KR100758144B1 - 서미스터 소체 형성용 수지 조성물 및 서미스터 - Google Patents

서미스터 소체 형성용 수지 조성물 및 서미스터 Download PDF

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Publication number
KR100758144B1
KR100758144B1 KR1020050056898A KR20050056898A KR100758144B1 KR 100758144 B1 KR100758144 B1 KR 100758144B1 KR 1020050056898 A KR1020050056898 A KR 1020050056898A KR 20050056898 A KR20050056898 A KR 20050056898A KR 100758144 B1 KR100758144 B1 KR 100758144B1
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South Korea
Prior art keywords
thermistor
resin composition
epoxy resin
resin
group
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Expired - Fee Related
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KR1020050056898A
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English (en)
Korean (ko)
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KR20060048688A (ko
Inventor
유키에 모리
사토시 시라이
Original Assignee
티디케이가부시기가이샤
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Publication of KR20060048688A publication Critical patent/KR20060048688A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the permanent binder
    • H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the permanent binder composed of organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
KR1020050056898A 2004-06-29 2005-06-29 서미스터 소체 형성용 수지 조성물 및 서미스터 Expired - Fee Related KR100758144B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004192026A JP2006013378A (ja) 2004-06-29 2004-06-29 サーミスタ素体形成用樹脂組成物及びサーミスタ
JPJP-P-2004-00192026 2004-06-29

Publications (2)

Publication Number Publication Date
KR20060048688A KR20060048688A (ko) 2006-05-18
KR100758144B1 true KR100758144B1 (ko) 2007-09-13

Family

ID=34981564

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050056898A Expired - Fee Related KR100758144B1 (ko) 2004-06-29 2005-06-29 서미스터 소체 형성용 수지 조성물 및 서미스터

Country Status (7)

Country Link
US (1) US7270776B2 (cg-RX-API-DMAC10.html)
EP (1) EP1612811B1 (cg-RX-API-DMAC10.html)
JP (1) JP2006013378A (cg-RX-API-DMAC10.html)
KR (1) KR100758144B1 (cg-RX-API-DMAC10.html)
CN (1) CN100410319C (cg-RX-API-DMAC10.html)
DE (1) DE602005004703T2 (cg-RX-API-DMAC10.html)
TW (1) TW200613433A (cg-RX-API-DMAC10.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4796322B2 (ja) * 2005-03-30 2011-10-19 阪本薬品工業株式会社 新規な熱硬化性樹脂組成物
US8383322B2 (en) 2005-08-05 2013-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography watermark reduction
US7993808B2 (en) 2005-09-30 2011-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. TARC material for immersion watermark reduction
CN101401015B (zh) 2006-03-10 2011-03-23 株式会社日本触媒 偏振片保护薄膜、偏振板、以及图像显示装置
ES2691528T3 (es) * 2006-07-31 2018-11-27 Henkel Ag & Co. Kgaa Composiciones adhesivas basadas en resina epoxi curable
US8518628B2 (en) 2006-09-22 2013-08-27 Taiwan Semiconductor Manufacturing Company, Ltd. Surface switchable photoresist
CN101547990B (zh) * 2006-10-06 2012-09-05 汉高股份及两合公司 可泵送的耐洗掉的环氧膏状粘合剂
JP5357629B2 (ja) 2008-07-01 2013-12-04 新日鉄住金化学株式会社 光導波路用樹脂組成物およびそれを用いた光導波路
JP5466643B2 (ja) * 2008-07-31 2014-04-09 株式会社ダイセル 光半導体封止用樹脂組成物とこれを使用した光半導体装置
JP2010077305A (ja) * 2008-09-26 2010-04-08 Yokohama Rubber Co Ltd:The エポキシ樹脂組成物
SE534437C2 (sv) * 2009-09-29 2011-08-23 Conflux Ab Värmeelement med positiv temperaturkoefficient och deras framställning
CN102286190B (zh) * 2011-06-23 2013-04-17 浙江华正新材料股份有限公司 一种无卤树脂组合物及用该组合物制成的覆铜板
KR20150112018A (ko) 2013-01-28 2015-10-06 메사추세츠 인스티튜트 오브 테크놀로지 전기기계 디바이스
US10302506B2 (en) 2014-02-06 2019-05-28 Japan Science And Technology Agency Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor
CN108648889B (zh) * 2018-03-15 2020-04-28 佛山市信鼎电子科技有限公司 一种电子元件的制备方法
CN110793658A (zh) * 2019-11-26 2020-02-14 青岛科技大学 一种自带电路保护功能的聚合物基温敏电阻器

