KR100782482B1 - GeBiTe막을 상변화 물질막으로 채택하는 상변화 기억 셀, 이를 구비하는 상변화 기억소자, 이를 구비하는 전자 장치 및 그 제조방법 - Google Patents

GeBiTe막을 상변화 물질막으로 채택하는 상변화 기억 셀, 이를 구비하는 상변화 기억소자, 이를 구비하는 전자 장치 및 그 제조방법 Download PDF

Info

Publication number
KR100782482B1
KR100782482B1 KR1020060045298A KR20060045298A KR100782482B1 KR 100782482 B1 KR100782482 B1 KR 100782482B1 KR 1020060045298 A KR1020060045298 A KR 1020060045298A KR 20060045298 A KR20060045298 A KR 20060045298A KR 100782482 B1 KR100782482 B1 KR 100782482B1
Authority
KR
South Korea
Prior art keywords
phase change
film
electrode
gebite
cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020060045298A
Other languages
English (en)
Korean (ko)
Other versions
KR20070111896A (ko
Inventor
구봉진
하용호
박두환
박정희
고한봉
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020060045298A priority Critical patent/KR100782482B1/ko
Priority to JP2007125944A priority patent/JP2007311791A/ja
Priority to US11/747,395 priority patent/US7817464B2/en
Priority to CNA2007101034537A priority patent/CN101075632A/zh
Priority to TW096117854A priority patent/TWI338391B/zh
Publication of KR20070111896A publication Critical patent/KR20070111896A/ko
Application granted granted Critical
Publication of KR100782482B1 publication Critical patent/KR100782482B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5678Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using amorphous/crystalline phase transition storage elements
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0004Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/20Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/30Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • H10N70/021Formation of switching materials, e.g. deposition of layers
    • H10N70/026Formation of switching materials, e.g. deposition of layers by physical vapor deposition, e.g. sputtering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828Tellurides, e.g. GeSbTe
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/72Array wherein the access device being a diode
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/79Array wherein the access device being a transistor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
KR1020060045298A 2006-05-19 2006-05-19 GeBiTe막을 상변화 물질막으로 채택하는 상변화 기억 셀, 이를 구비하는 상변화 기억소자, 이를 구비하는 전자 장치 및 그 제조방법 Active KR100782482B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020060045298A KR100782482B1 (ko) 2006-05-19 2006-05-19 GeBiTe막을 상변화 물질막으로 채택하는 상변화 기억 셀, 이를 구비하는 상변화 기억소자, 이를 구비하는 전자 장치 및 그 제조방법
JP2007125944A JP2007311791A (ja) 2006-05-19 2007-05-10 GeBiTe膜を相変化物質膜として採用する相変化記憶セル、それを有する相変化記憶素子、それを有する電子システム及びその製造方法
US11/747,395 US7817464B2 (en) 2006-05-19 2007-05-11 Phase change memory cell employing a GeBiTe layer as a phase change material layer, phase change memory device including the same, electronic system including the same and method of fabricating the same
CNA2007101034537A CN101075632A (zh) 2006-05-19 2007-05-18 相变存储单元、相变存储器件、电子系统及其制造方法
TW096117854A TWI338391B (en) 2006-05-19 2007-05-18 Phase change memory cell employing a gebite layer as a phase change material layer, phase change memory device including the same, electronic system including the same and method of fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060045298A KR100782482B1 (ko) 2006-05-19 2006-05-19 GeBiTe막을 상변화 물질막으로 채택하는 상변화 기억 셀, 이를 구비하는 상변화 기억소자, 이를 구비하는 전자 장치 및 그 제조방법

Publications (2)

Publication Number Publication Date
KR20070111896A KR20070111896A (ko) 2007-11-22
KR100782482B1 true KR100782482B1 (ko) 2007-12-05

Family

ID=38711253

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060045298A Active KR100782482B1 (ko) 2006-05-19 2006-05-19 GeBiTe막을 상변화 물질막으로 채택하는 상변화 기억 셀, 이를 구비하는 상변화 기억소자, 이를 구비하는 전자 장치 및 그 제조방법

