KR100558143B1 - 와이어본딩용 와이어의 이니셜 볼 형성방법 및 와이어본딩장치 - Google Patents

와이어본딩용 와이어의 이니셜 볼 형성방법 및 와이어본딩장치 Download PDF

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Publication number
KR100558143B1
KR100558143B1 KR20030041664A KR20030041664A KR100558143B1 KR 100558143 B1 KR100558143 B1 KR 100558143B1 KR 20030041664 A KR20030041664 A KR 20030041664A KR 20030041664 A KR20030041664 A KR 20030041664A KR 100558143 B1 KR100558143 B1 KR 100558143B1
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South Korea
Prior art keywords
wire
ball
melting point
coating material
wire bonding
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KR20030041664A
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Korean (ko)
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KR20040002709A (ko
Inventor
니시우라신이치
사카쿠라미츠아키
미야노후미오
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가부시키가이샤 신가와
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR20030041664A 2002-06-26 2003-06-25 와이어본딩용 와이어의 이니셜 볼 형성방법 및 와이어본딩장치 Expired - Fee Related KR100558143B1 (ko)

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JPJP-P-2002-00186731 2002-06-26
JP2002186731A JP3727615B2 (ja) 2002-06-26 2002-06-26 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置

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KR20040002709A KR20040002709A (ko) 2004-01-07
KR100558143B1 true KR100558143B1 (ko) 2006-03-10

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US (1) US7299966B2 (enExample)
JP (1) JP3727615B2 (enExample)
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TW (1) TW200400574A (enExample)

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US20040000578A1 (en) 2004-01-01
JP2004031686A (ja) 2004-01-29

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