KR100753290B1 - 로봇을 사용하여 기판을 정렬시키는 장치 및 방법 - Google Patents

로봇을 사용하여 기판을 정렬시키는 장치 및 방법 Download PDF

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Publication number
KR100753290B1
KR100753290B1 KR1020000080200A KR20000080200A KR100753290B1 KR 100753290 B1 KR100753290 B1 KR 100753290B1 KR 1020000080200 A KR1020000080200 A KR 1020000080200A KR 20000080200 A KR20000080200 A KR 20000080200A KR 100753290 B1 KR100753290 B1 KR 100753290B1
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South Korea
Prior art keywords
substrate
end effector
aligning
slot
robot
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Expired - Fee Related
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KR1020000080200A
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English (en)
Korean (ko)
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KR20010062625A (ko
Inventor
존엠. 화이트
시니치 쿠리타
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어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20010062625A publication Critical patent/KR20010062625A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020000080200A 1999-12-23 2000-12-22 로봇을 사용하여 기판을 정렬시키는 장치 및 방법 Expired - Fee Related KR100753290B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/470,821 1999-12-23
US09/470,821 US6577923B1 (en) 1999-12-23 1999-12-23 Apparatus and method for robotic alignment of substrates

Publications (2)

Publication Number Publication Date
KR20010062625A KR20010062625A (ko) 2001-07-07
KR100753290B1 true KR100753290B1 (ko) 2007-08-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020000080200A Expired - Fee Related KR100753290B1 (ko) 1999-12-23 2000-12-22 로봇을 사용하여 기판을 정렬시키는 장치 및 방법

Country Status (5)

Country Link
US (1) US6577923B1 (enExample)
EP (1) EP1126506A3 (enExample)
JP (1) JP2001244316A (enExample)
KR (1) KR100753290B1 (enExample)
SG (1) SG90220A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230080488A (ko) * 2015-02-06 2023-06-07 퍼시몬 테크놀로지스 코포레이션 동등하지 않은 링크 길이를 가진 아암을 구비한 로봇
US11996316B2 (en) 2013-01-18 2024-05-28 Persimmon Technologies Corporation Robot having arm with parallel paths

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US6577923B1 (en) * 1999-12-23 2003-06-10 Applied Materials, Inc. Apparatus and method for robotic alignment of substrates
JP2001222624A (ja) * 2000-02-10 2001-08-17 Sony Corp 情報提供システム、情報提供方法、部品情報提供装置及び部品情報提供方法
JP4327599B2 (ja) * 2001-11-29 2009-09-09 ダイアモンド セミコンダクタ グループ エルエルシー ウエーハ取り扱い装置及び方法
US20080011421A1 (en) * 2002-04-26 2008-01-17 Accretech Usa, Inc. Processing chamber having labyrinth seal
US7135852B2 (en) * 2002-12-03 2006-11-14 Sensarray Corporation Integrated process condition sensing wafer and data analysis system
US7505832B2 (en) * 2003-05-12 2009-03-17 Applied Materials, Inc. Method and apparatus for determining a substrate exchange position in a processing system
US8545159B2 (en) * 2003-10-01 2013-10-01 Jusung Engineering Co., Ltd. Apparatus having conveyor and method of transferring substrate using the same
KR100568867B1 (ko) * 2004-03-18 2006-04-10 삼성전자주식회사 웨이퍼 좌표감지장치 및 그 웨이퍼 좌표감지 기능을 갖는반도체 제조설비
US7440091B2 (en) * 2004-10-26 2008-10-21 Applied Materials, Inc. Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate
US7444205B2 (en) * 2004-10-29 2008-10-28 Neil Desmond Modular self structuring and computing system
US7848832B2 (en) * 2004-11-30 2010-12-07 Kabushiki Kaisha Yaskawa Denki Alignment apparatus
JP2006196716A (ja) * 2005-01-14 2006-07-27 Matsushita Electric Ind Co Ltd 半導体製造装置および半導体装置の製造方法
US20060245871A1 (en) * 2005-03-10 2006-11-02 Wen-Ming Lo Wafer transfer system, wafer transfer method, cassette exchange system and cassette exchange method
KR20070004230A (ko) * 2005-07-04 2007-01-09 삼성전자주식회사 반도체 웨이퍼 이송용 로봇
KR100693759B1 (ko) * 2005-08-16 2007-03-12 주식회사 디엠에스 고밀도 처리가 가능한 기판처리장치 및 방법
KR100693760B1 (ko) * 2005-08-16 2007-03-12 주식회사 디엠에스 고밀도의 현상처리가 가능한 기판처리장치 및 방법
US20080279672A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods of stack to array work-piece transfer for photovoltaic factory
JP5235376B2 (ja) * 2007-10-05 2013-07-10 川崎重工業株式会社 ロボットのターゲット位置検出装置
EP2149831B1 (de) * 2008-07-31 2012-02-01 Siemens Aktiengesellschaft Steuerungsverfahren für einen Verbund aus mehreren, hintereinander und/oder nebeneinander angeordneten, mehrachsigen Handlingsgeräten sowie Datenspeichermedium, Steuerungssystem und Verbund
US8276959B2 (en) 2008-08-08 2012-10-02 Applied Materials, Inc. Magnetic pad for end-effectors
JP6021909B2 (ja) 2011-07-21 2016-11-09 ブルックス オートメーション インコーポレイテッド 低温試料グループホルダーにおける寸法変化の補正のための方法と装置
CH706473A1 (de) * 2012-05-04 2013-11-15 Erowa Ag Überwachugungseinrichtung zur Überwachung von Positionen eines Roboters sowie Fertigungsanlage mit einer Überwachungseinrichtung.
JP6208419B2 (ja) * 2012-09-19 2017-10-04 株式会社ダイヘン 算出装置、搬送ロボットシステム、及び算出方法
US9666465B2 (en) 2013-12-12 2017-05-30 Seagate Technology Llc Positioning apparatus
JP6833685B2 (ja) 2014-11-10 2021-02-24 ブルックス オートメーション インコーポレイテッド ツールの自動教示方法および装置
KR102680059B1 (ko) * 2015-11-23 2024-06-28 어플라이드 머티어리얼스, 인코포레이티드 프로세스 툴에서의 온-보드 메트롤로지(obm) 설계 및 그 영향
US11201078B2 (en) * 2017-02-14 2021-12-14 Applied Materials, Inc. Substrate position calibration for substrate supports in substrate processing systems
US12228395B2 (en) 2017-02-14 2025-02-18 Applied Materials, Inc. Substrate position calibration for substrate supports in substrate processing systems
US10290523B2 (en) * 2017-03-17 2019-05-14 Asm Ip Holding B.V. Wafer processing apparatus, recording medium and wafer conveying method
WO2020167947A1 (en) * 2019-02-14 2020-08-20 Persimmon Technologies Corporation Radar based position measurement for robot systems
JP7576555B2 (ja) * 2019-02-14 2024-10-31 パーシモン テクノロジーズ コーポレイション ２リンクアームを有するリニアロボット
TW202228961A (zh) * 2021-01-27 2022-08-01 日商發那科股份有限公司 選擇順應性裝配機械手臂機器人
JP2024079167A (ja) * 2022-11-30 2024-06-11 東京エレクトロン株式会社 搬送システム、処理システムおよび搬送方法

