CN1430253A - 焊接方法以及焊接装置 - Google Patents

焊接方法以及焊接装置 Download PDF

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Publication number
CN1430253A
CN1430253A CN02160454A CN02160454A CN1430253A CN 1430253 A CN1430253 A CN 1430253A CN 02160454 A CN02160454 A CN 02160454A CN 02160454 A CN02160454 A CN 02160454A CN 1430253 A CN1430253 A CN 1430253A
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China
Prior art keywords
wire
instrument
lead
electrode
technology
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CN02160454A
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三上邦光
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Seiko Epson Corp
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Seiko Epson Corp
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
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Abstract

本发明提供一种焊接方法以及焊接装置。其目的是在提高半导体装置的可靠性的同时，可以进行保证恒定质量的焊接。引线(20)穿过第1工具(30)被送出到外部的引线(20)的前端部(22)成形为球状。通过第1工具(30)将前端部(22)焊接在第1电极(12)上。将引线(20)从第1工具(30)引出，通过第1工具(30)将引线(20)的一部(24)焊接在第2电极(16)上。由配置在第1工具(30)的上方的第2工具(32)夹持引线(20)，让一部(24)残留在第2电极(16)上扯断引线(20)。在夹持引线(20)的状态下让第2工具(32)相对接近第1工具(30)，将引线(20)从第1T具(30)送出到外部。

Description

焊接方法以及焊接装置
技术领域
本发明涉及一种焊接方法以及焊接装置。
背景技术
在半导体装置的制造中，进行将半导体芯片的焊盘和引脚电连接的引线焊接工艺。在该工艺中，从毛细管引出到外部的引线的前端部由焊炬形成球状，将该球焊接在焊盘上，引出该引线并焊接在引脚上。
然后，从毛细管将给定长度的引线引出到外部，然后将引线切断。详细讲，在将引线连接在引脚上的状态下，开放夹住引线的夹具，让夹具和毛细管同时上升，从毛细管将给定长度的引线引出到外部，然后将引线切断。
但是，依据该工艺，在上升过程中，毛细管和引线摩擦，有可能出现引线在达到给定长度之前就被切断的情况。这样，对于每次焊接工艺，焊炬与引线的前端部之间的距离都要改变，引线的前端部的球的大小不均匀，会出现不能保证焊接质量的情况。此外，这样的问题，例如在采用球块法形成凸块的工艺中也会产生。
发明内容
本发明的目的在于进行在提高半导体装置的可靠性的同时可以保证恒定的质量的焊接。
(1)有关本发明的焊接方法包括将从引线穿过的第1工具送出到外部的上述引线的前端部成形为球状的工艺、
由上述第1工具将上述前端部焊接在第1电极上的工艺、
从上述第1工具中引出上述引线、由上述第1工具将上述引线的一部焊接在第2电极上的工艺、
由配置在上述第1工具的上方的第2工具夹持上述引线、让上述一部残留在上述第2电极上的状态下扯断上述引线的工艺、