Country Status (5)

Country Link
US (1) US7817464B2 (enExample)
JP (1) JP2007311791A (enExample)
KR (1) KR100782482B1 (enExample)
CN (1) CN101075632A (enExample)
TW (1) TWI338391B (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7425735B2 (en) * 2003-02-24 2008-09-16 Samsung Electronics Co., Ltd. Multi-layer phase-changeable memory devices
US7115927B2 (en) 2003-02-24 2006-10-03 Samsung Electronics Co., Ltd. Phase changeable memory devices
KR100637235B1 (ko) * 2005-08-26 2006-10-20 삼성에스디아이 주식회사 플라즈마 디스플레이 패널
US7459717B2 (en) * 2005-11-28 2008-12-02 Macronix International Co., Ltd. Phase change memory cell and manufacturing method
KR100911473B1 (ko) * 2007-06-18 2009-08-11 삼성전자주식회사 상변화 메모리 유닛, 이의 제조 방법, 이를 포함하는상변화 메모리 장치 및 그 제조 방법
US8003971B2 (en) * 2008-03-19 2011-08-23 Qimonda Ag Integrated circuit including memory element doped with dielectric material
KR101604864B1 (ko) * 2008-04-25 2016-03-18 에이에스엠 인터내셔널 엔.브이. 텔루르와 셀렌 박막의 원자층 증착을 위한 전구체의 합성과 그 용도
US8134857B2 (en) * 2008-06-27 2012-03-13 Macronix International Co., Ltd. Methods for high speed reading operation of phase change memory and device employing same
US7932506B2 (en) * 2008-07-22 2011-04-26 Macronix International Co., Ltd. Fully self-aligned pore-type memory cell having diode access device
US8154006B2 (en) * 2008-12-29 2012-04-10 Micron Technology, Inc. Controlling the circuitry and memory array relative height in a phase change memory feol process flow
US8809829B2 (en) * 2009-06-15 2014-08-19 Macronix International Co., Ltd. Phase change memory having stabilized microstructure and manufacturing method
US8363463B2 (en) 2009-06-25 2013-01-29 Macronix International Co., Ltd. Phase change memory having one or more non-constant doping profiles
KR101535462B1 (ko) * 2009-08-27 2015-07-09 삼성전자주식회사 상변화 물질을 포함하는 비휘발성 메모리 소자
CN102687243B (zh) 2009-10-26 2016-05-11 Asm国际公司 用于含va族元素的薄膜ald的前体的合成和使用
KR20110103160A (ko) * 2010-03-12 2011-09-20 삼성전자주식회사 반도체 소자 및 이를 제조하는 방법
US8456888B2 (en) * 2010-10-07 2013-06-04 Hynix Semiconductor Inc. Semiconductor memory device including variable resistance elements and manufacturing method thereof
CN102569645A (zh) * 2010-12-17 2012-07-11 中芯国际集成电路制造(上海)有限公司 相变存储器及其形成方法
