KR100774225B1 - Ｃｕ-Ｎｉ-Ｓｉ-Ｚｎ 계 합금 주석 도금조 - Google Patents

Ｃｕ-Ｎｉ-Ｓｉ-Ｚｎ 계 합금 주석 도금조 Download PDF

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Publication number
KR100774225B1
KR100774225B1 KR1020060027753A KR20060027753A KR100774225B1 KR 100774225 B1 KR100774225 B1 KR 100774225B1 KR 1020060027753 A KR1020060027753 A KR 1020060027753A KR 20060027753 A KR20060027753 A KR 20060027753A KR 100774225 B1 KR100774225 B1 KR 100774225B1
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KR
South Korea
Prior art keywords
plating
mass
phase
alloy
concentration
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KR1020060027753A
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English (en)
Korean (ko)
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KR20060105477A (ko
Inventor
다카아키 하타노
Original Assignee
닛코 킨조쿠 가부시키가이샤
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Application filed by 닛코 킨조쿠 가부시키가이샤 filed Critical 닛코 킨조쿠 가부시키가이샤
Publication of KR20060105477A publication Critical patent/KR20060105477A/ko
Application granted granted Critical
Publication of KR100774225B1 publication Critical patent/KR100774225B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020060027753A 2005-03-29 2006-03-28 Ｃｕ-Ｎｉ-Ｓｉ-Ｚｎ 계 합금 주석 도금조 KR100774225B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005096475 2005-03-29
JPJP-P-2005-00096475 2005-03-29

Publications (2)

Publication Number Publication Date
KR20060105477A KR20060105477A (ko) 2006-10-11
KR100774225B1 true KR100774225B1 (ko) 2007-11-07

Family

ID=37029910

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060027753A KR100774225B1 (ko) 2005-03-29 2006-03-28 Ｃｕ-Ｎｉ-Ｓｉ-Ｚｎ 계 합금 주석 도금조

Country Status (3)

Country Link
KR (1) KR100774225B1 (zh)
CN (1) CN1840718B (zh)
TW (1) TW200704790A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101356258B1 (ko) 2009-09-30 2014-01-28 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 주석 도금의 내열 박리성이 우수한 Ｃｕ-Ｎｉ-Ｓｉ계 합금 주석 도금조

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4402132B2 (ja) * 2007-05-18 2010-01-20 日鉱金属株式会社 リフローＳｎめっき材及びそれを用いた電子部品
KR101245911B1 (ko) * 2008-05-30 2013-03-20 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Ｓｎ 또는 Ｓｎ 합금 도금 피막, 그것을 갖는 복합 재료, 및 복합 재료의 제조 방법
CN101784165B (zh) * 2010-03-19 2014-11-05 中兴通讯股份有限公司 一种印制电路板耐腐蚀可焊涂层处理方法
JP5281031B2 (ja) * 2010-03-31 2013-09-04 Ｊｘ日鉱日石金属株式会社 曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系合金

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0559468A (ja) * 1991-04-24 1993-03-09 Nikko Kyodo Co Ltd 導電性ばね用銅合金
JPH09320668A (ja) * 1996-05-14 1997-12-12 Mitsubishi Shindoh Co Ltd メッキ銅合金薄板およびその薄板で製造したコネクタ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3728776B2 (ja) * 1995-08-10 2005-12-21 三菱伸銅株式会社 めっき予備処理工程中にスマットが発生することのない高強度銅合金
DE10025106A1 (de) * 2000-05-20 2001-11-22 Stolberger Metallwerke Gmbh Elektrisch leitfähiges Metallband und Steckverbinder hieraus
JP4112426B2 (ja) * 2003-05-14 2008-07-02 三菱伸銅株式会社 めっき処理材の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0559468A (ja) * 1991-04-24 1993-03-09 Nikko Kyodo Co Ltd 導電性ばね用銅合金
JPH09320668A (ja) * 1996-05-14 1997-12-12 Mitsubishi Shindoh Co Ltd メッキ銅合金薄板およびその薄板で製造したコネクタ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101356258B1 (ko) 2009-09-30 2014-01-28 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 주석 도금의 내열 박리성이 우수한 Ｃｕ-Ｎｉ-Ｓｉ계 합금 주석 도금조

Also Published As

Publication number Publication date
KR20060105477A (ko) 2006-10-11
TWI363099B (zh) 2012-05-01
CN1840718A (zh) 2006-10-04
TW200704790A (en) 2007-02-01
CN1840718B (zh) 2011-04-27

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