在夹持上述引线的状态下让上述第2工具相对接近上述第1工具、将上述引线从上述第1工具送出到外部的工艺。
依据本发明，在扯断引线之后，通过让第1和第2工具相对移动，将引线从第1工具中送出到外部。为此，即使引线在第1工具上摩擦，也可以将引线以恒定的长度确切地从第1工具送出到外部。即，在成形为球状的工艺中，可以每次将引线的前端部配置在确定的位置上。因此，可以让引线的前端部的球为恒定大小，提高了产品的可靠性并恒定保持其质量。
(2)在该焊接方法中，也可以重复上述各工艺，将多个上述第1电极以及多个上述第2电极采用上述引线电连接。
(3)在该焊接方法中，也可以是上述第1电极是半导体芯片的焊盘，上述第2电极是引脚片的内部引脚。
(4)在该焊接方法中，也可以是上述第1电极是引脚片的内部引脚，上述第2电极是半导体芯片的焊盘。
(5)有关本发明的焊接方法包括：
将从引线穿过的第1工具送出到外部的上述引线的前端部成形为球状的工艺、
由上述第1工具将上述前端部焊接在电极上的工艺、
由配置在上述第1工具的上方的第2工具夹持上述引线、让上述前端部残留在上述电极上的状态下扯断上述引线的工艺、
在夹持上述引线的状态下让上述第2工具相对接近上述第1工具、将上述引线从上述第1工具送出到外部的工艺。
依据本发明，在扯断引线之后，通过让第1和第2工具相对移动，将引线从第1工具中送出到外部。为此，即使引线在第1工具上摩擦，也可以将引线以一定的长度确切地从第1工具送出到外部。即，在成形为球状的工艺中，可以每次将引线的前端部配置在确定的位置上。因此，可以让引线的前端部的球为恒定大小，提高了产品的可靠性并恒定保持其质量。
(6)在该焊接方法中，也可以是利用残留在上述电极上的上述引线的上述前端部形成凸块。
(7)在该焊接方法中，也可以是上述电极是半导体晶圆的焊盘。
(8)在该焊接方法中，也可以是在扯断上述引线的工艺中，不将上述引线从上述第1工具引出到外部，在上述第1工具的端部附近进行扯断。
这样，由于可以在恒定位置上扯断引线，可以简单将恒定长度的引线从第1工具送出到外部。
(9)在该焊接方法中，也可以是在扯断上述引线的工艺中，通过让上述第1和第2工具同时上升，将上述引线扯断。
这样，可以简单扯断引线。
(10)在该焊接方法中，也可以是在送出上述引线的工艺中，通过让第2工具下降，将上述引线送出。
这样，可以简单将引线从第1工具送出到外部。
(11)有关本发明的焊接装置包括引线穿过的第1工具、配置在上述第1工具的上方、可以夹持上述引线、能相对于上述第1工具相对移动的第2工具，
在夹持上述引线的状态下通过让上述第2工具相对接近上述第1工具、将上述引线从上述第1工具送出到外部。
依据本发明，通过让第1和第2工具相对移动，将引线从第1工具中送出到外部。为此，即使引线在第1工具上摩擦，也可以将引线以恒定的长度确切地从第1工具送出到外部。这样，例如在成形为球状的工艺中，可以每次将引线的前端部配置在确定的位置上。因此，可以让引线的前端部的球为恒定大小，提高了产品的可靠性并恒定保持其质量。
(12)在该焊接装置中，也可以是将由上述第1工具送出到外部同时形成为球状的上述引线的前端部焊接在第1电极上，将上述引线从上述第1工具中引出，将上述引线的一部焊接在第2电极上，
由上述第2工具夹持上述引线，在让上述一部残留在上述第2电极上的状态下扯断上述引线。
(13)在该焊接装置中，也可以是多个上述第1电极以及多个上述第2电极采用上述引线电连接。
(14)在该焊接装置中，也可以是将由上述第1工具送出到外部同时形成为球状的上述引线的前端部焊接在电极上，
由上述第2工具夹持上述引线，在让上述前端部残留在上述电极上的状态下扯断上述引线。
(15)在该焊接装置中，也可以是利用残留在上述电极上的上述引线的上述前端部形成凸块。
(16)在该焊接装置中，也可以是利用第2工具，不将上述引线从上述第1工具引出到外部，在上述第1工具的端部附近进行扯断。
这样，由于可以在恒定位置上扯断引线，可以简单将恒定长度的引线从第1工具送出到外部。
(17)在该焊接装置中，也可以是通过让上述第1和第2工具同时上升，将上述引线扯断。
这样，可以简单扯断引线。
