DE602004009584D1 - Halbleiterreinigungslösung - Google Patents

Halbleiterreinigungslösung

Info

Publication number
DE602004009584D1
DE602004009584D1 DE602004009584T DE602004009584T DE602004009584D1 DE 602004009584 D1 DE602004009584 D1 DE 602004009584D1 DE 602004009584 T DE602004009584 T DE 602004009584T DE 602004009584 T DE602004009584 T DE 602004009584T DE 602004009584 D1 DE602004009584 D1 DE 602004009584D1
Authority
DE
Germany
Prior art keywords
compound
cleaning solution
equal
present
chemical formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004009584T
Other languages
English (en)
Other versions
DE602004009584T2 (de
Inventor
Rita Vos
Paul Mertens
Bernd Kolbesen
Albrecht Fester
Oliver Doll
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interuniversitair Microelektronica Centrum vzw IMEC
Air Products and Chemicals Inc
Original Assignee
Interuniversitair Microelektronica Centrum vzw IMEC
Air Products and Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interuniversitair Microelektronica Centrum vzw IMEC, Air Products and Chemicals Inc filed Critical Interuniversitair Microelektronica Centrum vzw IMEC
Publication of DE602004009584D1 publication Critical patent/DE602004009584D1/de
Application granted granted Critical
Publication of DE602004009584T2 publication Critical patent/DE602004009584T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE602004009584T 2003-06-27 2004-06-26 Halbleiterreinigungslösung Expired - Lifetime DE602004009584T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US48314703P 2003-06-27 2003-06-27
US483147P 2003-06-27
PCT/BE2004/000095 WO2005001016A1 (en) 2003-06-27 2004-06-26 Semiconductor cleaning solution

Publications (2)

Publication Number Publication Date
DE602004009584D1 true DE602004009584D1 (de) 2007-11-29
DE602004009584T2 DE602004009584T2 (de) 2008-08-07

Family

ID=33552033

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004009584T Expired - Lifetime DE602004009584T2 (de) 2003-06-27 2004-06-26 Halbleiterreinigungslösung

Country Status (5)

Country Link
US (1) US7521408B2 (de)
EP (1) EP1648991B1 (de)
AT (1) ATE376050T1 (de)
DE (1) DE602004009584T2 (de)
WO (1) WO2005001016A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE376050T1 (de) * 2003-06-27 2007-11-15 Imec Inter Uni Micro Electr Halbleiterreinigungslösung
US7700533B2 (en) 2005-06-23 2010-04-20 Air Products And Chemicals, Inc. Composition for removal of residue comprising cationic salts and methods using same
GB0520380D0 (en) 2005-10-07 2005-11-16 Unilever Plc Stain removal
EP1918985B1 (de) * 2006-10-31 2010-05-26 S.O.I.TEC. Silicon on Insulator Technologies S.A. Verfahren zur Charakterisierung von Defekten auf Silizium-Oberflächen, Ätzlösung für Silizium-Oberflächen und Verfahren zur Behandlung von Silizium-Oberflächen mit der Ätzlösung
WO2008061258A2 (en) * 2006-11-17 2008-05-22 Sachem, Inc. Selective metal wet etch composition and process
CN101270325A (zh) * 2007-03-23 2008-09-24 安集微电子（上海）有限公司 一种清洗液及其应用
JP2009099945A (ja) * 2007-09-28 2009-05-07 Fujifilm Corp 半導体デバイス用洗浄剤及びそれを用いた洗浄方法
ES2386692T3 (es) * 2007-11-13 2012-08-27 Sachem, Inc. Composición de silsesquioxano poliédrico con potencial zeta negativo elevado y método para la limpieza húmeda de semiconductores sin daños
TWI426125B (zh) * 2007-11-20 2014-02-11 Anji Microelectronics Co Ltd 清洗液及其應用
JP5278492B2 (ja) * 2010-06-16 2013-09-04 株式会社デンソー 半導体装置の製造方法
CN102064090B (zh) * 2010-10-15 2013-01-09 北京通美晶体技术有限公司 化合物半导体晶片清洗方法
US20120295447A1 (en) * 2010-11-24 2012-11-22 Air Products And Chemicals, Inc. Compositions and Methods for Texturing of Silicon Wafers
CA2896589A1 (en) 2012-12-31 2014-07-03 Volcano Corporation Devices, systems, and methods for assessment of vessels
US10780461B2 (en) * 2015-05-15 2020-09-22 Taiwan Semiconductor Manufacturing Co., Ltd Methods for processing substrate in semiconductor fabrication

