KR100853575B1 - 기판 처리 장치, 기판 흡착 방법 및 기억 매체 - Google Patents

기판 처리 장치, 기판 흡착 방법 및 기억 매체 Download PDF

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Publication number
KR100853575B1
KR100853575B1 KR1020070014576A KR20070014576A KR100853575B1 KR 100853575 B1 KR100853575 B1 KR 100853575B1 KR 1020070014576 A KR1020070014576 A KR 1020070014576A KR 20070014576 A KR20070014576 A KR 20070014576A KR 100853575 B1 KR100853575 B1 KR 100853575B1
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South Korea
Prior art keywords
substrate
electrode plate
electrostatic chuck
high frequency
mounting table
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Expired - Fee Related
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KR1020070014576A
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English (en)
Korean (ko)
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KR20070092104A (ko
Inventor
마사유키 사와타이시
아키타카 시미즈
에이이치 니시무라
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도쿄엘렉트론가부시키가이샤
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Publication of KR20070092104A publication Critical patent/KR20070092104A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020070014576A 2006-03-08 2007-02-12 기판 처리 장치, 기판 흡착 방법 및 기억 매체 Expired - Fee Related KR100853575B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00062884 2006-03-08
JP2006062884A JP5127147B2 (ja) 2006-03-08 2006-03-08 基板吸着脱離方法

Publications (2)

Publication Number Publication Date
KR20070092104A KR20070092104A (ko) 2007-09-12
KR100853575B1 true KR100853575B1 (ko) 2008-08-21

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ID=38588121

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070014576A Expired - Fee Related KR100853575B1 (ko) 2006-03-08 2007-02-12 기판 처리 장치, 기판 흡착 방법 및 기억 매체

Country Status (3)

Country Link
JP (1) JP5127147B2 (enExample)
KR (1) KR100853575B1 (enExample)
CN (1) CN101034679A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009076129A (ja) 2007-09-19 2009-04-09 Kobe Steel Ltd 読み出し専用の光情報記録媒体
JP2009212293A (ja) * 2008-03-04 2009-09-17 Tokyo Electron Ltd 基板処理装置用の部品及び基板処理装置
JP5875775B2 (ja) * 2011-03-30 2016-03-02 東京エレクトロン株式会社 基板除去方法及び記憶媒体
CN105097423B (zh) * 2014-05-12 2018-09-18 中芯国际集成电路制造(上海)有限公司 等离子体反应器及清除等离子体反应腔室颗粒污染的方法
JP6496579B2 (ja) * 2015-03-17 2019-04-03 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP6054470B2 (ja) * 2015-05-26 2016-12-27 株式会社日本製鋼所 原子層成長装置
CN109107987A (zh) * 2017-06-22 2019-01-01 北京北方华创微电子装备有限公司 一种吹扫方法
CN108648995B (zh) * 2018-05-22 2021-03-19 深圳市盛鸿运科技有限公司 一种半导体集成电路用硅晶片刻蚀方法
JP7398909B2 (ja) * 2019-09-12 2023-12-15 東京エレクトロン株式会社 静電吸着方法及びプラズマ処理装置
CN114334700A (zh) 2020-09-29 2022-04-12 长鑫存储技术有限公司 半导体设备电极板的安装治具
KR102442285B1 (ko) * 2022-03-14 2022-09-13 에이피티씨 주식회사 플라즈마 에칭 시스템
TWI836422B (zh) * 2022-05-09 2024-03-21 南韓商自適應等離子體技術公司 等離子體蝕刻系統

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030068569A (ko) * 2000-12-29 2003-08-21 램 리서치 코포레이션 반도체 공정 설비내의 질코니아 강화된 세라믹 부품 및코팅과, 그 제조방법
KR20050018063A (ko) * 2003-08-13 2005-02-23 삼성전자주식회사 반도체 제조장치의 기판 척킹/디척킹 장치 및 그의 방법
KR100544897B1 (ko) * 2004-11-30 2006-01-24 (주)아이씨디 플라즈마 쳄버용 정전기 척

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0269956A (ja) * 1988-09-05 1990-03-08 Toshiba Corp 静電チャック方法及び静電チャック装置
JPH04240747A (ja) * 1991-01-24 1992-08-28 Fujitsu Ltd 半導体装置の製造方法
JP2879887B2 (ja) * 1995-08-24 1999-04-05 東京エレクトロン株式会社 プラズマ処理方法
JPH1074734A (ja) * 1996-09-02 1998-03-17 Toshiba Corp プラズマ処理装置と半導体装置の製造方法
JP2985761B2 (ja) * 1996-03-18 1999-12-06 株式会社日立製作所 試料処理方法
JPH10209126A (ja) * 1997-01-23 1998-08-07 Hitachi Ltd プラズマエッチング装置
JP2002100614A (ja) * 2000-09-25 2002-04-05 Nec Corp 半導体製造装置および半導体製造方法
JP2002164328A (ja) * 2000-11-27 2002-06-07 Seiko Epson Corp ドライエッチング装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030068569A (ko) * 2000-12-29 2003-08-21 램 리서치 코포레이션 반도체 공정 설비내의 질코니아 강화된 세라믹 부품 및코팅과, 그 제조방법
KR20050018063A (ko) * 2003-08-13 2005-02-23 삼성전자주식회사 반도체 제조장치의 기판 척킹/디척킹 장치 및 그의 방법
KR100544897B1 (ko) * 2004-11-30 2006-01-24 (주)아이씨디 플라즈마 쳄버용 정전기 척

Also Published As

Publication number Publication date
KR20070092104A (ko) 2007-09-12
CN101034679A (zh) 2007-09-12
JP2007242870A (ja) 2007-09-20
JP5127147B2 (ja) 2013-01-23

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