(18)在该焊接装置中，也可以是通过让第2工具下降，将上述引线送出。
这样，可以简单将引线从第1工具送出到外部。
附图说明
图1A～图1C是表示有关本发明第1实施方式的半导体装置的制造方法以及制造装置的图。
图2A以及图2B是表示有关本发明第1实施方式的半导体装置的制造方法以及制造装置的图。
图3是表示有关本发明第1实施方式的半导体装置的图。
图4A以及图4B是表示有关本发明第2实施方式的半导体装置的制造方法以及制造装置的图。
图5A以及图5B是表示有关本发明第2实施方式的半导体装置的制造方法以及制造装置的图。
图6是表示有关本发明第2实施方式的半导体装置的图。
图7是表示有关本发明实施方式的电子仪器的图。
图8是表示有关本发明实施方式的电子仪器的图。
具体实施方式
以下参照附图说明本发明的实施方式。本发明包括以下实施方式中的半导体装置的制造方法以及制造装置。但是，本发明并不限定于以下的实施方式，也可以适用于其它电子装置的制造方法以及制造装置。
(第1实施方式)
图1A～图2B是表示有关本发明第1实施方式的半导体装置的制造方法以及制造装置(又称为引线焊接方法以及引线焊接装置)的图。
首先，如图1A所示，准备形成了多个焊盘12的半导体芯片10和多个引脚14。
半导体芯片10具有形成了集成电路的面(能动面)。集成电路在成为直方体的半导体芯片10的最大面积的面上形成。焊盘12多在半导体芯片10的形成了集成电路的面的侧边上形成。焊盘12由铝系或者铜系金属形成，多在半导体芯片10上形成为平坦薄层。又，在半导体芯片10上，在焊盘12之外也形成钝化膜(图中未画出)。钝化膜，例如可以采用SiO2、SiN或者聚酰亚胺树脂等形成。
引脚14，如图1A所示，也可以不被其他部件支撑，而成为自由端。引脚14配置在半导体芯片10的外侧。引脚14也可以是引脚框(图中未画出)的一部分。详细讲，引脚14包括内部引脚16和外部引脚(图中未画出)，内部引脚16面向半导体芯片10配置。
或者，引脚14也可以被支撑在图中未画出的衬底上。即，引脚14也可以是在衬底上形成的布线。布线包括与半导体芯片10的电连接部(例如连接盘)。半导体芯片10搭载在衬底中形成了布线的面上，电连接部配置在半导体芯片10的外侧。
在本实施方式中，上述半导体芯片10以及引脚14之间用引线20连接。详细讲，使用图1A所示的制造装置，对半导体芯片10的焊盘12和引脚14的内部引脚16进行引线焊接。
有关本实施方式的制造装置，包括第1和第2工具30、32。在本实施方式中，第1工具30为毛细管，第2工具32为夹具。第1和第2工具30、32可以在三维方向上移动。详细讲，第1和第2工具30、32在与半导体芯片10的焊接面(焊盘12形成的面)平行的面上沿相互垂直的XY轴(图1A的左右方向的轴以及与纸面垂直方向的轴)可以移动，在与焊接面垂直的Z轴(图1A上下方向的轴)可以移动。第1和第2工具30、32也可以沿XYZ轴整体移动(两者之间的距离保持恒定)。
第1工具30包括在其轴方向上引线20可以插通的导引部。在图1A所示的例中，导引部为孔。第1工具30的孔比引线20的线径大，引线20穿过该孔的内侧。又，第1工具30包括按压引线20的前端部22的按压部31。在图1A所示的例中，按压部31构成引线20穿通的孔的开口端部。此外，第1工具30由图中未画出的支撑体(例如超声波喇叭形)制成在图中未画出的制造装置的本体(引线焊接机)上。
第2工具32具有装载引线20的功能。详细讲，第2工具32固定引线20不让其在与半导体芯片10的焊接面垂直的Z轴上移动。在本实施方式中，第2工具32通过从引线20的两侧关闭夹持引线20。第2工具32配置在第1工具30的上方，即与第1工具30的按压部31相反侧上。第2工具32沿与半导体芯片10的焊接面垂直的轴可以相对于第1工具30移动。即，可以是只有第1工具30沿Z轴移动，也可以是只有第2工具32沿Z轴移动，或者也可以是第1和第2工具30、32以相互不同的方向以及速度沿Z轴移动。这时，第2工具32可以按关闭状态或者打开状态的任一个进行移动。
