KR100728845B1 - 오존을 함유하는 플루오르화 용매 조성물 - Google Patents

오존을 함유하는 플루오르화 용매 조성물 Download PDF

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Publication number
KR100728845B1
KR100728845B1 KR1020027012923A KR20027012923A KR100728845B1 KR 100728845 B1 KR100728845 B1 KR 100728845B1 KR 1020027012923 A KR1020027012923 A KR 1020027012923A KR 20027012923 A KR20027012923 A KR 20027012923A KR 100728845 B1 KR100728845 B1 KR 100728845B1
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KR
South Korea
Prior art keywords
group
ozone
fluorinated solvent
atoms
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020027012923A
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English (en)
Korean (ko)
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KR20020081595A (ko
Inventor
로렌스 에이. 자제라
프레더릭 이. 베어
마이클 제이. 패런트
폴 이. 라즈타
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
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Publication of KR20020081595A publication Critical patent/KR20020081595A/ko
Application granted granted Critical
Publication of KR100728845B1 publication Critical patent/KR100728845B1/ko
Anticipated expiration legal-status Critical
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5018—Halogenated solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/264—Aldehydes; Ketones; Acetals or ketals
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/266—Esters or carbonates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3263—Amides or imides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Detergent Compositions (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020027012923A 2000-03-31 2000-08-08 오존을 함유하는 플루오르화 용매 조성물 Expired - Fee Related KR100728845B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/540,590 2000-03-31
US09/540,590 US6372700B1 (en) 2000-03-31 2000-03-31 Fluorinated solvent compositions containing ozone

Publications (2)

Publication Number Publication Date
KR20020081595A KR20020081595A (ko) 2002-10-28
KR100728845B1 true KR100728845B1 (ko) 2007-06-14

Family

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Family Applications (1)

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KR1020027012923A Expired - Fee Related KR100728845B1 (ko) 2000-03-31 2000-08-08 오존을 함유하는 플루오르화 용매 조성물

Country Status (9)

Country Link
US (2) US6372700B1 (enExample)
EP (1) EP1268734B1 (enExample)
JP (1) JP4532806B2 (enExample)
KR (1) KR100728845B1 (enExample)
AT (1) ATE280214T1 (enExample)
AU (1) AU2000268956A1 (enExample)
DE (1) DE60015190T2 (enExample)
TW (1) TWI254075B (enExample)
WO (1) WO2001074985A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101026095B1 (ko) 2003-06-27 2011-03-31 아사히 가라스 가부시키가이샤 세정 헹굼 방법
US20180039170A1 (en) * 2015-02-27 2018-02-08 Canon Kabushiki Kaisha Nanonimprint liquid material, method for manufacturing nanoimprint liquid material, method for manufacturing cured product pattern, method for manufacturing optical component, and method for manufacturing circuit board

