AU2000268956A1 - Fluorinated solvent compositions containing ozone - Google Patents

Fluorinated solvent compositions containing ozone

Info

Publication number
AU2000268956A1
AU2000268956A1 AU2000268956A AU6895600A AU2000268956A1 AU 2000268956 A1 AU2000268956 A1 AU 2000268956A1 AU 2000268956 A AU2000268956 A AU 2000268956A AU 6895600 A AU6895600 A AU 6895600A AU 2000268956 A1 AU2000268956 A1 AU 2000268956A1
Authority
AU
Australia
Prior art keywords
compositions containing
fluorinated solvent
containing ozone
solvent compositions
ozone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2000268956A
Other languages
English (en)
Inventor
Frederick E. Behr
Michael J. Parent
Paul E. Rajtar
Lawrence A. Zazerra
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2000268956A1 publication Critical patent/AU2000268956A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5018—Halogenated solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/264—Aldehydes; Ketones; Acetals or ketals
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/266—Esters or carbonates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3263—Amides or imides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Detergent Compositions (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
AU2000268956A 2000-03-31 2000-08-08 Fluorinated solvent compositions containing ozone Abandoned AU2000268956A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/540,590 US6372700B1 (en) 2000-03-31 2000-03-31 Fluorinated solvent compositions containing ozone
US09540590 2000-03-31
PCT/US2000/021598 WO2001074985A1 (en) 2000-03-31 2000-08-08 Fluorinated solvent compositions containing ozone

Publications (1)

Publication Number Publication Date
AU2000268956A1 true AU2000268956A1 (en) 2001-10-15

Family

ID=24156103

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2000268956A Abandoned AU2000268956A1 (en) 2000-03-31 2000-08-08 Fluorinated solvent compositions containing ozone

Country Status (9)

Country Link
US (2) US6372700B1 (enExample)
EP (1) EP1268734B1 (enExample)
JP (1) JP4532806B2 (enExample)
KR (1) KR100728845B1 (enExample)
AT (1) ATE280214T1 (enExample)
AU (1) AU2000268956A1 (enExample)
DE (1) DE60015190T2 (enExample)
TW (1) TWI254075B (enExample)
WO (1) WO2001074985A1 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6552090B1 (en) * 1997-09-15 2003-04-22 3M Innovative Properties Company Perfluoroalkyl haloalkyl ethers and compositions and applications thereof
US6372700B1 (en) * 2000-03-31 2002-04-16 3M Innovative Properties Company Fluorinated solvent compositions containing ozone
TWI259202B (en) * 2000-06-01 2006-08-01 Asahi Kasei Corp Cleaning method and cleaning apparatus
US6678082B2 (en) * 2001-09-12 2004-01-13 Harris Corporation Electro-optical component including a fluorinated poly(phenylene ether ketone) protective coating and related methods
JP3914842B2 (ja) * 2001-10-23 2007-05-16 有限会社ユーエムエス 有機被膜の除去方法および除去装置
DE10229041A1 (de) * 2002-06-28 2004-01-22 Solvay Fluor Und Derivate Gmbh Herstellung homogener Gasgemische
AU2003257636A1 (en) * 2002-08-22 2004-03-11 Daikin Industries, Ltd. Removing solution
US7087805B2 (en) * 2002-10-22 2006-08-08 Steris Inc. Use of an ozone containing fluid to neutralize chemical and/or biological warfare agents
WO2004041477A1 (ja) * 2002-11-06 2004-05-21 Nomura Plating Co., Ltd. 真空用部材の表面処理方法
US20040117918A1 (en) * 2002-12-11 2004-06-24 The Procter & Gamble Company Fluorine-containing solvents and compositions and methods employing same
US6884338B2 (en) 2002-12-16 2005-04-26 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
US6858124B2 (en) 2002-12-16 2005-02-22 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
US7147767B2 (en) 2002-12-16 2006-12-12 3M Innovative Properties Company Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
CN100412184C (zh) * 2003-06-27 2008-08-20 旭硝子株式会社 清洗漂洗方法
US20050106774A1 (en) * 2003-11-13 2005-05-19 Dmitri Simonian Surface processes in fabrications of microstructures
US7071154B2 (en) * 2003-12-18 2006-07-04 3M Innovative Properties Company Azeotrope-like compositions and their use
JP2005217262A (ja) * 2004-01-30 2005-08-11 Matsushita Electric Ind Co Ltd 化合物半導体装置の製造方法
KR100627139B1 (ko) * 2004-06-18 2006-09-25 한국전자통신연구원 미세기전 구조물 그 제조방법
JP4559250B2 (ja) * 2005-02-16 2010-10-06 シチズンファインテックミヨタ株式会社 アクチュエータ、及びその製造方法
JP2006278966A (ja) * 2005-03-30 2006-10-12 Toshiba Corp 半導体製造装置
US20070129273A1 (en) * 2005-12-07 2007-06-07 Clark Philip G In situ fluoride ion-generating compositions and uses thereof
JP4803821B2 (ja) * 2007-03-23 2011-10-26 大日本スクリーン製造株式会社 基板処理装置
JP2010529670A (ja) * 2007-06-07 2010-08-26 レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード 半導体適用のための非可燃性溶媒
US8071816B2 (en) * 2008-06-30 2011-12-06 3M Innovative Properties Company Hydrofluoroacetal compounds and processes for their preparation and use
TWI558876B (zh) * 2010-07-05 2016-11-21 大陽日酸股份有限公司 表面氧化處理方法及表面氧化處理裝置
US20120039796A1 (en) * 2010-08-15 2012-02-16 Demetrios Markou Novel method for creating, suspending and stabilizing electronically modified oxygen derivatives, along with creating, suspending and stabilizing electronically modified reaction intermediates, in a bio compatible fluorocarbon suspension, for the purpose of inducing a cascading immune response in mammalian patients
JP5862353B2 (ja) * 2011-08-05 2016-02-16 東京エレクトロン株式会社 半導体装置の製造方法
JP5630679B1 (ja) * 2013-09-08 2014-11-26 株式会社Ｅ・テック 揮発性消毒剤、揮発性消毒剤の製造方法
US9321635B2 (en) * 2013-11-28 2016-04-26 Solid State System Co., Ltd. Method to release diaphragm in MEMS device
JP2016164977A (ja) * 2015-02-27 2016-09-08 キヤノン株式会社 ナノインプリント用液体材料、ナノインプリント用液体材料の製造方法、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、および電子部品の製造方法
CN109642159B (zh) * 2016-03-24 2022-02-15 安万托特性材料有限公司 非水性钨相容性金属氮化物选择性蚀刻剂和清洁剂

