CN100365785C - 用于夹住引线的引线焊接设备和方法 - Google Patents
用于夹住引线的引线焊接设备和方法 Download PDFInfo
- Publication number
- CN100365785C CN100365785C CNB2004100923304A CN200410092330A CN100365785C CN 100365785 C CN100365785 C CN 100365785C CN B2004100923304 A CNB2004100923304 A CN B2004100923304A CN 200410092330 A CN200410092330 A CN 200410092330A CN 100365785 C CN100365785 C CN 100365785C
- Authority
- CN
- China
- Prior art keywords
- wire
- lead
- clamp
- transducer
- wire clamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7865—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/789—Means for monitoring the connection process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/789—Means for monitoring the connection process
- H01L2224/78901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
Abstract
控制器可以接收来自引线焊接监视系统的断线信号和操作线夹以夹住断线。可以包括拉线操作、线尾形成操作和小球形成操作的一系列操作可以自动执行。传感器可以测量引线拉动毛细管的长度和可以在线尾上形成的小球的位置。为了利用传感器信息拉动引线,辅助线夹可以安装在线夹和毛细管之间。
Description
交叉参考相关申请
该申请要求2003年12月23日提出的韩国专利申请第2003-95437号和2004年3月25日提出的韩国专利申请第2004-20400号的优先权,特此全文引用,以供参考。
技术领域
总的来说,本发明涉及引线焊接(wire bonding)设备和方法,尤其涉及当出现断线时能够自恢复的引线焊接设备和自动形成小球(ball)的方法。
背景技术
在半导体封装件组装中,各种方法可以用来将半导体芯片与其它部件电连接在一起。例如,引线焊接、倒装芯片焊接和带式自动焊接(TAB)方法可以用于实现这样的连接。
在这些方法当中,利用例如金线的引线焊接方法可能是众所周知的,它应用在半导体封装件制造技术中。金线可能具有比其它引线材料(例如,像铝线或铜线之类)低的焊接强度。尽管如此,金线的使用可能仍然存在一些相关的优点。例如,与其它引线材料相比,金线可以更抗氧化和抗污染。此外,与其它引线材料相比,金线可能更容易拉伸和形成基本上是球形的小球。
图1例示了传统引线焊接设备50的结构。这里,引线41可以从引线卷轴39提供和通过线夹33插入毛细管32中。毛细管32可以包括换能器31。换能器31可以将超声波发生器(未示出)生成的能量转移给毛细管32。线夹33可以安装在毛细管32上和被配置成夹住引线41。引线焊接监视系统(WBMS)38可以在进行引线焊接处理之前监视引线衬底20和半导体芯片24的位置和排列。WBMS 38还可以在引线焊接期间将电流传输给换能器31和监视该电流。当引线41在引线焊接期间断线时,WBMS 38可以检测到电流值的变化并将断线信息传输给主计算机37。
线夹33可以受主计算机37控制。线夹33可以拥有将引线41夹在中间的一对平板。主计算机37可以管理数个引线焊接设备50。主计算机37可以通过例如像数字-模拟转换器(DAC)那样的通信板35,将控制线夹33的打开和/或闭合的轮廓(profile)传输给驱动器34。来自主计算机37的轮廓可以当作含有数个时间段的控制信号。在每个时间段期间,驱动器34可以打开或闭合线夹33。随着时间段越来越短,轮廓可能越来越精细。但是,由于主计算机37的特性(除了别的以外),难以将时间段的长度缩短到500μs(微秒)或更短。换句话说,利用主计算机37难以在500μs或更短时间内改变线夹33的状态(从打开状态到闭合状态,或反之)。
