ATE280214T1 - Fluorierte lösungsmittel enthaltend ozon - Google Patents

Fluorierte lösungsmittel enthaltend ozon

Info

Publication number
ATE280214T1
ATE280214T1 AT00957319T AT00957319T ATE280214T1 AT E280214 T1 ATE280214 T1 AT E280214T1 AT 00957319 T AT00957319 T AT 00957319T AT 00957319 T AT00957319 T AT 00957319T AT E280214 T1 ATE280214 T1 AT E280214T1
Authority
AT
Austria
Prior art keywords
containing ozone
solvents containing
fluorinated solvents
ozone
fluorinated
Prior art date
Application number
AT00957319T
Other languages
English (en)
Inventor
Lawrence A Zazerra
Frederick E Behr
Michael J Parent
Paul E Rajtar
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE280214T1 publication Critical patent/ATE280214T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • C11D7/5004Organic solvents
    • C11D7/5018Halogenated solvents
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39Organic or inorganic per-compounds
    • C11D3/3947Liquid compositions
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02Inorganic compounds
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00Cleaning of wafers, substrates or parts of devices
    • H10P70/10Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00Cleaning of wafers, substrates or parts of devices
    • H10P70/50Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/263Ethers
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/264Aldehydes; Ketones; Acetals or ketals
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/265Carboxylic acids or salts thereof
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/266Esters or carbonates
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/32Organic compounds containing nitrogen
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/32Organic compounds containing nitrogen
    • C11D7/3263Amides or imides
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/32Organic compounds containing nitrogen
    • C11D7/3281Heterocyclic compounds
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00Cleaning and liquid contact with solids
    • Y10S134/902Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Detergent Compositions (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
AT00957319T 2000-03-31 2000-08-08 Fluorierte lösungsmittel enthaltend ozon ATE280214T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/540,590 US6372700B1 (en) 2000-03-31 2000-03-31 Fluorinated solvent compositions containing ozone
PCT/US2000/021598 WO2001074985A1 (en) 2000-03-31 2000-08-08 Fluorinated solvent compositions containing ozone

Publications (1)

Publication Number Publication Date
ATE280214T1 true ATE280214T1 (de) 2004-11-15

Family

ID=24156103

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00957319T ATE280214T1 (de) 2000-03-31 2000-08-08 Fluorierte lösungsmittel enthaltend ozon

Country Status (9)

Country Link
US (2) US6372700B1 (de)
EP (1) EP1268734B1 (de)
JP (1) JP4532806B2 (de)
KR (1) KR100728845B1 (de)
AT (1) ATE280214T1 (de)
AU (1) AU2000268956A1 (de)
DE (1) DE60015190T2 (de)
TW (1) TWI254075B (de)
WO (1) WO2001074985A1 (de)