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JPH06297363A (ja) * 1993-01-28 1994-10-25 Applied Materials Inc ロボット機構を用いた搬入および搬出のための基板位置合わせ方法および装置
JPH09138256A (ja) * 1995-11-14 1997-05-27 Nippon Maikuronikusu:Kk 被検査基板のアライメント方法
JPH10173022A (ja) * 1996-12-10 1998-06-26 Mecs:Kk ウェハ搬送装置
JPH10335420A (ja) * 1997-06-04 1998-12-18 Mecs:Kk ワークのアライメント装置
WO1999002996A2 (en) * 1997-07-11 1999-01-21 Genmark Automation Multiple point position scanning system
JPH1126539A (ja) * 1997-07-04 1999-01-29 Kokusai Electric Co Ltd 半導体製造装置、及び該装置に於ける基板位置ずれ修正方法
KR100309932B1 (ko) * 1986-04-28 2001-12-15 제임스 엠. 윌리암스 웨이퍼 운반 장치 및 방법
US6577923B1 (en) * 1999-12-23 2003-06-10 Applied Materials, Inc. Apparatus and method for robotic alignment of substrates

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EP0597637A1 (en) * 1992-11-12 1994-05-18 Applied Materials, Inc. System and method for automated positioning of a substrate in a processing chamber
JPH06297363A (ja) * 1993-01-28 1994-10-25 Applied Materials Inc ロボット機構を用いた搬入および搬出のための基板位置合わせ方法および装置
JPH09138256A (ja) * 1995-11-14 1997-05-27 Nippon Maikuronikusu:Kk 被検査基板のアライメント方法
JPH10173022A (ja) * 1996-12-10 1998-06-26 Mecs:Kk ウェハ搬送装置
JPH10335420A (ja) * 1997-06-04 1998-12-18 Mecs:Kk ワークのアライメント装置
JPH1126539A (ja) * 1997-07-04 1999-01-29 Kokusai Electric Co Ltd 半導体製造装置、及び該装置に於ける基板位置ずれ修正方法
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11996316B2 (en) 2013-01-18 2024-05-28 Persimmon Technologies Corporation Robot having arm with parallel paths
KR20230080488A (ko) * 2015-02-06 2023-06-07 퍼시몬 테크놀로지스 코포레이션 동등하지 않은 링크 길이를 가진 아암을 구비한 로봇
KR102798678B1 (ko) * 2015-02-06 2025-04-23 퍼시몬 테크놀로지스 코포레이션 동등하지 않은 링크 길이를 가진 아암을 구비한 로봇

Also Published As

Publication number Publication date
JP2001244316A (ja) 2001-09-07
US6577923B1 (en) 2003-06-10
KR20010062625A (ko) 2001-07-07
EP1126506A3 (en) 2006-01-11
SG90220A1 (en) 2002-07-23
EP1126506A2 (en) 2001-08-22

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