下面描述利用引线焊接设备50的传统引线焊接处理。引线41在通过气致张力(air tension)单元40保持预定张力的同时,可以从引线卷轴39穿过换能器31和毛细管32。气致张力单元40可以通过将气体42吹过引线41来保持预定张力。高压电火花片(未示出)可以将电致点火(electric frameoff,EFO)生成的火焰作用在引线41的尾部以形成小球。在半导体芯片24的电极焊接区26上可以进行球形焊接处理。可能形成具有预定迹线的环。在布线衬底20的衬底焊接区上可以进行针脚式焊接处理。在球形焊接和针脚式焊接处理期间,通过换能器31可以将超声波能量施加到毛细管32,并可以将热量施加给目标焊接区。
在引线焊接处理期间可能会在引线41中出现故障。例如,在针脚式焊接处理期间,由于可能施加在毛细管32上的过分力或材料跳动(例如),可能不经意将引线41弄断(例如,遭受断裂)。当出现故障时,引线焊接设备50可能停止运行。操作人员可能人工地将引线41的末端重新插入毛细管32中。取决于操作人员的熟练程度(除了别的之外),重新插入操作可能花费许多时间。操作人员的这种人工干预可能导致生产效率下降。
为了努力克服如上所述的缺点,传统上已经实现了具有“自恢复”特征的引线焊接设备。当发生不经意断线时,“自恢复”设备可以自动地形成线尾,然后形成小球,从而无需操作人员干预就可以使引线焊接处理继续下去。尽管一般认为传统“自恢复”设备提供了可接受的性能,但它们也不是没有缺点的。例如,由于主计算机37控制引线焊接设备的线夹的打开和闭合,当发生不经意断线时,线夹33的夹线操作可能失效。具体地说,如果在引线焊接处理期间引线断开了,WBMS 38可能检测到流经换能器31的电流的变化,并且将相应信息传输给主计算机37。然后,WBMS 38可能接收到来自主计算机37的信号以夹住引线41。从发生不经意断线到夹线操作可能花费1,000μs或更长。在这个时间内,引线41可能滑动,并且可能完全从毛细管32中移出。因此,尽管具有“自恢复”特征,操作人员可能仍然需要人工地将引线41的末端重新插入毛细管32中。
并且,与正常引线的尾部相比,断线的尾部可能发生变形。断线的使用可能导致异常球形,从而导致引线焊接故障。
发明内容
示范性的引线焊接设备可以基本上与发生不经意断线同时地进行夹线操作,从而使断线从毛细管中滑出的可能性达到最小。
示范性的小球形成操作可以消除断线的变形末端,以便形成线尾和小球。
在示范性、非限制性的实施例中,引线焊接设备可以包括转移轨,转移轨可以转移含有半导体芯片的布线衬底。引线焊接单元可以被安装成与转移轨相邻和被配置通过引线将半导体芯片和布线衬底电连接。
引线焊接单元可以包括换能器、线夹、引线焊接监视系统和控制器。换能器可以包括接纳引线的毛细管。线夹可与毛细管一起移动。引线焊接监视系统(WBMS)可以监视换能器上的电流。控制器可以控制线夹的打开和闭合。控制器可以对接收到WBMS提供的断线信号作出响应,闭合线夹以夹住断线。
引线焊接设备可以进一步包括预焊接台。预焊接台可以被安装在转移轨上。预焊接台可以处在断线的末端可以从毛细管中移出的位置上。
在示范性、非限制性的实施例中,方法可以涉及对接收到WBMS提供的断线信号作出响应,通过控制器闭合线夹以便可以夹住断线。可以将引线移到特定位置以形成线尾。可以打开线夹并可以通过毛细管将引线拉到预定长度。可以将拉动的引线预引线焊接到特定位置以形成线尾。可以将火花施加在线尾上以形成小球。
该方法可以进一步涉及将引线从特定位置移到布线衬底,并将半导体芯片单元引线焊接在布线衬底上。可以检查引线焊接部分的偏移分离。
在另一个示范性、非限制性的实施例中,引线焊接单元可以包括含有接纳引线的毛细管的换能器。引线可以沿着拉线方向穿过毛细管,以便电连接衬底到半导体芯片。相对于拉线方向,线夹可以配备在毛细管的上游。系统可以监视换能器上的电流,并且一旦检测到指示断线的电流变化,就生成断线信号。专用控制器可以响应接收到引线焊接监视系统提供的断线信号,闭合线夹。