有关本实施方式的制造装置包括给引线20施加与半导体芯片10侧相反方向的拉力的第3工具34(例如空气拉力)。第3工具34配置在第2工具32的上方，即第2工具32中与第1工具30的相反侧上。第3工具34，如图1A所示，也可以具有由孔气向引线20施加拉力的功能。这样，容易控制焊接的重量，又，容易将引线20环绕成给定形状。或者，第3工具34也可以通过卷绕引线20施加拉力。第3工具34可以与第1和第2工具30、32一起沿XYZ轴移动，也可以只沿XY轴移动。
有关本实施方式的制造装置包括焊炬36。焊炬36让引线20中位于第1工具30的外部、即位于按压部31的下方的前端部22成为球状。焊炬36由放电能量或者气体火焰等热能将前端部22融化，形成为球状。此外，球状的前端部22只要是成为块状，其形状没有多大关系。
有关本实施方式的制造装置如上述那样构成，以下说明半导体装置的制造方法。此外，以下方法的特定事项包括从上述内容中可以适用于方法中的内容。
首先，如图1A所示，在半导体芯片10中形成了焊盘12的面一侧上配置第1工具30。在第1工具30中穿过引线20。引线20由金等导电材料形成。引线20的前端部22配置在第1工具30的外部。然后，在第1工具30的上方配置第2和第3工具32、34。第3工具34对引线20施加拉力。在本实施方式中，第3工具34与第1和第2工具30、32一起沿与半导体芯片10的焊接面平行的面上的XY轴移动。
然后，将引线20的前端部22成形为球状。如图1A所示，让焊炬36接近引线20的前端部22。当焊炬36为电焊炬时，通过高压放电，让引线20的前端部22溶化，成形为球状。这时，为了成形为恒定大小的球，优选焊炬36的前端部和引线20的前端部22之间的距离每次都相同。依据本实施方式，如后面所述，在成形为球状时，引线20的前端部22可以每次配置在相同的位置上。此外，在本工艺中，第2工具32，如图1A所示，可以是以开放状态让引线20开放，也可以是以关闭状态夹持引线20。
如图1B所示，将引线20的前端部22配置任一个焊盘12的上方，让第1工具30下降，由按压部31将前端部22按压在焊盘12上。在以恒定压力将前端部22按压在焊盘12上的期间，对其施加超声波或者热等。如图1B所示，第2工具32处于开放状态时，也可以让第1和第2工具30、32整体下降。当第2工具32处于关闭状态时，让按压部31接触在引线20的前端部22上，让第1工具30比第2工具32更下降。
如图1B所示，在本实施方式中，在半导体芯片10的焊盘12(第1电极)焊接，然后在引脚14的内部引脚16(第2电极)上焊接。
如图1B以及图1C所示，将第1工具30从焊盘12移动到内部引脚16上时，引线20在其前端部22焊接在焊盘12上的状态下向内部引脚16的方向引出。在引出引线20时，第2工具32处于开放状态，让引线20开放。第1～第3工具30、32、34也可以整体移动。引线20也可以成三维环状。然后，在内部引脚16上焊接引线20的一部24。详细讲，让第1工具30下降到内部引脚16上，由按压部31将引线20的一部24按压在内部引脚16上。在以一定的压力将引线20的一部24按压在内部引脚16上的期间，对其施加超声波或者热等。
然后，如图1C～图2B所示，进行扯断引线20的工艺、和将引线20从第1工具30送出到外部的工艺。
如图1C以及图2A所示，在焊接后，关闭第2工具32在夹持引线20的状态下让第2工具32上升。然后，留下焊接在内部引脚16上的一部24，扯断引线20。这时，如图2A所示，引线20也可以不从第1工具30引出到外部，在第1工具30的按压部31附近扯断。这样，可以在同样的位置上扯断引线20。因此，可以简单将恒定长度的引线20从第1工具30送出到外部。
如图2A所示，在扯断引线20的工艺中，第1和第2工具30、32也可以同时上升。这时，第1和第2工具30、32整体上升(让两者之间的距离保持一定的状态)。这样，可以整体控制第1和第2工具30、32，以简单的工艺就可以将引线20扯断。
