KR100708597B1 - 반도체 메모리 칩 모듈 - Google Patents

반도체 메모리 칩 모듈 Download PDF

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Publication number
KR100708597B1
KR100708597B1 KR1020017016453A KR20017016453A KR100708597B1 KR 100708597 B1 KR100708597 B1 KR 100708597B1 KR 1020017016453 A KR1020017016453 A KR 1020017016453A KR 20017016453 A KR20017016453 A KR 20017016453A KR 100708597 B1 KR100708597 B1 KR 100708597B1
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KR
South Korea
Prior art keywords
chip
memory
memory chip
semiconductor memory
chip module
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020017016453A
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English (en)
Korean (ko)
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KR20020021137A (ko
Inventor
토마스 그라슬
Original Assignee
지세케 앤드 데브리엔트 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 지세케 앤드 데브리엔트 게엠베하 filed Critical 지세케 앤드 데브리엔트 게엠베하
Publication of KR20020021137A publication Critical patent/KR20020021137A/ko
Application granted granted Critical
Publication of KR100708597B1 publication Critical patent/KR100708597B1/ko
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Semiconductor Memories (AREA)
  • Static Random-Access Memory (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Credit Cards Or The Like (AREA)
  • Dram (AREA)
  • Read Only Memory (AREA)
KR1020017016453A 1999-06-23 2000-06-19 반도체 메모리 칩 모듈 Expired - Fee Related KR100708597B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19928733.3 1999-06-23
DE19928733A DE19928733A1 (de) 1999-06-23 1999-06-23 Halbleiterspeicher-Chipmodul

Publications (2)

Publication Number Publication Date
KR20020021137A KR20020021137A (ko) 2002-03-18
KR100708597B1 true KR100708597B1 (ko) 2007-08-10

Family

ID=7912247

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017016453A Expired - Fee Related KR100708597B1 (ko) 1999-06-23 2000-06-19 반도체 메모리 칩 모듈

Country Status (12)

Country Link
US (1) US6721196B1 (https=)
EP (1) EP1198797B1 (https=)
JP (1) JP2003503834A (https=)
KR (1) KR100708597B1 (https=)
CN (1) CN1203486C (https=)
AT (1) ATE239296T1 (https=)
AU (1) AU5683500A (https=)
BR (1) BR0011868A (https=)
CA (1) CA2377175C (https=)
DE (2) DE19928733A1 (https=)
ES (1) ES2193968T3 (https=)
WO (1) WO2001001418A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10139414A1 (de) * 2001-08-17 2003-02-27 Giesecke & Devrient Gmbh Halbleiterschaltungsanordnung mit biometrischem Sensor und Auswerteeinheit
KR100528464B1 (ko) * 2003-02-06 2005-11-15 삼성전자주식회사 스마트카드의 보안장치
DE10317147A1 (de) * 2003-04-14 2004-10-28 Nec Electronics (Europe) Gmbh Sicheres Speichersystem mit Flash-Speichern und Cache-Speicher
KR100689589B1 (ko) * 2004-12-30 2007-03-02 매그나칩 반도체 유한회사 반도체 소자 및 그 제조 방법
US7581678B2 (en) 2005-02-22 2009-09-01 Tyfone, Inc. Electronic transaction card
US7557597B2 (en) * 2005-06-03 2009-07-07 International Business Machines Corporation Stacked chip security
US7991158B2 (en) * 2006-12-13 2011-08-02 Tyfone, Inc. Secure messaging
US20080244208A1 (en) * 2007-03-30 2008-10-02 Narendra Siva G Memory card hidden command protocol
US9741027B2 (en) * 2007-12-14 2017-08-22 Tyfone, Inc. Memory card based contactless devices
US8451122B2 (en) 2008-08-08 2013-05-28 Tyfone, Inc. Smartcard performance enhancement circuits and systems
US7961101B2 (en) 2008-08-08 2011-06-14 Tyfone, Inc. Small RFID card with integrated inductive element
US12147863B2 (en) 2008-08-08 2024-11-19 Icashe, Inc. Method and apparatus for transmitting data via NFC for mobile applications including mobile payments and ticketing
US20100033310A1 (en) * 2008-08-08 2010-02-11 Narendra Siva G Power negotation for small rfid card
EP2401708A4 (en) * 2009-02-24 2012-08-15 Tyfone Inc CONTACTLESS DEVICE WITH MINIATURIZED ANTENNA
CN103633092B (zh) * 2012-08-22 2016-02-03 成都海存艾匹科技有限公司 存储、模拟和数字功能分离的三维存储器
TWI579856B (zh) 2014-09-12 2017-04-21 東芝股份有限公司 Semiconductor device
US20190244666A1 (en) * 2018-02-04 2019-08-08 Fu-Chang Hsu Methods and apparatus for memory cells that combine static ram and non volatile memory