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2842862A1 (de) * 1978-10-02 1980-04-10 Boehringer Mannheim Gmbh Verfahren zur bestimmung von ionen, polaren und/oder lipophilen substanzen in fluessigkeiten
US5686410A (en) * 1989-07-20 1997-11-11 Novartis Ag Polypeptide derivatives
EP0496605B1 (de) * 1991-01-24 2001-08-01 Wako Pure Chemical Industries Ltd Lösungen zur Oberflächenbehandlung von Halbleitern
JP3075290B2 (ja) * 1991-02-28 2000-08-14 三菱瓦斯化学株式会社 半導体基板の洗浄液
DE4136590A1 (de) * 1991-11-07 1993-05-13 Bosch Gmbh Robert Pumpe
US5421897A (en) * 1992-07-17 1995-06-06 Grawe; John Abatement process for contaminants
TW274630B (de) * 1994-01-28 1996-04-21 Wako Zunyaku Kogyo Kk
US5466389A (en) * 1994-04-20 1995-11-14 J. T. Baker Inc. PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates
US5498293A (en) * 1994-06-23 1996-03-12 Mallinckrodt Baker, Inc. Cleaning wafer substrates of metal contamination while maintaining wafer smoothness
WO1997005228A1 (fr) * 1995-07-27 1997-02-13 Mitsubishi Chemical Corporation Procede de traitement de la surface d'un substrat et composition de traitement de surface prevue a cet effet
US5989353A (en) * 1996-10-11 1999-11-23 Mallinckrodt Baker, Inc. Cleaning wafer substrates of metal contamination while maintaining wafer smoothness
US6066609A (en) * 1997-07-31 2000-05-23 Siemens Aktiengesellschaft Aqueous solution for cleaning a semiconductor substrate
US6599370B2 (en) * 2000-10-16 2003-07-29 Mallinckrodt Inc. Stabilized alkaline compositions for cleaning microelectronic substrates
US7160482B2 (en) * 2000-12-22 2007-01-09 Imec Vzw Composition comprising an oxidizing and complexing compound
KR20020061530A (ko) * 2001-01-18 2002-07-24 쉬플리 캄파니, 엘.엘.씨. 촉매 금속의 회수방법
GB0116212D0 (en) * 2001-07-03 2001-08-29 Avecia Ltd Process
KR100546169B1 (ko) * 2001-09-21 2006-01-24 주식회사 하이닉스반도체 포토레지스트 제거용 용액 조성물
KR20050084939A (ko) * 2002-11-05 2005-08-29 메르크 파텐트 게엠베하 반도체 표면 처리 방법 및 이에 사용되는 혼합물
ATE376050T1 (de) * 2003-06-27 2007-11-15 Imec Inter Uni Micro Electr Halbleiterreinigungslösung
CN1875325B (zh) * 2003-10-29 2011-01-26 马林克罗特贝克公司 含有金属卤化物腐蚀抑制剂的碱性后等离子体蚀刻/灰化残余物去除剂和光致抗蚀剂剥离组合物
US7432233B2 (en) * 2003-12-18 2008-10-07 Interuniversitair Microelektronica Centrum (Imec) Composition and method for treating a semiconductor substrate
WO2005107723A2 (en) * 2004-05-06 2005-11-17 Rashid Buttar Transdermal delivery systems and transdermal chelation preparations

Also Published As

Publication number Publication date
EP1648991A1 (de) 2006-04-26
US20060089280A1 (en) 2006-04-27
EP1648991B1 (de) 2007-10-17
ATE376050T1 (de) 2007-11-15
WO2005001016A1 (en) 2005-01-06
DE602004009584T2 (de) 2008-08-07
US7521408B2 (en) 2009-04-21

Similar Documents

Publication Publication Date Title
AU2002218892A1 (en) Composition comprising an oxidizing and complexing compound
ATE376050T1 (de) Halbleiterreinigungslösung
NO20050065L (no) Kjemiske forbindelser
MX2007005408A (es) Compuestos de aminoquinazolinas.
ATE487785T1 (de) Ammoniak-freie fluorid-salze enthaltende mikroelectronikreinigunsmittel
AU4980300A (en) Compositions for cleaning organic and plasma etched residues for semiconductor devices
AU6348600A (en) Lactam compositions for cleaning organic and plasma etched residues for semiconductor devices
ATE338461T1 (de) Pyrazolpyrimidinfungizide
DE60212867D1 (de) Thiazolylsubstituierte aminopyrimidine als pflanzenschutzmittel
ATE405622T1 (de) Wässrige phosphorsäurezusammensetzung zur reinigung von halbleiter-vorrichtungen
SE0300956L (sv) Stabilisatorblandningar
EP1741714A4 (de) Heterocyclische verbindung und mittel gegen maligne tumore, das diese enthält
DE60239170D1 (de) Bicyclische Verbindungen
NO20040067L (no) Ammoniakkfrei alkaliske mikroelektroniske rengjoringssammensetninger med forbedret substratkompatibilitet
TW200624410A (en) Triarylamine compounds, compositions and devices
AR011912A1 (es) PROCEDIMIENTO PARA LA PREPARACION DE COMPUESTOS DE 5-AMINO-1-ARIL-3-CIANOPIRAZOL, COMPUESTOS INTERMEDIARIOS DE APLICACIoN EN EL MISMO Y PROCESOS PARA PREPARAR DICHOS COMPUESTOS INTERMEDIARIOS
ATE287403T1 (de) 6-phenylbenzonaphthyidine
ATE373071T1 (de) Zusammensetzung und verfahren zur behandlung von halbleitersubstraten
RS20060206A (en) Aminopyridine-derivatives as inducible no-synthase inhibitors
NO20041671L (no) Anthelmintic composition
DE60123602D1 (de) Reinigen von oberflächen
NO20050764L (no) Forbindelser
SE0003186D0 (sv) New process
TW200712105A (en) The leavening agent
RS20050026A (en) Novel benzohydrazide derivatives as herbicides and desiccant compositions contaning them

Legal Events

Date Code Title Description
8364 No opposition during term of opposition