Citations (6)

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Publication number Priority date Publication date Assignee Title
US5250228A (en) 1991-11-06 1993-10-05 Raychem Corporation Conductive polymer composition
EP0896344A2 (en) * 1997-07-21 1999-02-10 General Electric Company Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite
US5968419A (en) 1997-12-08 1999-10-19 Westinghouse Electric Company Llc Conductive polymer compositions, electrical devices and methods of making
US6375867B1 (en) 1993-11-29 2002-04-23 Eaton Corporation Process for making a positive temperature coefficient conductive polymer from a thermosetting epoxy resin and conductive fillers
WO2003105160A1 (ja) * 2002-05-31 2003-12-18 タツタ電線株式会社 導電性ペースト、これを用いた多層基板及びその製造方法
WO2004029720A1 (ja) 2002-09-30 2004-04-08 Zeon Corporation 感放射線性樹脂組成物、樹脂パターン膜とその形成方法、及び樹脂パターン膜の利用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1043911A (en) 1975-04-14 1978-12-05 Robert B. Johnson Electronic device assembly on insulating substrates
GB2152060B (en) * 1983-12-02 1987-05-13 Osaka Soda Co Ltd Electrically conductive adhesive composition
FR2614130B1 (fr) * 1987-04-15 1992-01-17 Lorraine Carbone Materiau ayant une resistivite a coefficient de temperature positif
JP3101048B2 (ja) 1992-01-20 2000-10-23 ティーディーケイ株式会社 有機質正特性サーミスタ
JP3101047B2 (ja) 1992-01-20 2000-10-23 ティーディーケイ株式会社 有機質正特性サーミスタ
DE4232969A1 (de) * 1992-10-01 1994-04-07 Abb Research Ltd Elektrisches Widerstandselement
US5700398A (en) * 1994-12-14 1997-12-23 International Business Machines Corporation Composition containing a polymer and conductive filler and use thereof
US5935372A (en) * 1997-04-29 1999-08-10 Occidental Chemical Corporation Adhesive sealant for bonding metal parts to ceramics
US6139777A (en) * 1998-05-08 2000-10-31 Matsushita Electric Industrial Co., Ltd. Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same
JP3683113B2 (ja) 1998-11-02 2005-08-17 Ｔｄｋ株式会社 有機質正特性サーミスタ
JP3506629B2 (ja) 1999-01-28 2004-03-15 Ｔｄｋ株式会社 有機質正特性サーミスタ
CN100487826C (zh) * 2003-03-25 2009-05-13 Tdk株式会社 有机质正特性热敏电阻
JP4261407B2 (ja) 2004-03-31 2009-04-30 Ｔｄｋ株式会社 有機質正特性サーミスタ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250228A (en) 1991-11-06 1993-10-05 Raychem Corporation Conductive polymer composition
US6375867B1 (en) 1993-11-29 2002-04-23 Eaton Corporation Process for making a positive temperature coefficient conductive polymer from a thermosetting epoxy resin and conductive fillers
EP0896344A2 (en) * 1997-07-21 1999-02-10 General Electric Company Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite
JPH11126706A (ja) 1997-07-21 1999-05-11 General Electric Co <Ge> 電流制限装置、導電性複合材および該複合材の製造方法
US5968419A (en) 1997-12-08 1999-10-19 Westinghouse Electric Company Llc Conductive polymer compositions, electrical devices and methods of making
WO2003105160A1 (ja) * 2002-05-31 2003-12-18 タツタ電線株式会社 導電性ペースト、これを用いた多層基板及びその製造方法
WO2004029720A1 (ja) 2002-09-30 2004-04-08 Zeon Corporation 感放射線性樹脂組成物、樹脂パターン膜とその形成方法、及び樹脂パターン膜の利用

Also Published As

Publication number Publication date
EP1612811B1 (en) 2008-02-13
KR20060048688A (ko) 2006-05-18
TWI295307B (cg-RX-API-DMAC10.html) 2008-04-01
JP2006013378A (ja) 2006-01-12
DE602005004703D1 (de) 2008-03-27
CN1715329A (zh) 2006-01-04
TW200613433A (en) 2006-05-01
EP1612811A1 (en) 2006-01-04
DE602005004703T2 (de) 2009-02-12
CN100410319C (zh) 2008-08-13
US20060022790A1 (en) 2006-02-02
US7270776B2 (en) 2007-09-18

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