TWI293487B - - Google Patents

Download PDF

Info

Publication number
TWI293487B
TWI293487B TW92113799A TW92113799A TWI293487B TW I293487 B TWI293487 B TW I293487B TW 92113799 A TW92113799 A TW 92113799A TW 92113799 A TW92113799 A TW 92113799A TW I293487 B TWI293487 B TW I293487B
Authority
TW
Taiwan
Prior art keywords
wire
lead
patent application
starting ball
discharge
Prior art date
Application number
TW92113799A
Other languages
English (en)
Chinese (zh)
Other versions
TW200400574A (en
Inventor
Shinichi Nishiura
Fumio Miyano
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200400574A publication Critical patent/TW200400574A/zh
Application granted granted Critical
Publication of TWI293487B publication Critical patent/TWI293487B/zh

Links

Classifications

    • H10W72/071—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/07511—
    • H10W72/07533—
    • H10W72/07541—
    • H10W72/536—
    • H10W72/5522—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/952—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
TW92113799A 2002-06-26 2003-05-22 Initial ball forming method of wire bonding lead and wire bonding apparatus TW200400574A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002186731A JP3727615B2 (ja) 2002-06-26 2002-06-26 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置

Publications (2)

Publication Number Publication Date
TW200400574A TW200400574A (en) 2004-01-01
TWI293487B true TWI293487B (enExample) 2008-02-11

Family

ID=29774144

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92113799A TW200400574A (en) 2002-06-26 2003-05-22 Initial ball forming method of wire bonding lead and wire bonding apparatus

Country Status (4)

Country Link
US (1) US7299966B2 (enExample)
JP (1) JP3727615B2 (enExample)
KR (1) KR100558143B1 (enExample)
TW (1) TW200400574A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3727615B2 (ja) * 2002-06-26 2005-12-14 株式会社新川 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置
JP3704328B2 (ja) * 2002-06-26 2005-10-12 株式会社新川 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置
CN1328774C (zh) * 2005-01-12 2007-07-25 哈尔滨工业大学 双电热丝熔切法锡球制备机
SG137756A1 (en) * 2006-05-09 2007-12-28 Asm Tech Singapore Pte Ltd Wire bonding process for insulated wires
US20080185737A1 (en) * 2007-02-02 2008-08-07 Pandi Chelvam Marimuthu Integrated circuit system with pre-configured bond wire ball
AT507228B1 (de) * 2008-07-30 2010-08-15 Fronius Int Gmbh Verfahren und vorrichtung zur formung des schweissdrahtendes
JP5077278B2 (ja) * 2009-04-06 2012-11-21 株式会社デンソー ワイヤボンディング方法
CN102569111A (zh) * 2011-12-27 2012-07-11 三星半导体(中国)研究开发有限公司 用于引线键合的压板
JP2018046242A (ja) 2016-09-16 2018-03-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN119016828A (zh) * 2023-05-26 2024-11-26 长江存储科技有限责任公司 引线键合装置、引线键合方法及半导体器件

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4814855A (en) * 1986-04-29 1989-03-21 International Business Machines Corporation Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
US5152450A (en) * 1987-01-26 1992-10-06 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method
EP0276928B1 (en) * 1987-01-26 1994-10-26 Hitachi, Ltd. Wire Bonding
US5285949A (en) * 1987-01-26 1994-02-15 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
US5176310A (en) * 1988-11-28 1993-01-05 Hitachi, Ltd. Method and apparatus for wire bond
JP3055285B2 (ja) * 1992-01-29 2000-06-26 松下電器産業株式会社 中間基材のボンディング方法
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
JP2551370B2 (ja) * 1993-12-27 1996-11-06 日本電気株式会社 半導体チップの実装方法
JPH08107123A (ja) 1994-10-04 1996-04-23 Hitachi Ltd 半導体集積回路装置の製造方法、その製造装置および半導体集積回路装置
JP3558449B2 (ja) * 1996-06-10 2004-08-25 松下電器産業株式会社 電子部品構体
JP3455126B2 (ja) * 1999-03-02 2003-10-14 株式会社新川 ワイヤボンデイング方法
JP2002064117A (ja) * 2000-08-22 2002-02-28 Mitsubishi Electric Corp ワイヤボンディング方法、ワイヤボンディング装置および半導体装置
JP2003163235A (ja) * 2001-11-29 2003-06-06 Shinkawa Ltd ワイヤボンディング装置
JP3704328B2 (ja) * 2002-06-26 2005-10-12 株式会社新川 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置
JP3727615B2 (ja) * 2002-06-26 2005-12-14 株式会社新川 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置

Also Published As

Publication number Publication date
TW200400574A (en) 2004-01-01
JP3727615B2 (ja) 2005-12-14
KR100558143B1 (ko) 2006-03-10
US7299966B2 (en) 2007-11-27
KR20040002709A (ko) 2004-01-07
US20040000578A1 (en) 2004-01-01
JP2004031686A (ja) 2004-01-29

Similar Documents

Publication Publication Date Title
US4717066A (en) Method of bonding conductors to semiconductor devices
JP2003197669A (ja) ボンディング方法及びボンディング装置
TWI293487B (enExample)
JP6854810B2 (ja) 半導体装置
TWI376776B (en) Wirebonding insulated wire and capillary therefor
TWI269391B (en) Initial ball forming method of wire bonding lead and wire bonding apparatus
TW200416915A (en) Wirebonding insulated wire
CN101800205B (zh) 半导体封装构造及其封装方法
JP2003031606A (ja) 金線ボンディング方法、装置、及びシステム
EP1367644A1 (en) Semiconductor electronic device and method of manufacturing thereof
US10978415B2 (en) Semiconductor package having magnetic interconnects and related methods
CN101419926A (zh) 一种薄型非接触模块封装的焊接方法
JPH10261664A (ja) 半導体素子、突起電極の形成方法およびワイヤボンディング方法
CN101969033A (zh) 将导线电连接至集成电路芯片的焊盘的方法及电子器件
JPH07283221A (ja) バンプの形成方法
JP2018195673A (ja) バンプ及びその形成方法、並びに基板
JP2001237365A (ja) 接続用端子の接合方法、半導体装置の製造方法および半導体装置
JP2737137B2 (ja) 半導体素子ボンディング用絶縁被覆金または金合金極細線
US20140096998A1 (en) Electrical Contact Pad
Gurbinder et al. Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding
JPH10261645A (ja) 半導体素子、突起電極の形成方法およびワイヤボンディング方法
TW389964B (en) Method for forming projected electrode and ultrasonic junction apparatus
JPH02288345A (ja) ワイヤボンディング方法
JPH0590355A (ja) ワイヤボンデイング方法及び装置
JPH10199913A (ja) ワイヤボンディング方法