然后，如图2A以及图2B所示，让第1和第2工具30、32上升后，在关闭第2工具32的状态下(夹持引线20的状态)，让第2工具32相对接近第1工具30。这时，如图2A所示，可以让第2工具32下降。或者，也可以让第1工具30上升，或者让第1和第2工具30、32两者一方上升而另一方下降。然后，如图2B所示，引线20被送出到第1工具30的外部。当不将引线20从第1工具30引出到外部就进行扯断时，例如可以将与第2工具30下降的距离相同长度的引线20从第1工具30送出到外部。因此，可以正确设定引线20中从第1工具30送出到外部的这一部分的长度。
这样，如图2B所示，引线20的前端部可以从第1工具30送出到外部。第1和第2工具30、32之间的距离比将引线20的一部24焊接在内部引脚16上时要小。
需要引线焊接的1对焊盘12以及引脚14为多个时，针对多个焊盘12以及引脚14重复进行以上的工艺。即，图2B所示的从第1工具30送出到外部的引线20的前端部，如图1A所示，再次成形为球状后焊接在其它焊盘12上。这时，在下一引线焊接工艺中，将引线20再次从第1工具30送出到外部，在引线焊接开始时或者中途中，优选让第1和第2工具30、32相互相隔一定距离。
依据本实施方式，在扯断引线20之后，通过让第1和第2工具30、32相对移动，将引线20从第1工具30中送出到外部。为此，即使引线20在第1工具30上摩擦，可以将引线20以恒定的长度确切地从第1工具30送出到外部。即，在成形为球状的工艺中，可以每次将引线20的前端部22配置在确定的位置上。因此，可以让引线20的前端部22的球为恒定大小，提供一种提高了产品的可靠性并恒定保持质量的制造方法以及制造装置。
作为本实施方式的变形例，也可以先焊接引脚14的内部引脚16(第1电极)，然后，焊接半导体芯片10的焊盘12(第2电极)。即，也可以将引线20的成形为球状的前端部22焊接在内部引脚16上。这时，在焊盘12上预先形成凸块，优选通过凸块将引线20的一部二次焊接。这样做，可以不损坏薄焊盘12，而将引线20和焊盘12进行电连接。此外，在本变形例中，可以达到上述效果。
图3表示使用上述方法制造的半导体装置的一例。在图3中，半导体装置被安装在电路板上。
半导体装置1包括半导体芯片10、引脚14、将半导体芯片10和引脚14电连接的引线20、至少密封半导体芯片10的密封部46。在图3所示的例中，半导体芯片10面朝上安装在芯片安装板40上。又，芯片安装板40中与半导体芯片10相反一侧设置散热片42。散热片42从密封部46中露出一部分，这样可以提高半导体芯片10的散热性能。引脚14包括内部引脚16和外部引脚18，外部引脚18在密封部46的外侧凸出，并弯曲成给定形状(图3中为海鸥展翅形状)。此外，优选在外部引脚18上采用电镀法设置焊料等金属皮膜44。
在图3中，半导体装置1安装在电路板50上。电路板50一般采用例如环氧树脂玻璃衬底等有机衬底。在电路板50上由铜等形成的布线图形52形成所要求的电路，将布线图形52与半导体装置的外部引脚18连接。又，在电路板50上，设置散热部件54，散热部件54与半导体装置的散热片42的露出面连接。这样，在半导体芯片10中所产生的热，可以通过散热片42，从散热部件54散出。
(第2实施方式)
图4A～图5B是表示有关本发明第2实施方式的半导体装置的制造方法以及制造装置(又称为凸块形成方法以及凸块形成用装置)的图。在本实施方式中，可以使用上述实施方式中说明的半导体装置的制造装置。此外，在本实施方式中，可以选择适用上述实施方式中说明的内容中的任一个。
首先，如图1A所示，准备好半导体晶圆60。半导体晶圆60包括形成了集成电路的面(能动面)。然后，在半导体晶圆60的形成了集成电路的面一侧上形成多个焊盘62。又，在半导体晶圆60上在焊盘62之外也可以形成钝化膜(图中未画出)。在本实施方式中，凸块形成过程在晶圆状态下一齐处理。或者，作为变形例，也可以在芯片状态下进行凸块形成处理。
首先，如图4A所示，在半导体晶圆60中形成了焊盘62的面的一侧配置第1工具30。在第1工具30中穿过引线20，引线20的前端部22配置在第1工具30的外部。在第1工具30的上方配置第2以及第3工具32、34。
第1到第3工具30、32、34的方式(包括移动方式)，可以选择适用第1实施方式中说明的内容的任一个。
如图4A所示，引线20的前端部22成形为球状。成形为球状的方法可以适用上述内容。