US8426242B2 (en) 2011-02-01 2013-04-23 Macronix International Co., Ltd. Composite target sputtering for forming doped phase change materials
US8946666B2 (en) 2011-06-23 2015-02-03 Macronix International Co., Ltd. Ge-Rich GST-212 phase change memory materials
US8598562B2 (en) * 2011-07-01 2013-12-03 Micron Technology, Inc. Memory cell structures
US8932901B2 (en) 2011-10-31 2015-01-13 Macronix International Co., Ltd. Stressed phase change materials
KR20130123904A (ko) * 2012-05-04 2013-11-13 에스케이하이닉스 주식회사 반도체 메모리 장치
JP5905858B2 (ja) 2012-08-13 2016-04-20 エア プロダクツ アンド ケミカルズ インコーポレイテッドAir Products And Chemicals Incorporated Ald/cvdプロセスにおけるgst膜のための前駆体
US9336879B2 (en) 2014-01-24 2016-05-10 Macronix International Co., Ltd. Multiple phase change materials in an integrated circuit for system on a chip application
CN104485417A (zh) * 2014-12-16 2015-04-01 曲阜师范大学 一种提高GeSbTe相变性能的技术及其薄膜制备方法
CN108258114B (zh) * 2015-04-27 2020-12-08 江苏理工学院 用于高速相变存储器的GeTe/Sb类超晶格相变薄膜材料的制备方法
US9672906B2 (en) 2015-06-19 2017-06-06 Macronix International Co., Ltd. Phase change memory with inter-granular switching
US11314109B1 (en) * 2016-05-20 2022-04-26 URL Laboratories, LLC Electrically switchable infrared mirrors using phase-change chalcogenides materials
US10050196B1 (en) * 2017-05-04 2018-08-14 Macronix International Co., Ltd. Dielectric doped, Sb-rich GST phase change memory
KR102452296B1 (ko) * 2018-07-10 2022-10-06 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼 적층 구조체 및 그 제조 방법 그리고 반도체 디바이스
KR102118734B1 (ko) * 2018-09-07 2020-06-09 한국과학기술연구원 4성분계 이상의 캘코제나이드 상변화 물질 및 이를 포함하는 메모리 소자
CN114899311A (zh) * 2022-04-07 2022-08-12 长江先进存储产业创新中心有限责任公司 相变存储器及其控制方法和制作方法
CN119300443B (zh) * 2024-12-06 2025-04-04 长春长光圆辰微电子技术有限公司 一种tmbs器件的制备工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01220236A (ja) * 1988-02-29 1989-09-01 Hoya Corp 書き替え可能な相変化型光メモリ媒体
KR20010006496A (ko) * 1997-04-16 2001-01-26 야마모토 카즈모토 광학 정보 기록 매체의 제조 방법 및 이 방법으로 제조된 광학 정보 기록 매체
KR20020059162A (ko) * 2001-01-03 2002-07-12 리우 챠오 시우안 재기록가능한 상변화형 광기록 조성물 및 재기록가능한상변화형 광디스크
US20050064334A1 (en) 2003-09-22 2005-03-24 Hitachi Maxell, Ltd. Information recording medium

