JP3727615B2 - ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置 - Google Patents

ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置 Download PDF

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Publication number
JP3727615B2
JP3727615B2 JP2002186731A JP2002186731A JP3727615B2 JP 3727615 B2 JP3727615 B2 JP 3727615B2 JP 2002186731 A JP2002186731 A JP 2002186731A JP 2002186731 A JP2002186731 A JP 2002186731A JP 3727615 B2 JP3727615 B2 JP 3727615B2
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JP
Japan
Prior art keywords
wire
ball
bonding
copper
initial ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002186731A
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English (en)
Japanese (ja)
Other versions
JP2004031686A (ja
Inventor
信一 西浦
光昭 坂倉
文男 宮野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
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Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2002186731A priority Critical patent/JP3727615B2/ja
Priority to TW92113799A priority patent/TW200400574A/zh
Priority to US10/462,928 priority patent/US7299966B2/en
Priority to KR20030041664A priority patent/KR100558143B1/ko
Publication of JP2004031686A publication Critical patent/JP2004031686A/ja
Application granted granted Critical
Publication of JP3727615B2 publication Critical patent/JP3727615B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H10W72/071—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/07511—
    • H10W72/07533—
    • H10W72/07541—
    • H10W72/536—
    • H10W72/5522—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/952—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2002186731A 2002-06-26 2002-06-26 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置 Expired - Fee Related JP3727615B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002186731A JP3727615B2 (ja) 2002-06-26 2002-06-26 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置
TW92113799A TW200400574A (en) 2002-06-26 2003-05-22 Initial ball forming method of wire bonding lead and wire bonding apparatus
US10/462,928 US7299966B2 (en) 2002-06-26 2003-06-17 Initial ball forming method for wire bonding wire and wire bonding apparatus
KR20030041664A KR100558143B1 (ko) 2002-06-26 2003-06-25 와이어본딩용 와이어의 이니셜 볼 형성방법 및 와이어본딩장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002186731A JP3727615B2 (ja) 2002-06-26 2002-06-26 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JP2004031686A JP2004031686A (ja) 2004-01-29
JP3727615B2 true JP3727615B2 (ja) 2005-12-14

Family

ID=29774144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002186731A Expired - Fee Related JP3727615B2 (ja) 2002-06-26 2002-06-26 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置

Country Status (4)

Country Link
US (1) US7299966B2 (enExample)
JP (1) JP3727615B2 (enExample)
KR (1) KR100558143B1 (enExample)
TW (1) TW200400574A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3727615B2 (ja) * 2002-06-26 2005-12-14 株式会社新川 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置
JP3704328B2 (ja) * 2002-06-26 2005-10-12 株式会社新川 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置
CN1328774C (zh) * 2005-01-12 2007-07-25 哈尔滨工业大学 双电热丝熔切法锡球制备机
SG137756A1 (en) * 2006-05-09 2007-12-28 Asm Tech Singapore Pte Ltd Wire bonding process for insulated wires
US20080185737A1 (en) * 2007-02-02 2008-08-07 Pandi Chelvam Marimuthu Integrated circuit system with pre-configured bond wire ball
AT507228B1 (de) * 2008-07-30 2010-08-15 Fronius Int Gmbh Verfahren und vorrichtung zur formung des schweissdrahtendes
JP5077278B2 (ja) * 2009-04-06 2012-11-21 株式会社デンソー ワイヤボンディング方法
CN102569111A (zh) * 2011-12-27 2012-07-11 三星半导体(中国)研究开发有限公司 用于引线键合的压板
JP2018046242A (ja) 2016-09-16 2018-03-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN119016828A (zh) * 2023-05-26 2024-11-26 长江存储科技有限责任公司 引线键合装置、引线键合方法及半导体器件

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4814855A (en) * 1986-04-29 1989-03-21 International Business Machines Corporation Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
US5152450A (en) * 1987-01-26 1992-10-06 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method
EP0276928B1 (en) * 1987-01-26 1994-10-26 Hitachi, Ltd. Wire Bonding
US5285949A (en) * 1987-01-26 1994-02-15 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
US5176310A (en) * 1988-11-28 1993-01-05 Hitachi, Ltd. Method and apparatus for wire bond
JP3055285B2 (ja) * 1992-01-29 2000-06-26 松下電器産業株式会社 中間基材のボンディング方法
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
JP2551370B2 (ja) * 1993-12-27 1996-11-06 日本電気株式会社 半導体チップの実装方法
JPH08107123A (ja) 1994-10-04 1996-04-23 Hitachi Ltd 半導体集積回路装置の製造方法、その製造装置および半導体集積回路装置
JP3558449B2 (ja) * 1996-06-10 2004-08-25 松下電器産業株式会社 電子部品構体
JP3455126B2 (ja) * 1999-03-02 2003-10-14 株式会社新川 ワイヤボンデイング方法
JP2002064117A (ja) * 2000-08-22 2002-02-28 Mitsubishi Electric Corp ワイヤボンディング方法、ワイヤボンディング装置および半導体装置
JP2003163235A (ja) * 2001-11-29 2003-06-06 Shinkawa Ltd ワイヤボンディング装置
JP3704328B2 (ja) * 2002-06-26 2005-10-12 株式会社新川 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置
JP3727615B2 (ja) * 2002-06-26 2005-12-14 株式会社新川 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置

Also Published As

Publication number Publication date
TW200400574A (en) 2004-01-01
TWI293487B (enExample) 2008-02-11
KR100558143B1 (ko) 2006-03-10
US7299966B2 (en) 2007-11-27
KR20040002709A (ko) 2004-01-07
US20040000578A1 (en) 2004-01-01
JP2004031686A (ja) 2004-01-29

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