TW594891B - The adhesive-attached tape for semiconductor substrate and using them for the copper-affixed laminates - Google Patents

The adhesive-attached tape for semiconductor substrate and using them for the copper-affixed laminates Download PDF

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Publication number
TW594891B
TW594891B TW090120598A TW90120598A TW594891B TW 594891 B TW594891 B TW 594891B TW 090120598 A TW090120598 A TW 090120598A TW 90120598 A TW90120598 A TW 90120598A TW 594891 B TW594891 B TW 594891B
Authority
TW
Taiwan
Prior art keywords
adhesive
resin
adhesive tape
tape
semiconductor
Prior art date
Application number
TW090120598A
Other languages
English (en)
Chinese (zh)
Inventor
Mikihiro Ogura
Syouji Kigoshi
Masami Tokunaga
Yasuaki Tsutsumi
Ryuichi Kamei
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Application granted granted Critical
Publication of TW594891B publication Critical patent/TW594891B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer

Landscapes

  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW090120598A 2000-08-25 2001-08-22 The adhesive-attached tape for semiconductor substrate and using them for the copper-affixed laminates TW594891B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000255352A JP4665298B2 (ja) 2000-08-25 2000-08-25 半導体装置用接着剤付きテープおよびそれを用いた銅張り積層板、半導体接続用基板ならびに半導体装置

Publications (1)

Publication Number Publication Date
TW594891B true TW594891B (en) 2004-06-21

Family

ID=18744154

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090120598A TW594891B (en) 2000-08-25 2001-08-22 The adhesive-attached tape for semiconductor substrate and using them for the copper-affixed laminates

Country Status (9)

Country Link
US (1) US6982484B2 (https=)
EP (1) EP1249863B1 (https=)
JP (1) JP4665298B2 (https=)
KR (1) KR100602537B1 (https=)
CN (1) CN1204611C (https=)
AT (1) ATE380393T1 (https=)
DE (1) DE60131725T2 (https=)
TW (1) TW594891B (https=)
WO (1) WO2002017379A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8109432B2 (en) 2005-07-11 2012-02-07 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
US8123111B2 (en) 2005-03-29 2012-02-28 Showa Denko K.K. Production method of solder circuit board
TWI858212B (zh) * 2020-03-05 2024-10-11 日商琳得科股份有限公司 捲材體
TWI877132B (zh) * 2019-02-04 2025-03-21 日商索尼半導體解決方案公司 電子裝置

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KR100633849B1 (ko) * 2002-04-03 2006-10-13 가부시키가이샤 도모에가와 세이시쇼 반도체 장치 제조용 접착 시트
US7005729B2 (en) * 2002-04-24 2006-02-28 Intel Corporation Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame
JP4082242B2 (ja) * 2003-03-06 2008-04-30 ソニー株式会社 素子転写方法
JP3952196B2 (ja) * 2003-06-25 2007-08-01 信越化学工業株式会社 フレキシブル金属箔ポリイミド積層板の製造方法
JP4397653B2 (ja) * 2003-08-26 2010-01-13 日東電工株式会社 半導体装置製造用接着シート
US7132158B2 (en) * 2003-10-22 2006-11-07 Olin Corporation Support layer for thin copper foil
JP4785340B2 (ja) * 2003-11-13 2011-10-05 三井化学株式会社 ポリイミド金属積層板
KR100674907B1 (ko) * 2003-11-26 2007-01-26 삼성전자주식회사 고신뢰성을 갖는 스택형 반도체 패키지
WO2007029866A1 (en) * 2005-09-09 2007-03-15 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
KR100728748B1 (ko) * 2005-12-14 2007-06-19 삼성전기주식회사 임베디드 인쇄회로기판 제조방법
JP5029057B2 (ja) * 2007-02-19 2012-09-19 旭硝子株式会社 燃料電池製造プロセス用キャリアフィルム
US7923373B2 (en) 2007-06-04 2011-04-12 Micron Technology, Inc. Pitch multiplication using self-assembling materials
JP5467720B2 (ja) * 2007-12-28 2014-04-09 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP5792924B2 (ja) * 2009-04-30 2015-10-14 住友電気工業株式会社 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板
JP5384443B2 (ja) 2010-07-28 2014-01-08 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
CN104244586A (zh) * 2013-07-04 2014-12-24 漳州市福世通电子有限公司 一种卷式ic卡线路板铜箔与基材的固化方法
JP6238121B2 (ja) * 2013-10-01 2017-11-29 ローム株式会社 半導体装置
CN105739138A (zh) * 2016-04-28 2016-07-06 京东方科技集团股份有限公司 一种面板、封框胶固化方法及超薄基板加工方法
TWI800534B (zh) * 2017-09-29 2023-05-01 南韓商Ｌｇ化學股份有限公司 用於封裝有機電子元件之方法
JP6909171B2 (ja) * 2018-02-12 2021-07-28 株式会社巴川製紙所 半導体装置製造用接着シート及びそれを用いた半導体装置の製造方法
KR102607691B1 (ko) * 2018-12-17 2023-11-30 닛폰세이테츠 가부시키가이샤 스테이터용 접착 적층 코어 및 회전 전기 기계
CN116209237B (zh) * 2022-12-29 2023-10-27 东莞市富颖电子材料有限公司 一种元器件点胶贴及其制备工艺

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8123111B2 (en) 2005-03-29 2012-02-28 Showa Denko K.K. Production method of solder circuit board
US8109432B2 (en) 2005-07-11 2012-02-07 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
TWI877132B (zh) * 2019-02-04 2025-03-21 日商索尼半導體解決方案公司 電子裝置
TWI858212B (zh) * 2020-03-05 2024-10-11 日商琳得科股份有限公司 捲材體

Also Published As

Publication number Publication date
CN1393033A (zh) 2003-01-22
DE60131725T2 (de) 2008-11-06
DE60131725D1 (de) 2008-01-17
EP1249863A8 (en) 2003-01-15
HK1051441A1 (en) 2003-08-01
EP1249863B1 (en) 2007-12-05
JP4665298B2 (ja) 2011-04-06
KR20020044569A (ko) 2002-06-15
EP1249863A4 (en) 2005-03-16
ATE380393T1 (de) 2007-12-15
KR100602537B1 (ko) 2006-07-20
JP2002076062A (ja) 2002-03-15
EP1249863A1 (en) 2002-10-16
US20030031867A1 (en) 2003-02-13
CN1204611C (zh) 2005-06-01
US6982484B2 (en) 2006-01-03
WO2002017379A1 (en) 2002-02-28

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