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US6552090B1 (en) * 1997-09-15 2003-04-22 3M Innovative Properties Company Perfluoroalkyl haloalkyl ethers and compositions and applications thereof
US6372700B1 (en) * 2000-03-31 2002-04-16 3M Innovative Properties Company Fluorinated solvent compositions containing ozone
TWI259202B (en) * 2000-06-01 2006-08-01 Asahi Kasei Corp Cleaning method and cleaning apparatus
US6678082B2 (en) 2001-09-12 2004-01-13 Harris Corporation Electro-optical component including a fluorinated poly(phenylene ether ketone) protective coating and related methods
JP3914842B2 (ja) * 2001-10-23 2007-05-16 有限会社ユーエムエス 有機被膜の除去方法および除去装置
DE10229041A1 (de) * 2002-06-28 2004-01-22 Solvay Fluor Und Derivate Gmbh Herstellung homogener Gasgemische
EP1536291A4 (en) * 2002-08-22 2008-08-06 Daikin Ind Ltd Removing solution
US7087805B2 (en) * 2002-10-22 2006-08-08 Steris Inc. Use of an ozone containing fluid to neutralize chemical and/or biological warfare agents
AU2003301858A1 (en) * 2002-11-06 2004-06-07 Nomura Plating Co., Ltd. Surface treatment method for vacuum member
US20040117918A1 (en) * 2002-12-11 2004-06-24 The Procter & Gamble Company Fluorine-containing solvents and compositions and methods employing same
US6884338B2 (en) 2002-12-16 2005-04-26 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
US7147767B2 (en) 2002-12-16 2006-12-12 3M Innovative Properties Company Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
US6858124B2 (en) 2002-12-16 2005-02-22 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
US20050106774A1 (en) * 2003-11-13 2005-05-19 Dmitri Simonian Surface processes in fabrications of microstructures
US7071154B2 (en) * 2003-12-18 2006-07-04 3M Innovative Properties Company Azeotrope-like compositions and their use
JP2005217262A (ja) * 2004-01-30 2005-08-11 Matsushita Electric Ind Co Ltd 化合物半導体装置の製造方法
KR100627139B1 (ko) * 2004-06-18 2006-09-25 한국전자통신연구원 미세기전 구조물 그 제조방법
JP4559250B2 (ja) * 2005-02-16 2010-10-06 シチズンファインテックミヨタ株式会社 アクチュエータ、及びその製造方法
JP2006278966A (ja) * 2005-03-30 2006-10-12 Toshiba Corp 半導体製造装置
US20070129273A1 (en) * 2005-12-07 2007-06-07 Clark Philip G In situ fluoride ion-generating compositions and uses thereof
JP4803821B2 (ja) * 2007-03-23 2011-10-26 大日本スクリーン製造株式会社 基板処理装置
US20090020140A1 (en) * 2007-06-07 2009-01-22 Air Liquide Electronics U.S. Lp Non-flammable solvents for semiconductor applications
US8071816B2 (en) * 2008-06-30 2011-12-06 3M Innovative Properties Company Hydrofluoroacetal compounds and processes for their preparation and use
TWI558876B (zh) * 2010-07-05 2016-11-21 大陽日酸股份有限公司 表面氧化處理方法及表面氧化處理裝置
US20120039796A1 (en) * 2010-08-15 2012-02-16 Demetrios Markou Novel method for creating, suspending and stabilizing electronically modified oxygen derivatives, along with creating, suspending and stabilizing electronically modified reaction intermediates, in a bio compatible fluorocarbon suspension, for the purpose of inducing a cascading immune response in mammalian patients
JP5862353B2 (ja) * 2011-08-05 2016-02-16 東京エレクトロン株式会社 半導体装置の製造方法
JP5630679B1 (ja) * 2013-09-08 2014-11-26 株式会社Ｅ・テック 揮発性消毒剤、揮発性消毒剤の製造方法
US9321635B2 (en) * 2013-11-28 2016-04-26 Solid State System Co., Ltd. Method to release diaphragm in MEMS device
KR102173490B1 (ko) * 2016-03-24 2020-11-05 아반토르 퍼포먼스 머티리얼스, 엘엘씨 비-수성 텅스텐 상용성 금속 질화물 선택적 에칭제 및 세정제

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101026095B1 (ko) 2003-06-27 2011-03-31 아사히 가라스 가부시키가이샤 세정 헹굼 방법
US20180039170A1 (en) * 2015-02-27 2018-02-08 Canon Kabushiki Kaisha Nanonimprint liquid material, method for manufacturing nanoimprint liquid material, method for manufacturing cured product pattern, method for manufacturing optical component, and method for manufacturing circuit board

Also Published As

Publication number Publication date
EP1268734B1 (en) 2004-10-20
TWI254075B (en) 2006-05-01
EP1268734A1 (en) 2003-01-02
AU2000268956A1 (en) 2001-10-15
DE60015190D1 (de) 2004-11-25
WO2001074985A1 (en) 2001-10-11
US20020107160A1 (en) 2002-08-08
ATE280214T1 (de) 2004-11-15
JP4532806B2 (ja) 2010-08-25
US6372700B1 (en) 2002-04-16
KR20020081595A (ko) 2002-10-28
DE60015190T2 (de) 2006-03-09
US6537380B2 (en) 2003-03-25
JP2003529925A (ja) 2003-10-07

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