然后，如图4B所示，让引线20的前端部22位于任一个焊盘62的上方，让第1工具30下降，由按压部31将前端部22按压在焊盘62上。在本实施方式中，在半导体晶圆60的多个焊盘62(电极)的每一个上形成有凸块64(参照图5A)。
然后，如图4B～图5B所示，进行扯断引线20的工艺、和将引线20从第1工具30送出到外部的工艺。
如图4B以及图5A所示，在焊接后，关闭第2工具32在夹持引线20的状态下让第2工具32上升。然后，留下焊接在焊盘62上的前端部22，扯断引线20。这时，如图5A所示，引线20也可以不从第1工具30引出到外部，在第1工具30的按压部3 1附近扯断。即，在从前端部22导引的颈部扯断引线20。因此，可以简单将恒定长度的引线20从第1工具30送出到外部。
如图5A所示，在扯断引线20的工艺中，第1和第2工具30、32也可以同时上升。这时，第1和第2工具30、32整体上升(让两者之间的距离保持恒定的状态)。这样，可以整体控制第1和第2工具30、32，以简单的工艺就可以将引线20扯断。
然后，如图5A以及图5B所示，让第1和第2工具30、32上升后，在关闭第2工具32的状态下(夹持引线20的状态)，让第2工具32相对接近第1工具30。这时，如图5A所示，可以让第2工具32下降。或者，也可以让第1工具30上升，或者让第1和第2工具30、32两者一方上升而另一方下降。然后，如图5B所示，引线20从第1工具30送出到外部。当不将引线20从第1工具30引出到外部就进行扯断时，例如可以将与第2工具32下降的距离相同长度的引线20从第1工具30送出到外部。因此，可以正确设定引线20中从第1工具30送出到外部的这一部分的长度。
这样，如图5B所示，引线20的前端部可以从第1工具30送出到外部。第1和第2工具30、32之间的距离比将引线20的一部24焊接在内部引脚16上时要小。
需要形成凸块的焊盘62为多个时，针对多个焊盘62重复进行以上的工艺。这时，在下一凸块形成工艺中，将引线20再次从第1工具30送出到外部，在凸块形成工艺开始时或者中途中，优选让第1和第2工具30、32相互相隔一定距离。
根据需要，也可以对在半导体晶圆60上形成的多个凸块64进行平整。这样，可以减少凸块64的高度不均匀。然后，对半导体晶圆60进行切割工艺等给定工艺，对半导体晶圆60上的各个半导体芯片66进行个片化。
此外，在本实施方式中，也可以获得第1实施方式中说明的效果。
图6表示使用上述方法制造的半导体装置的一例。该半导体装置包括半导体芯片66、将半导体芯片66面朝下安装的衬底70。在半导体芯片66上形成多个焊盘62，在焊盘62上形成上述凸块64。在衬底70上形成布线图形72。半导体芯片66，也可以通过粘接材料，搭载在衬底70上。例如，作为粘接材料采用异方性导电材料74时，通过让粘接剂中的导电粒子76介入到凸块64和布线图形72之间，将半导体芯片66和布线图形72电连接。
在衬底70上设置多个外部端子78(例如焊锡球)。外部端子78与布线图形72电连接。例如，外部端子78通过在衬底70上形成的通孔(图中未画出)，也可以设置在搭载半导体芯片66的面相反面上。
然后，作为包括适用了本发明的半导体装置的电子仪器，在图7中示出了笔记本型微机100，在图8中示出了手机电话200。
本发明并不限定于上述实施方式，可以进行各种变形。例如，本发明，包括与实施方式中所说明的构成实质上是相同的构成(例如，功能、方法和结果上相同的构成、或者目的和结果上相同的构成)。又，本发明包括将实施方式中所说明的构成中非本质性的部分替换后的构成。又，本发明包括与实施方式中所说明的构成具有相同作用效果的构成，或者可以达到同一目的的构成。又，本发明包括在实施方式中所说明的构成中添加了公知技术的构成。

Claims (21)

1.一种焊接方法，其特征在于：
包括：
将从引线穿过的第1工具送出到外部的所述引线的前端部成形为球状的工艺、
由所述第1工具将所述前端部焊接在第1电极上的工艺、
从所述第1工具中引出所述引线、由所述第1工具将所述引线的一部焊接在第2电极上的工艺、
