KR100675030B1 - 집적 회로 패키지 - Google Patents

집적 회로 패키지 Download PDF

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Publication number
KR100675030B1
KR100675030B1 KR1020010043981A KR20010043981A KR100675030B1 KR 100675030 B1 KR100675030 B1 KR 100675030B1 KR 1020010043981 A KR1020010043981 A KR 1020010043981A KR 20010043981 A KR20010043981 A KR 20010043981A KR 100675030 B1 KR100675030 B1 KR 100675030B1
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South Korea
Prior art keywords
integrated circuit
conductive
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circuit chip
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KR1020010043981A
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English (en)
Korean (ko)
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KR20020010489A (ko
Inventor
콘찰스
Original Assignee
에이저 시스템즈 가디언 코포레이션
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Publication of KR20020010489A publication Critical patent/KR20020010489A/ko
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Publication of KR100675030B1 publication Critical patent/KR100675030B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020010043981A 2000-07-28 2001-07-21 집적 회로 패키지 Expired - Lifetime KR100675030B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/628067 2000-07-28
US09/628,067 US6509642B1 (en) 2000-07-28 2000-07-28 Integrated circuit package

Publications (2)

Publication Number Publication Date
KR20020010489A KR20020010489A (ko) 2002-02-04
KR100675030B1 true KR100675030B1 (ko) 2007-01-29

Family

ID=24517308

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010043981A Expired - Lifetime KR100675030B1 (ko) 2000-07-28 2001-07-21 집적 회로 패키지

Country Status (5)

Country Link
US (1) US6509642B1 (enrdf_load_stackoverflow)
JP (1) JP2002057238A (enrdf_load_stackoverflow)
KR (1) KR100675030B1 (enrdf_load_stackoverflow)
GB (1) GB2370687B (enrdf_load_stackoverflow)
TW (1) TW498514B (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6614123B2 (en) * 2001-07-31 2003-09-02 Chippac, Inc. Plastic ball grid array package with integral heatsink
TW523887B (en) 2001-11-15 2003-03-11 Siliconware Precision Industries Co Ltd Semiconductor packaged device and its manufacturing method
US6977436B2 (en) * 2002-02-14 2005-12-20 Macronix International Co. Ltd. Semiconductor packaging device
TW582100B (en) * 2002-05-30 2004-04-01 Fujitsu Ltd Semiconductor device having a heat spreader exposed from a seal resin
US9713258B2 (en) * 2006-04-27 2017-07-18 International Business Machines Corporation Integrated circuit chip packaging
TW200828555A (en) * 2006-12-18 2008-07-01 Advanced Connection Tech Inc Package module for radio frequency identification chip
US8159828B2 (en) * 2007-02-23 2012-04-17 Alpha & Omega Semiconductor, Inc. Low profile flip chip power module and method of making
JP2010034403A (ja) * 2008-07-30 2010-02-12 Shinko Electric Ind Co Ltd 配線基板及び電子部品装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5823462A (ja) 1981-08-06 1983-02-12 Mitsubishi Electric Corp 半導体装置の冷却方法
JPH04139752A (ja) 1990-09-29 1992-05-13 Toshiba Corp 冷却装置
US5294826A (en) 1993-04-16 1994-03-15 Northern Telecom Limited Integrated circuit package and assembly thereof for thermal and EMI management
US5650593A (en) * 1994-05-26 1997-07-22 Amkor Electronics, Inc. Thermally enhanced chip carrier package
JP3292798B2 (ja) * 1995-10-04 2002-06-17 三菱電機株式会社 半導体装置
DE69735361T2 (de) * 1996-07-03 2006-10-19 Seiko Epson Corp. Harzverkapselte halbleiteranordnung und herstellungsverfahren dafür
US5894166A (en) 1997-09-17 1999-04-13 Northern Telecom Limited Chip mounting scheme

Also Published As

Publication number Publication date
TW498514B (en) 2002-08-11
US6509642B1 (en) 2003-01-21
JP2002057238A (ja) 2002-02-22
GB2370687B (en) 2005-03-23
GB0117917D0 (en) 2001-09-12
KR20020010489A (ko) 2002-02-04
GB2370687A (en) 2002-07-03

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