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0328062A2 (en) * 1988-02-08 1989-08-16 Pitney Bowes, Inc. Fault tolerant smart card
JPH0328062A (ja) * 1989-06-23 1991-02-06 Jidosha Kiki Co Ltd 液圧倍力装置
KR100328062B1 (ko) * 1997-12-13 2002-06-29 이구택 일산화탄소농도에따른극저탄소강의정련방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH025455A (ja) 1988-06-24 1990-01-10 Hitachi Ltd チップオンチップの半導体装置
JP2591324B2 (ja) * 1990-10-29 1997-03-19 日本電気株式会社 半導体記憶集積回路
US5229647A (en) 1991-03-27 1993-07-20 Micron Technology, Inc. High density data storage using stacked wafers
JP2622038B2 (ja) * 1991-06-03 1997-06-18 シャープ株式会社 半導体装置及びその製造方法
JPH0548000A (ja) * 1991-08-13 1993-02-26 Fujitsu Ltd 半導体装置
US5422435A (en) * 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
DE4219031C2 (de) 1992-06-10 1994-11-10 Siemens Ag Multi-Chip-Modul mit Kondensator, der auf dem Träger aus Silizium (monokristalines Substrat) realisiert ist
JP2605968B2 (ja) 1993-04-06 1997-04-30 日本電気株式会社 半導体集積回路およびその形成方法
WO1994024704A1 (en) * 1993-04-12 1994-10-27 Bolger Justin C Area bonding conductive adhesive preforms
US5514907A (en) * 1995-03-21 1996-05-07 Simple Technology Incorporated Apparatus for stacking semiconductor chips
DE19511775C1 (de) * 1995-03-30 1996-10-17 Siemens Ag Trägermodul, insb. zum Einbau in einen kartenförmigen Datenträger, mit Schutz gegen die Untersuchung geheimer Bestandteile
EP0811204B1 (de) 1995-07-05 1999-09-22 International Business Machines Corporation Verarbeitung langer nachrichten in einer chipkarte
US5973396A (en) * 1996-02-16 1999-10-26 Micron Technology, Inc. Surface mount IC using silicon vias in an area array format or same size as die array
JP4011695B2 (ja) * 1996-12-02 2007-11-21 株式会社東芝 マルチチップ半導体装置用チップおよびその形成方法
US6037661A (en) * 1996-12-20 2000-03-14 International Business Machines Multichip module
US5915167A (en) * 1997-04-04 1999-06-22 Elm Technology Corporation Three dimensional structure memory

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0328062A2 (en) * 1988-02-08 1989-08-16 Pitney Bowes, Inc. Fault tolerant smart card
JPH0328062A (ja) * 1989-06-23 1991-02-06 Jidosha Kiki Co Ltd 液圧倍力装置
KR100328062B1 (ko) * 1997-12-13 2002-06-29 이구택 일산화탄소농도에따른극저탄소강의정련방법

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
0328062

Also Published As

Publication number Publication date
KR20020021137A (ko) 2002-03-18
ES2193968T3 (es) 2003-11-16
CA2377175C (en) 2007-01-09
CN1203486C (zh) 2005-05-25
EP1198797B1 (de) 2003-05-02
AU5683500A (en) 2001-01-31
ATE239296T1 (de) 2003-05-15
US6721196B1 (en) 2004-04-13
DE19928733A1 (de) 2001-01-04
JP2003503834A (ja) 2003-01-28
EP1198797A1 (de) 2002-04-24
DE50001991D1 (de) 2003-06-05
WO2001001418A1 (de) 2001-01-04
BR0011868A (pt) 2002-04-09
CN1358315A (zh) 2002-07-10
CA2377175A1 (en) 2001-01-04

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