由配置在所述第1工具的上方的第2工具夹持所述引线、让所述一部残留在所述第2电极上的状态下扯断所述引线的工艺、以及
在夹持所述引线的状态下让所述第2工具相对接近所述第1工具、将所述引线从所述第1工具送出到外部的工艺。
2.根据权利要求1所述的焊接方法，其特征在于：
重复所述各工艺，将多个所述第1电极以及多个所述第2电极采用所述引线电连接。
3.根据权利要求1或2所述的焊接方法，其特征在于：
所述第1电极是半导体芯片的焊盘，
所述第2电极是引脚片的内部引脚。
4.根据权利要求1或2所述的焊接方法，其特征在于：
所述第1电极是引脚片的内部引脚，
所述第2电极是半导体芯片的焊盘。
5.根据权利要求1或2所述的焊接方法，其特征在于：
在扯断所述引线的工艺中，不将所述引线从所述第1工具引出到外部，在所述第1工具的端部附近进行扯断。
6.根据权利要求1或2所述的焊接方法，其特征在于：
在扯断所述引线的工艺中，
通过使所述第1及第2工具同时上升，将所述引线扯断。
7.根据权利要求1或2所述的焊接方法，其特征在于：
在送出所述引线的工艺中，
通过使第2工具下降，将所述引线送出。
8.一种焊接方法，其特征在于：
包括：
将从引线穿过的第1工具送出到外部的所述引线的前端部成形为球状的工艺、
由所述第1工具将所述前端部焊接在电极上的工艺、
由配置在所述第1工具的上方的第2工具夹持所述引线、使所述前端部残留在所述电极上的状态下扯断所述引线的工艺、
在夹持所述引线的状态下使所述第2工具相对接近所述第1工具、将所述引线从所述第1工具送出到外部的工艺。
9.根据权利要求8所述的焊接方法，其特征在于：
利用残留在所述电极上的所述引线的所述前端部形成凸块。
10.根据权利要求8或9所述的焊接方法，其特征在于：
所述电极是半导体晶圆的焊盘。
11.根据权利要求8或9所述的焊接方法，其特征在于：
在扯断所述引线的工艺中，
不将所述引线从所述第1工具引出到外部，在所述第1工具的端部附近进行扯断。
12.根据权利要求8或9所述的焊接方法，其特征在于：
在扯断所述引线的工艺中，
通过使所述第1及第2工具同时上升，将所述引线扯断。
13.根据权利要求8或9所述的焊接方法，其特征在于：
在送出所述引线的工艺中，
通过使第2工具下降，将所述引线送出。
14.一种焊接装置，其特征在于：
包括：
引线穿过的第1工具、
配置在所述第1工具的上方、可以夹持所述引线、能相对于所述第1工具相对移动的第2工具，
在夹持所述引线的状态下通过使所述第2工具相对接近所述第1工具、将所述引线从所述第1工具送出到外部。
15.根据权利要求14所述的焊接装置，其特征在于：
将由所述第1工具送出到外部同时形成为球状的所述引线的前端部焊接在第1电极上，将所述引线从所述第1工具中引出，将所述引线的一部焊接在第2电极上，
由所述第2工具夹持所述引线，在使所述一部残留在所述第2电极上的状态下扯断所述引线。
16.根据权利要求14所述的焊接装置，其特征在于：
多个所述第1电极以及多个所述第2电极采用所述引线电连接。
17.根据权利要求14所述的焊接装置，其特征在于：
将由所述第1工具送出到外部同时形成为球状的所述引线的前端部焊接在电极上，
由所述第2工具夹持所述引线，在使所述前端部残留在所述电极上的状态下扯断所述引线。
18.根据权利要求17所述的焊接装置，其特征在于：
利用残留在所述电极上的所述引线的所述前端部形成凸块。
19.根据权利要求14～18中任一权利要求所述的焊接装置，其特征在于：
利用第2工具，不将所述引线从所述第1工具引出到外部，在所述第1工具的端部附近进行扯断。
20.根据权利要求14～18中任一权利要求所述的焊接装置，其特征在于：
通过使所述第1和第2工具同时上升，将所述引线扯断。
21.根据权利要求14～18中任一权利要求所述的焊接装置，其特征在于：
通过使所述第2工具下降，将所述引线送出。
CN02160454A 2001-12-28 2002-12-30 焊接方法以及焊接装置 Pending CN1430253A (zh)

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