1995-02-23 1996-09-03 Sekisui Chem Co Ltd 面材搬送・取付装置
KR20050045360A (ko) * 2003-11-11 2005-05-17 주식회사 디엠에스 기판의 진공처리장치
KR20050113574A (ko) * 2003-05-08 2005-12-02 가부시키가이샤 아루박 진공처리장치용 진공챔버

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08225152A (ja) * 1995-02-23 1996-09-03 Sekisui Chem Co Ltd 面材搬送・取付装置
KR20050113574A (ko) * 2003-05-08 2005-12-02 가부시키가이샤 아루박 진공처리장치용 진공챔버
KR20050045360A (ko) * 2003-11-11 2005-05-17 주식회사 디엠에스 기판의 진공처리장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101016044B1 (ko) * 2010-07-01 2011-02-23 강우성 반도체 장비의 리드를 위한 자동 유지보수장치
KR20160035377A (ko) * 2014-09-23 2016-03-31 주식회사 선익시스템 챔버장비 유지보수 시스템
KR102328325B1 (ko) * 2014-09-23 2021-11-18 (주)선익시스템 챔버장비 유지보수 시스템

Also Published As

Publication number Publication date
JP4355314B2 (ja) 2009-10-28
CN100474506C (zh) 2009-04-01
KR20070063450A (ko) 2007-06-19
JP2007165659A (ja) 2007-06-28
CN1983515A (zh) 2007-06-20

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