JP3727615B2 - ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置 - Google Patents

ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置 Download PDF

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Publication number
JP3727615B2
JP3727615B2 JP2002186731A JP2002186731A JP3727615B2 JP 3727615 B2 JP3727615 B2 JP 3727615B2 JP 2002186731 A JP2002186731 A JP 2002186731A JP 2002186731 A JP2002186731 A JP 2002186731A JP 3727615 B2 JP3727615 B2 JP 3727615B2
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Prior art keywords
wire
ball
bonding
copper
initial ball
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Expired - Fee Related
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JP2002186731A
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Japanese (ja)
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JP2004031686A (ja
Inventor
信一 西浦
光昭 坂倉
文男 宮野
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Shinkawa Ltd
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Shinkawa Ltd
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Priority to JP2002186731A priority Critical patent/JP3727615B2/ja
Priority to TW92113799A priority patent/TW200400574A/zh
Priority to US10/462,928 priority patent/US7299966B2/en
Priority to KR20030041664A priority patent/KR100558143B1/ko
Publication of JP2004031686A publication Critical patent/JP2004031686A/ja
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Publication of JP3727615B2 publication Critical patent/JP3727615B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2002186731A 2002-06-26 2002-06-26 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置 Expired - Fee Related JP3727615B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002186731A JP3727615B2 (ja) 2002-06-26 2002-06-26 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置
TW92113799A TW200400574A (en) 2002-06-26 2003-05-22 Initial ball forming method of wire bonding lead and wire bonding apparatus
US10/462,928 US7299966B2 (en) 2002-06-26 2003-06-17 Initial ball forming method for wire bonding wire and wire bonding apparatus
KR20030041664A KR100558143B1 (ko) 2002-06-26 2003-06-25 와이어본딩용 와이어의 이니셜 볼 형성방법 및 와이어본딩장치

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Application Number Priority Date Filing Date Title
JP2002186731A JP3727615B2 (ja) 2002-06-26 2002-06-26 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置

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JP2004031686A JP2004031686A (ja) 2004-01-29
JP3727615B2 true JP3727615B2 (ja) 2005-12-14

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JP3704328B2 (ja) * 2002-06-26 2005-10-12 株式会社新川 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置
CN1328774C (zh) * 2005-01-12 2007-07-25 哈尔滨工业大学 双电热丝熔切法锡球制备机
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TWI293487B (enExample) 2008-02-11
US20040000578A1 (en) 2004-01-01
JP2004031686A (ja) 2004-01-29

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