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US6372700B1 (en) * 2000-03-31 2002-04-16 3M Innovative Properties Company Fluorinated solvent compositions containing ozone
TWI250206B (en) * 2000-06-01 2006-03-01 Asahi Kasei Corp Cleaning agent, cleaning method and cleaning apparatus
US6678082B2 (en) * 2001-09-12 2004-01-13 Harris Corporation Electro-optical component including a fluorinated poly(phenylene ether ketone) protective coating and related methods
JP3914842B2 (ja) * 2001-10-23 2007-05-16 有限会社ユーエムエス 有機被膜の除去方法および除去装置
DE10229041A1 (de) * 2002-06-28 2004-01-22 Solvay Fluor Und Derivate Gmbh Herstellung homogener Gasgemische
KR100649418B1 (ko) 2002-08-22 2006-11-27 다이킨 고교 가부시키가이샤 박리액
US7087805B2 (en) * 2002-10-22 2006-08-08 Steris Inc. Use of an ozone containing fluid to neutralize chemical and/or biological warfare agents
WO2004041477A1 (ja) * 2002-11-06 2004-05-21 Nomura Plating Co., Ltd. 真空用部材の表面処理方法
US20040117918A1 (en) * 2002-12-11 2004-06-24 The Procter & Gamble Company Fluorine-containing solvents and compositions and methods employing same
US6858124B2 (en) 2002-12-16 2005-02-22 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
US6884338B2 (en) 2002-12-16 2005-04-26 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
US7147767B2 (en) 2002-12-16 2006-12-12 3M Innovative Properties Company Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
DE602004024253D1 (de) * 2003-06-27 2009-12-31 Asahi Glass Co Ltd Reinigungs-/Spülverfahren
US20050106774A1 (en) * 2003-11-13 2005-05-19 Dmitri Simonian Surface processes in fabrications of microstructures
US7071154B2 (en) * 2003-12-18 2006-07-04 3M Innovative Properties Company Azeotrope-like compositions and their use
JP2005217262A (ja) * 2004-01-30 2005-08-11 Matsushita Electric Ind Co Ltd 化合物半導体装置の製造方法
KR100627139B1 (ko) * 2004-06-18 2006-09-25 한국전자통신연구원 미세기전 구조물 그 제조방법
JP4559250B2 (ja) * 2005-02-16 2010-10-06 シチズンファインテックミヨタ株式会社 アクチュエータ、及びその製造方法
JP2006278966A (ja) * 2005-03-30 2006-10-12 Toshiba Corp 半導体製造装置
US20070129273A1 (en) * 2005-12-07 2007-06-07 Clark Philip G In situ fluoride ion-generating compositions and uses thereof
JP4803821B2 (ja) 2007-03-23 2011-10-26 大日本スクリーン製造株式会社 基板処理装置
JP2010529670A (ja) * 2007-06-07 2010-08-26 レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード 半導体適用のための非可燃性溶媒
US8071816B2 (en) * 2008-06-30 2011-12-06 3M Innovative Properties Company Hydrofluoroacetal compounds and processes for their preparation and use
TWI558876B (zh) * 2010-07-05 2016-11-21 大陽日酸股份有限公司 表面氧化處理方法及表面氧化處理裝置
US20120039796A1 (en) * 2010-08-15 2012-02-16 Demetrios Markou Novel method for creating, suspending and stabilizing electronically modified oxygen derivatives, along with creating, suspending and stabilizing electronically modified reaction intermediates, in a bio compatible fluorocarbon suspension, for the purpose of inducing a cascading immune response in mammalian patients
JP5862353B2 (ja) * 2011-08-05 2016-02-16 東京エレクトロン株式会社 半導体装置の製造方法
JP5630679B1 (ja) * 2013-09-08 2014-11-26 株式会社E・テック 揮発性消毒剤、揮発性消毒剤の製造方法
US9321635B2 (en) * 2013-11-28 2016-04-26 Solid State System Co., Ltd. Method to release diaphragm in MEMS device
JP2016164977A (ja) * 2015-02-27 2016-09-08 キヤノン株式会社 ナノインプリント用液体材料、ナノインプリント用液体材料の製造方法、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、および電子部品の製造方法
CN109642159B (zh) * 2016-03-24 2022-02-15 安万托特性材料有限公司 非水性钨相容性金属氮化物选择性蚀刻剂和清洁剂

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US6310018B1 (en) * 2000-03-31 2001-10-30 3M Innovative Properties Company Fluorinated solvent compositions containing hydrogen fluoride

Also Published As

Publication number Publication date
DE60015190D1 (de) 2004-11-25
DE60015190T2 (de) 2006-03-09
JP4532806B2 (ja) 2010-08-25
EP1268734A1 (de) 2003-01-02
WO2001074985A1 (en) 2001-10-11
US20020107160A1 (en) 2002-08-08
US6372700B1 (en) 2002-04-16
KR100728845B1 (ko) 2007-06-14
TWI254075B (en) 2006-05-01
EP1268734B1 (de) 2004-10-20
JP2003529925A (ja) 2003-10-07
AU2000268956A1 (en) 2001-10-15
KR20020081595A (ko) 2002-10-28
US6537380B2 (en) 2003-03-25

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