Family Cites Families (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL61678A (en) 1979-12-13 1984-04-30 Energy Conversion Devices Inc Programmable cell and programmable electronic arrays comprising such cells
US4499557A (en) 1980-10-28 1985-02-12 Energy Conversion Devices, Inc. Programmable cell for use in programmable electronic arrays
US4719594A (en) 1984-11-01 1988-01-12 Energy Conversion Devices, Inc. Grooved optical data storage device including a chalcogenide memory layer
US4653024A (en) 1984-11-21 1987-03-24 Energy Conversion Devices, Inc. Data storage device including a phase changeable material
US4820394A (en) 1984-11-21 1989-04-11 Energy Conversion Devices, Inc. Phase changeable material
CN1010519B (zh) 1985-09-25 1990-11-21 松下电器产业株式会社 可逆的光学情报记录介质
US4845533A (en) 1986-08-22 1989-07-04 Energy Conversion Devices, Inc. Thin film electrical devices with amorphous carbon electrodes and method of making same
US4924436A (en) 1987-06-22 1990-05-08 Energy Conversion Devices, Inc. Data storage device having a phase change memory medium reversible by direct overwrite and method of direct overwrite
JPH03297689A (ja) 1990-04-17 1991-12-27 Toray Ind Inc 情報記録媒体
US5194363A (en) 1990-04-27 1993-03-16 Matsushita Electric Industrial Co., Ltd. Optical recording medium and production process for the medium
US5536947A (en) 1991-01-18 1996-07-16 Energy Conversion Devices, Inc. Electrically erasable, directly overwritable, multibit single cell memory element and arrays fabricated therefrom
US5341328A (en) * 1991-01-18 1994-08-23 Energy Conversion Devices, Inc. Electrically erasable memory elements having reduced switching current requirements and increased write/erase cycle life
US5166758A (en) 1991-01-18 1992-11-24 Energy Conversion Devices, Inc. Electrically erasable phase change memory
US5552608A (en) 1995-06-26 1996-09-03 Philips Electronics North America Corporation Closed cycle gas cryogenically cooled radiation detector
US5714768A (en) 1995-10-24 1998-02-03 Energy Conversion Devices, Inc. Second-layer phase change memory array on top of a logic device
US6087674A (en) 1996-10-28 2000-07-11 Energy Conversion Devices, Inc. Memory element with memory material comprising phase-change material and dielectric material
US5825046A (en) 1996-10-28 1998-10-20 Energy Conversion Devices, Inc. Composite memory material comprising a mixture of phase-change memory material and dielectric material
JPH10340489A (ja) 1997-06-04 1998-12-22 Victor Co Of Japan Ltd 相変化型光ディスク及び相変化型光ディスクの製造方法
EP0917137B1 (en) 1997-11-17 2006-06-28 Mitsubishi Kagaku Media Co., Ltd. Optical information recording medium
AU1612699A (en) 1998-06-17 2000-01-05 H. Randall Craig Cryogenic freezing of liquids
US6141241A (en) 1998-06-23 2000-10-31 Energy Conversion Devices, Inc. Universal memory element with systems employing same and apparatus and method for reading, writing and programming same
US6258062B1 (en) 1999-02-25 2001-07-10 Joseph M. Thielen Enclosed container power supply for a needleless injector
JP2000260073A (ja) 1999-03-10 2000-09-22 Nec Corp 誘電体膜の製造方法及びその誘電体膜を用いた相変化型光ディスク媒体とその製造方法
WO2000054982A1 (en) * 1999-03-15 2000-09-21 Matsushita Electric Industrial Co., Ltd. Information recording medium and method for manufacturing the same
US6496946B2 (en) 1999-05-10 2002-12-17 Motorola, Inc. Electronic control apparatus with memory validation and method