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US4182663A (en) 1978-03-13 1980-01-08 Vaseen Vesper A Converting oxygen to ozone by U.V. radiation of a halogen saturated hydrocarbon liquid containing dissolved or absorbed oxygen
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US5603750A (en) 1995-08-14 1997-02-18 Minnesota Mining And Manufacturing Company Fluorocarbon fluids as gas carriers to aid in precious and base metal heap leaching operations
DE69620642T2 (de) * 1995-12-15 2002-11-28 Minnesota Mining And Mfg. Co., Saint Paul Reiningungsverfahren und-zusammensetzung
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DE19701971C1 (de) 1997-01-22 1998-11-26 Invent Gmbh Entwicklung Neuer Technologien Verfahren und Vorrichtung zur Reinigung von Substratoberflächen
US5882425A (en) 1997-01-23 1999-03-16 Semitool, Inc. Composition and method for passivation of a metallization layer of a semiconductor circuit after metallization etching
US6552090B1 (en) 1997-09-15 2003-04-22 3M Innovative Properties Company Perfluoroalkyl haloalkyl ethers and compositions and applications thereof
EP1025409A1 (en) 1997-09-23 2000-08-09 Gary W. Ferrell Improved chemical drying and cleaning system
US6046368A (en) 1998-03-17 2000-04-04 3M Innovative Properties Company Catalytic process for making hydrofluoroethers
US5914003A (en) 1998-06-09 1999-06-22 Mach I, Inc. Cellulose oxidation
JP4107720B2 (ja) * 1998-07-07 2008-06-25 スリーエム カンパニー 半導体製造装置における汚染物の洗浄方法
US6297308B1 (en) * 1999-10-07 2001-10-02 3M Innovative Properties Company Chemical compositions
US6310018B1 (en) * 2000-03-31 2001-10-30 3M Innovative Properties Company Fluorinated solvent compositions containing hydrogen fluoride
US6372700B1 (en) * 2000-03-31 2002-04-16 3M Innovative Properties Company Fluorinated solvent compositions containing ozone

Also Published As

Publication number Publication date
KR20020081595A (ko) 2002-10-28
EP1268734B1 (en) 2004-10-20
KR100728845B1 (ko) 2007-06-14
EP1268734A1 (en) 2003-01-02
TWI254075B (en) 2006-05-01
ATE280214T1 (de) 2004-11-15
JP4532806B2 (ja) 2010-08-25
DE60015190D1 (de) 2004-11-25
WO2001074985A1 (en) 2001-10-11
US6372700B1 (en) 2002-04-16
US6537380B2 (en) 2003-03-25
US20020107160A1 (en) 2002-08-08
DE60015190T2 (de) 2006-03-09
JP2003529925A (ja) 2003-10-07

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