在另一个示范性、非限制性的实施例中,在引线焊接处理期间夹住引线的方法可以涉及使换能器振动以穿过毛细管拉动引线,监视换能器上的电流,并且一旦检测到指示断线的电流变化,就生成断线信号。系统可以生成断线信号并将断线信号供应给控制线夹闭合的专用控制器,以便可以夹住断线。
附图说明
下面参照附图,描述本发明的示范性、非限制性实施例,在附图中,将相同的标号指定给相同和相应的构件。
图1是传统引线焊接设备的示意性方块图;
图2是按照本发明的示范性、非限制性实施例的引线焊接设备的示意性方块图;
图3是按照本发明的示范性、非限制性实施例安装在转移轨上的预焊接台的俯视图;
图4是可由图2的引线焊接设备执行的、自动形成小球的方法的流程图;
图5A-5C是根据本发明的示范性、非限制性实施例和现有技术的夹线操作的示意图;
图6和7是根据本发明的示范性、非限制性实施例的移动操作的示意图;
图8和9是根据本发明的示范性、非限制性实施例的拉线操作的示意图;
图10A和10B是根据本发明的示范性、非限制性实施例的引线检测操作的示意图;
图11A和11B是根据本发明的示范性、非限制性实施例的线尾形成操作的示意图;
图12是根据本发明的示范性、非限制性实施例的小球形成操作的示意图;
图13是利用图2的引线焊接设备进行的拉线操作的另一个示范性、非限制性实施例的示意图;
图14是按照本发明的示范性、非限制性实施例、含有辅助线夹的引线焊接设备的示意图方块图;
图15是按照本发明的示范性、非限制性实施例、利用滚筒型辅助线夹的拉线操作的示意图;和
图16是按照本发明的示范性、非限制性实施例、利用平板型辅助线夹的拉线操作的示意图。
具体实施方式
下面参照附图描述本发明的示范性、非限制性实施例。但是,本发明可以以许多不同方式具体化,不应该被理解成局限于这里所陈述的实施例。而是,提供这些例示的实施例是为了使本公开全面完整,并向本领域的普通技术人员充分传达本发明的范围。此外,这些图形不是按比例画的。而是,为了便于例示的简单性和清楚性,一些部件可能被放大、缩小和/或简化。
参照图2和3,引线焊接设备150可以包括转移轨110和引线焊接单元130。转移轨110可以转移上面放着半导体芯片124的布线衬底120。引线焊接单元130可以通过引线141电连接半导体芯片124和布线衬底120。引线焊接单元130可以包括换能器131、线夹133和引线焊接监视系统(WBMS)138。换能器131可以含有引线141从中伸过的毛细管132。线夹133可以安装在毛细管132的上面并可以被配置成夹住引线141。线夹133可以与毛细管132一起移动。WBMS 138可以通过检验换能器131上的电流,监视引线焊接处理。引线卷轴139可以将引线141供应给引线焊接单元130。气致张力单元140可以将气体142引向引线141,以便使引线141可以保持预定张力。主计算机137可以与引线焊接设备150连接并可以被配置成控制引线焊接设备150。通信板136可以将主计算机137与引线焊接设备150相连接。
引线焊接设备150可以包括控制器135和预焊接台112。控制器135可以控制线夹133的打开和闭合。例如,一旦接收到来自WBMS 138的断线信号,控制器135可以闭合线夹133,以便夹住断线。预焊接台112可以安装在转移轨110上。
WBMS 138可以检测布线衬底120和半导体芯片124的位置和排列,以便监视引线焊接处理。WBMS 138在引线焊接处理期间可以将电流传送到换能器131,并且可以监视该电流。如果引线141断线,WBMS 138可以检测到电流值的变化并将断线信息(例如,断线信号)传输给控制器135。WBMS 138也可以将断线信息传输给可以管理数个引线焊接设备150的主计算机137。这样,可以将有关哪个引线焊接设备发生断线的信息通知主计算机137,并且主计算机137可以启动在含有断线的引线焊接设备中自动形成小球的处理。
控制器135可以与线夹133的驱动器134连接。控制器135可以将控制线夹133的打开和/或闭合的轮廓传输给驱动器134。来自控制器135的轮廓可以当作含有数个时间段的控制信号。在每个时间段期间,驱动器134可以打开或闭合线夹133。控制器135还可以通过例如像数字-模拟转换器(DAC)那样的通信板136与主计算机137连接。为了接收与线夹133的打开和闭合有关的信号(例如像断线信号那样),控制器135还可以与WBMS 138连接。
