KR100602537B1 - 반도체 접속 기판용 접착제 부착 테이프 및 그것을 사용한동박 적층판 - Google Patents

반도체 접속 기판용 접착제 부착 테이프 및 그것을 사용한동박 적층판 Download PDF

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KR100602537B1
KR100602537B1 KR1020027005242A KR20027005242A KR100602537B1 KR 100602537 B1 KR100602537 B1 KR 100602537B1 KR 1020027005242 A KR1020027005242 A KR 1020027005242A KR 20027005242 A KR20027005242 A KR 20027005242A KR 100602537 B1 KR100602537 B1 KR 100602537B1
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South Korea
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adhesive
tape
adhesive tape
insulating film
semiconductor devices
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Expired - Fee Related
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Korean (ko)
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KR20020044569A (ko
Inventor
미끼히로 오구라
쇼지 기고시
마사미 도꾸나가
야스아끼 쯔쯔미
류이찌 가메이
겐 시미즈
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도레이 가부시끼가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer

Landscapes

  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020027005242A 2000-08-25 2001-08-22 반도체 접속 기판용 접착제 부착 테이프 및 그것을 사용한동박 적층판 Expired - Fee Related KR100602537B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00255352 2000-08-25
JP2000255352A JP4665298B2 (ja) 2000-08-25 2000-08-25 半導体装置用接着剤付きテープおよびそれを用いた銅張り積層板、半導体接続用基板ならびに半導体装置

Publications (2)

Publication Number Publication Date
KR20020044569A KR20020044569A (ko) 2002-06-15
KR100602537B1 true KR100602537B1 (ko) 2006-07-20

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KR1020027005242A Expired - Fee Related KR100602537B1 (ko) 2000-08-25 2001-08-22 반도체 접속 기판용 접착제 부착 테이프 및 그것을 사용한동박 적층판

Country Status (9)

Country Link
US (1) US6982484B2 (https=)
EP (1) EP1249863B1 (https=)
JP (1) JP4665298B2 (https=)
KR (1) KR100602537B1 (https=)
CN (1) CN1204611C (https=)
AT (1) ATE380393T1 (https=)
DE (1) DE60131725T2 (https=)
TW (1) TW594891B (https=)
WO (1) WO2002017379A1 (https=)

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JP5029057B2 (ja) * 2007-02-19 2012-09-19 旭硝子株式会社 燃料電池製造プロセス用キャリアフィルム
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JP5467720B2 (ja) * 2007-12-28 2014-04-09 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP5792924B2 (ja) * 2009-04-30 2015-10-14 住友電気工業株式会社 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板
JP5384443B2 (ja) 2010-07-28 2014-01-08 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
CN104244586A (zh) * 2013-07-04 2014-12-24 漳州市福世通电子有限公司 一种卷式ic卡线路板铜箔与基材的固化方法
JP6238121B2 (ja) * 2013-10-01 2017-11-29 ローム株式会社 半導体装置
CN105739138A (zh) * 2016-04-28 2016-07-06 京东方科技集团股份有限公司 一种面板、封框胶固化方法及超薄基板加工方法
TWI800534B (zh) * 2017-09-29 2023-05-01 南韓商Ｌｇ化學股份有限公司 用於封裝有機電子元件之方法
JP6909171B2 (ja) * 2018-02-12 2021-07-28 株式会社巴川製紙所 半導体装置製造用接着シート及びそれを用いた半導体装置の製造方法
KR102607691B1 (ko) * 2018-12-17 2023-11-30 닛폰세이테츠 가부시키가이샤 스테이터용 접착 적층 코어 및 회전 전기 기계
TW202541302A (zh) * 2019-02-04 2025-10-16 日商索尼半導體解決方案公司 電子裝置
WO2021176804A1 (ja) * 2020-03-05 2021-09-10 リンテック株式会社 ロール体
CN116209237B (zh) * 2022-12-29 2023-10-27 东莞市富颖电子材料有限公司 一种元器件点胶贴及其制备工艺

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Also Published As

Publication number Publication date
CN1393033A (zh) 2003-01-22
DE60131725T2 (de) 2008-11-06
DE60131725D1 (de) 2008-01-17
TW594891B (en) 2004-06-21
EP1249863A8 (en) 2003-01-15
HK1051441A1 (en) 2003-08-01
EP1249863B1 (en) 2007-12-05
JP4665298B2 (ja) 2011-04-06
KR20020044569A (ko) 2002-06-15
EP1249863A4 (en) 2005-03-16
ATE380393T1 (de) 2007-12-15
JP2002076062A (ja) 2002-03-15
EP1249863A1 (en) 2002-10-16
US20030031867A1 (en) 2003-02-13
CN1204611C (zh) 2005-06-01
US6982484B2 (en) 2006-01-03
WO2002017379A1 (en) 2002-02-28

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