DE19946073A1 (de) 1999-09-25 2001-05-10 Volkswagen Ag System zur Steuerung von Fahrzeugkomponenten nach dem "Drive By Wire"-Prinzip
US6365256B1 (en) 2000-02-29 2002-04-02 Eastman Kodak Company Erasable phase change optical recording elements
US6429064B1 (en) 2000-09-29 2002-08-06 Intel Corporation Reduced contact area of sidewall conductor
US6555860B2 (en) 2000-09-29 2003-04-29 Intel Corporation Compositionally modified resistive electrode
EP1201529B1 (de) 2000-10-27 2008-04-09 VDO Automotive AG Verfahren und Einrichtung zur Bestimmung eines Lenkwinkels eines Kraftfahrzeuges
JP4025527B2 (ja) 2000-10-27 2007-12-19 松下電器産業株式会社 メモリ、書き込み装置、読み出し装置およびその方法
US6437383B1 (en) 2000-12-21 2002-08-20 Intel Corporation Dual trench isolation for a phase-change memory cell and method of making same
US6534781B2 (en) 2000-12-26 2003-03-18 Ovonyx, Inc. Phase-change memory bipolar array utilizing a single shallow trench isolation for creating an individual active area region for two memory array elements and one bipolar base contact
US6531373B2 (en) 2000-12-27 2003-03-11 Ovonyx, Inc. Method of forming a phase-change memory cell using silicon on insulator low electrode in charcogenide elements
JP2002246310A (ja) 2001-02-14 2002-08-30 Sony Corp 半導体薄膜の形成方法及び半導体装置の製造方法、これらの方法の実施に使用する装置、並びに電気光学装置
US6511862B2 (en) 2001-06-30 2003-01-28 Ovonyx, Inc. Modified contact for programmable devices
US6511867B2 (en) 2001-06-30 2003-01-28 Ovonyx, Inc. Utilizing atomic layer deposition for programmable device
US6588540B2 (en) 2001-07-26 2003-07-08 Delphi Technologies, Inc. Steer-by-wire redundant handwheel control
US6709958B2 (en) 2001-08-30 2004-03-23 Micron Technology, Inc. Integrated circuit device and fabrication using metal-doped chalcogenide materials
US6507061B1 (en) 2001-08-31 2003-01-14 Intel Corporation Multiple layer phase-change memory
WO2003021589A1 (en) 2001-09-01 2003-03-13 Energy Conversion Devices, Inc. Increased data storage in optical data storage and retrieval systems using blue lasers and/or plasmon lenses
US6586761B2 (en) 2001-09-07 2003-07-01 Intel Corporation Phase change material memory device
US6545287B2 (en) 2001-09-07 2003-04-08 Intel Corporation Using selective deposition to form phase-change memory cells
JP2003168222A (ja) 2001-09-20 2003-06-13 Victor Co Of Japan Ltd 情報記録担体及び情報記録担体の再生方法及び情報記録担体の再生装置
JP3749847B2 (ja) 2001-09-27 2006-03-01 株式会社東芝 相変化型不揮発性記憶装置及びその駆動回路
US6690026B2 (en) 2001-09-28 2004-02-10 Intel Corporation Method of fabricating a three-dimensional array of active media
US6933031B2 (en) 2001-10-19 2005-08-23 Matsushita Electric Industrial Co., Ltd. Optical information recording medium and its manufacturing method
US6549447B1 (en) * 2001-10-31 2003-04-15 Peter Fricke Memory cell structure
US6885021B2 (en) 2001-12-31 2005-04-26 Ovonyx, Inc. Adhesion layer for a polymer memory device and method therefor
US6648098B2 (en) * 2002-02-08 2003-11-18 Bose Corporation Spiral acoustic waveguide electroacoustical transducing system
US6891749B2 (en) 2002-02-20 2005-05-10 Micron Technology, Inc. Resistance variable ‘on ’ memory
US7087919B2 (en) 2002-02-20 2006-08-08 Micron Technology, Inc. Layered resistance variable memory device and method of fabrication
US6972430B2 (en) 2002-02-20 2005-12-06 Stmicroelectronics S.R.L. Sublithographic contact structure, phase change memory cell with optimized heater shape, and manufacturing method thereof
US6899938B2 (en) 2002-02-22 2005-05-31 Energy Conversion Devices, Inc. Phase change data storage device for multi-level recording