按照惯例,可以管理数个引线焊接设备的主计算机可以控制线夹的打开和闭合。相比之下,在这个示范性实施例中,控制器135可以控制线夹的打开和闭合。在这点上,控制器135在一定程度上可以被当作专用控制器,它可以只控制单个引线焊接设备150的线夹133的操作。
与传统结构相比,这个示范性实施例的结构可以为控制夹线操作的信号提供更直接的路径。例如,断线信号可以直接从WBMS 138传送到可以生成轮廓并将轮廓直接供应给驱动器134的控制器135。控制器135可以生成具有大约100μs的片段的轮廓。由于控制夹线操作的信号的间接路径的缘故,在传统结构中至少部分地不能获得这样的轮廓。例如,参照图1,断线信号可以通过通信板35从WBMS 38传送到主计算机37,然后,主计算机37生成经过通信板35传递到驱动器34的轮廓。此外,在传统结构中,主计算机37的共享性质可能在处理与夹线操作相联系的信号时引起延迟。
具有大约100μs的片段的轮廓可以使线夹133的打开和闭合用一个起始位来控制,从而基本上与断线信号的传输同时地进行断线的夹线操作。因此,这个示范性实施例可以降低非有意断线滑过毛细管132并完全从毛细管132中移出的可能性。
可以配备预焊接台112以便可以从毛细管132中移出断线的末端。这样,通过引线焊接的一个循环可以自动形成线尾和小球(下文称为“预引线焊接”操作)。与在正常、未中断引线焊接处理期间形成的线尾相比,断线的末端可以是变形的。如果将高压电火花施加在断线的变形末端上以形成小球,那么,所得的小球可能具有所需球形之外的形状。通过预引线焊接操作可以在预焊接台112上消除断线的异常末端,以形成适合于形成所需小球(即,没有缺陷)的线尾。可替代地,可以在布线衬底120上进行预引线焊接操作。在这种情况下,预引线焊接操作可能涉及到利用配备在布线衬底120上的衬底焊接区122的虚设衬底焊接区122a(参见图3)形成线尾。
预焊接台112可以安装在转移轨110上。例如,可以将预焊接台112配备在转移轨110的一端或两端上。预焊接台112可以沿着转移轨110的安装方向延伸。但是,应该认识到,预焊接台112可以具有各种各样的可替代形状,并且仍然适合预引线焊接操作。预焊接台112可以由在预引线焊接操作期间可以降低对毛细管112的损害和可与引线141接合的材料制成。正如在现有技术中众所周知的那样,这些材料可以包括铁合金、铜合金、或任何其它合适材料。预焊接台112和布线衬底120的衬底焊接区122和122a可以由相同材料或不同材料制成。
图4是可以利用图2的引线焊接设备实现、自动形成小球的方法的流程图。图5A到图12示意性地例示了图4的方法的各种操作。
在转移轨可提供含有半导体芯片的布线衬底的同时,引线焊接单元可以进行引线焊接处理170。如果在引线焊接处理170期间没有发生不经意断线(步骤171中的“否”),那么,可以继续进行引线焊接处理170。如果发生不经意断线(步骤171中的“是”),那么,可以开始夹线操作173,接着可以进行可能导致引线焊接处理170继续下去的小球形成操作183。下面针对在针脚式焊接处理期间发生不经意断线情况对这个示范性实施例加以讨论。但是,应该认识到,在引线焊接处理期间,任何时候都可能发生这样的断线。无论如何,该示范性实施例可以提供有效的“自恢复”特征。
当发生不经意断线时(步骤171中的“是”),接着,可以进行夹线操作(图4的173)以夹住断线141。夹线操作将参照图5A到6加以讨论。由于断线,流经换能器131的电流量可能发生变化。WBMS 138可以检测电流变化,并且将断线信号传输给控制器135。控制器135可以将命令轮廓传输给驱动器134以闭合线夹133,从而夹住断线141。
控制器135可以生成像大约100μs的片段(t2)那样的轮廓。因此,线夹133的闭合或打开可以用一个起始位来控制。这样,可以基本上与来自WBMS138的断线信号的传输同时地夹住断线141。这可以降低断线141滑过毛细管132和完全从毛细管132中移出的可能性。图6的标号146a是发生非有意断线之后穿过毛细管132暴露出来的引线端部。
如图5A所示,通过毛细管132可以将引线141针脚式焊接在布线衬底120上(I)。可以让毛细管132向上移动到形成线尾的位置(II)。线夹133可以夹住引线141和毛细管132可以向上移动,以便可以在引线141的薄弱部分或在针脚式焊接部分发生故意断线,形成线尾146(III)。