CN101042903B (zh) 2002-02-25 2010-06-09 日矿金属株式会社 相变型存储器用溅射靶的制造方法
US6670628B2 (en) 2002-04-04 2003-12-30 Hewlett-Packard Company, L.P. Low heat loss and small contact area composite electrode for a phase change media memory device
KR100476893B1 (ko) 2002-05-10 2005-03-17 삼성전자주식회사 상변환 기억 셀들 및 그 제조방법들
US6759267B2 (en) 2002-07-19 2004-07-06 Macronix International Co., Ltd. Method for forming a phase change memory
US6864503B2 (en) 2002-08-09 2005-03-08 Macronix International Co., Ltd. Spacer chalcogenide memory method and device
US6850432B2 (en) 2002-08-20 2005-02-01 Macronix International Co., Ltd. Laser programmable electrically readable phase-change memory method and device
US6856002B2 (en) 2002-08-29 2005-02-15 Micron Technology, Inc. Graded GexSe100-x concentration in PCRAM
US6884991B2 (en) 2002-09-10 2005-04-26 Trw Inc. Steering wheel angle sensor
JP3647848B2 (ja) * 2002-09-10 2005-05-18 日立マクセル株式会社 情報記録媒体
JP3786665B2 (ja) 2002-09-10 2006-06-14 日立マクセル株式会社 情報記録媒体
CN100341060C (zh) * 2002-09-13 2007-10-03 松下电器产业株式会社 信息记录介质及其制造方法
CN1589461A (zh) 2002-10-11 2005-03-02 三菱电机株式会社 显示装置
JP4928045B2 (ja) 2002-10-31 2012-05-09 大日本印刷株式会社 相変化型メモリ素子およびその製造方法
US7049623B2 (en) 2002-12-13 2006-05-23 Ovonyx, Inc. Vertical elevated pore phase change memory
US20040115945A1 (en) 2002-12-13 2004-06-17 Lowrey Tyler A. Using an electron beam to write phase change memory devices
US7205562B2 (en) 2002-12-13 2007-04-17 Intel Corporation Phase change memory and method therefor
US6869883B2 (en) 2002-12-13 2005-03-22 Ovonyx, Inc. Forming phase change memories
US6867425B2 (en) 2002-12-13 2005-03-15 Intel Corporation Lateral phase change memory and method therefor
US7402851B2 (en) 2003-02-24 2008-07-22 Samsung Electronics Co., Ltd. Phase changeable memory devices including nitrogen and/or silicon and methods for fabricating the same
US7115927B2 (en) 2003-02-24 2006-10-03 Samsung Electronics Co., Ltd. Phase changeable memory devices
KR100543445B1 (ko) 2003-03-04 2006-01-23 삼성전자주식회사 상변화 기억 소자 및 그 형성방법
JP4181490B2 (ja) 2003-03-25 2008-11-12 松下電器産業株式会社 情報記録媒体とその製造方法
JP4445398B2 (ja) * 2003-04-03 2010-04-07 株式会社東芝 相変化メモリ装置
JP4634014B2 (ja) 2003-05-22 2011-02-16 株式会社日立製作所 半導体記憶装置
US7067865B2 (en) 2003-06-06 2006-06-27 Macronix International Co., Ltd. High density chalcogenide memory cells
US7893419B2 (en) 2003-08-04 2011-02-22 Intel Corporation Processing phase change material to improve programming speed
US7381611B2 (en) 2003-08-04 2008-06-03 Intel Corporation Multilayered phase change memory
WO2005031752A1 (ja) * 2003-09-26 2005-04-07 Kanazawa University Technology Licensing Organization Ltd. 多値メモリおよびそのための相変化型記録媒体への記録方法
JP4145773B2 (ja) 2003-11-06 2008-09-03 パイオニア株式会社 情報記録再生装置および記録媒体
JP4124743B2 (ja) * 2004-01-21 2008-07-23 株式会社ルネサステクノロジ 相変化メモリ
TW200529414A (en) * 2004-02-06 2005-09-01 Renesas Tech Corp Storage
JP4865248B2 (ja) * 2004-04-02 2012-02-01 株式会社半導体エネルギー研究所 半導体装置
TW200601322A (en) * 2004-04-07 2006-01-01 Hitachi Maxell Information recording medium
DE102005025209B4 (de) * 2004-05-27 2011-01-13 Samsung Electronics Co., Ltd., Suwon Halbleiterspeicherbauelement, elektronisches System und Verfahren zur Herstellung eines Halbleiterspeicherbauelements
US7394088B2 (en) 2005-11-15 2008-07-01 Macronix International Co., Ltd. Thermally contained/insulated phase change memory device and method (combined)
JP4478100B2 (ja) * 2005-11-30 2010-06-09 株式会社東芝 半導体記録素子

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01220236A (ja) * 1988-02-29 1989-09-01 Hoya Corp 書き替え可能な相変化型光メモリ媒体
KR20010006496A (ko) * 1997-04-16 2001-01-26 야마모토 카즈모토 광학 정보 기록 매체의 제조 방법 및 이 방법으로 제조된 광학 정보 기록 매체
KR20020059162A (ko) * 2001-01-03 2002-07-12 리우 챠오 시우안 재기록가능한 상변화형 광기록 조성물 및 재기록가능한상변화형 광디스크
US20050064334A1 (en) 2003-09-22 2005-03-24 Hitachi Maxell, Ltd. Information recording medium

Also Published As

Publication number Publication date
KR20070111896A (ko) 2007-11-22
CN101075632A (zh) 2007-11-21
TWI338391B (en) 2011-03-01
US20070267721A1 (en) 2007-11-22
TW200805722A (en) 2008-01-16
JP2007311791A (ja) 2007-11-29
US7817464B2 (en) 2010-10-19

Similar Documents

Publication Publication Date Title
KR100782482B1 (ko) GeBiTe막을 상변화 물질막으로 채택하는 상변화 기억 셀, 이를 구비하는 상변화 기억소자, 이를 구비하는 전자 장치 및 그 제조방법
US8605495B2 (en) Isolation device free memory
US7459717B2 (en) Phase change memory cell and manufacturing method
US7456421B2 (en) Vertical side wall active pin structures in a phase change memory and manufacturing methods
US8129706B2 (en) Structures and methods of a bistable resistive random access memory
US7964468B2 (en) Multi-level memory cell having phase change element and asymmetrical thermal boundary
US7642539B2 (en) Thin film fuse phase change cell with thermal isolation pad and manufacturing method
US8110456B2 (en) Method for making a self aligning memory device
US8513637B2 (en) 4F2 self align fin bottom electrodes FET drive phase change memory
CN100524880C (zh) 具有热隔离结构的ⅰ型相变化存储单元
US7534647B2 (en) Damascene phase change RAM and manufacturing method
KR101396750B1 (ko) 낸드-구조 직렬 가변-저항 물질 메모리, 이를 형성하는 프로세스 및 이를 이용하는 방법
US8427865B2 (en) Semiconductor storage device
US8237148B2 (en) 4F2 self align side wall active phase change memory
US8158965B2 (en) Heating center PCRAM structure and methods for making
JP5544104B2 (ja) 抵抗メモリ素子及びその形成方法
CN101546809B (zh) 一种存储装置及其制造方法
US20100144128A1 (en) Phase Change Memory Cell and Manufacturing Method
CN1967894A (zh) 工字型相变存储单元
CN101685827A (zh) 一种存储装置及其制造方法
CN102013431A (zh) 具有自动对准底电极和二极管存取装置的伞状存储单元
US7233017B2 (en) Multibit phase change memory device and method of driving the same
WO2011086725A1 (ja) 不揮発性記憶装置およびその製造方法
US7528402B2 (en) Electrically rewritable non-volatile memory element
US10818730B2 (en) Semiconductor memory device

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20060519

PA0201 Request for examination
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20070529

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20071015

PG1501 Laying open of application
GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20071129

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20071130

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20101029

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20111101

Start annual number: 5

End annual number: 5

FPAY Annual fee payment

Payment date: 20121031

Year of fee payment: 6

PR1001 Payment of annual fee

Payment date: 20121031

Start annual number: 6

End annual number: 6

FPAY Annual fee payment

Payment date: 20131031

Year of fee payment: 7

PR1001 Payment of annual fee

Payment date: 20131031

Start annual number: 7

End annual number: 7

FPAY Annual fee payment

Payment date: 20141031

Year of fee payment: 8

PR1001 Payment of annual fee

Payment date: 20141031

Start annual number: 8

End annual number: 8

FPAY Annual fee payment

Payment date: 20151030

Year of fee payment: 9

PR1001 Payment of annual fee

Payment date: 20151030

Start annual number: 9

End annual number: 9

FPAY Annual fee payment

Payment date: 20181031

Year of fee payment: 12

PR1001 Payment of annual fee

Payment date: 20181031

Start annual number: 12

End annual number: 12

FPAY Annual fee payment

Payment date: 20191031

Year of fee payment: 13

PR1001 Payment of annual fee

Payment date: 20191031

Start annual number: 13

End annual number: 13

PR1001 Payment of annual fee

Payment date: 20201030

Start annual number: 14

End annual number: 14

PR1001 Payment of annual fee

Payment date: 20211027

Start annual number: 15

End annual number: 15

PR1001 Payment of annual fee

Payment date: 20221026

Start annual number: 16

End annual number: 16

PR1001 Payment of annual fee

Payment date: 20241024

Start annual number: 18

End annual number: 18