图5B和5C比较了本发明的示范性实施例和现有技术的夹线时间。当在线夹可能处在打开状态下的时刻A发生非有意断线时,可以测量夹线时间。时刻A可以在毛细管132完成它到形成线尾146的位置的移动之前并且可以在针脚式焊接处理之后。
图5B(1)描绘了在没有发生非有意断线的引线焊接处理期间可能发生的夹线操作。这里,在适当时刻,线夹133可以从打开状态移动到闭合状态以夹住引线141。随着线夹133处在闭合状态,毛细管132可以向上移动造成故意断线141,从而形成线尾146(参见图5A(III))。
图5B(2)描绘了传统结构的夹线时间。传统主计算机可以控制线夹的打开和闭合。从发生非有意断线开始(在时刻A),到线夹开始闭合可能需要大约800μs(t1)。这可能导致引线滑过毛细管,未被线夹夹住。
图5B(3)描绘了本发明示范性实施例的夹线时间。控制器135可以控制线夹133的打开和闭合。从发生非有意断线开始(在时刻A),到线夹夹住断线141可能需要大约100μs(t2)。因此,断线141可以基本上与WBMS 138提供的断线信号的传输同时地被夹住。结果,可以降低非有意断线滑过毛细管132和完全从毛细管132中移出的可能性。
图6和7例示了为了将断线移动到特定位置而执行的移动操作(图4的175)。夹住断线141的引线焊接单元130可以移动到特定位置以形成线尾,这个线尾随后可以用于形成小球。换能器131可以移动到特定位置的上表面的上面。形成线尾的位置可以与布线衬底120的衬底焊接区的高度相适应。在这个示范性实施例中,特定位置可以是预焊接台112。但是,应该认识到,本发明不局限于这一点。例如,特定位置可以是虚设衬底焊接区(图3的122a)。在这个示范性实施例中,预焊接台112可以沿着转移轨110的安装方向延伸(如图3所示)并且预引线焊接操作可以沿着转移轨110的安装方向进行下去。但是,应该认识到,本发明不局限于这一点。例如,预焊接台112可以沿着与转移轨110的安装方向垂直的方向延伸和预引线焊接操作可以沿着预焊接台112的安装方向(即,与转移轨110的安装方向垂直)进行下去。
图8和9例示了可以执行的拉线操作(图4的177)。如图8所示,闭合的线夹133可以打开。可以将超声波振动作用在换能器131上以拉动穿过毛细管132的引线,以便引线的暴露端部146a可以在毛细管132的下面具有预定长度。如图9所示,打开的线夹133可以闭合,以结束拉线操作。在毛细管132的下面拉动的引线的暴露端部146a可以在预引线焊接操作中用作线尾。
图10A和10B表示为了确定暴露端部146a是否被拉成在毛细管132的下面具有预定长度而执行的引线检测操作(图4的179)。如图10A所示,换能器131可以向下移动到预焊接台112的上面。WBMS 138可以根据引线的暴露端部146a与预焊接台112的接触检测电流的变化。如果没有检测到电流变化(这可能表示引线可能没有被拉到预定长度),那么,可以重复拉线操作(图4的177)。
应该认识到,本发明不局限于上面所讨论的特定引线检测操作。例如,参照图10B,高压电火花片143可以将高压电火花施加在引线的暴露端部146a上。WBMS 138可以检测换能器131上的电流。如果引线被拉到毛细管132的下面,可以在引线的末端形成小球149a。形成的小球具有基本上为球形的形状。
应该认识到,在引线检测操作中可以适当地应用像传感器(例如)那样的其它可替代检测装置。
图11A和11B例示了线尾形成操作(图4的181)。可以进行线尾形成操作,以便可以通过预引线焊接操作消除断线的末端。线尾形成操作可以在预焊接台112上(或可替代地,例如在图3的虚设衬底焊接区122a上)进行,以形成线尾146,这个线尾146可以用于形成没有缺陷的小球。
如图11A所示,可以像楔形焊接操作那样实现预引线焊接操作。这里,在利用如图10A所示的方法完成引线检测操作之后,可以在预焊接台112上进行楔形焊接操作,以便在毛细管132的下面形成线尾146。正如名称所暗示的那样,楔形焊接操作可以导致在预焊接台112上形成的楔形焊接引线147a。楔形焊接本身在现有技术中是众所周知的引线焊接技术,因此,省略对它的详细描述。
可替代地,如图11B所示,可以像球形焊接操作那样实现预引线焊接操作。在这种情况下,利用如图10B所示的方法形成的小球149a,可以在预焊接台112上进行球形焊接操作,以便在毛细管132的下面形成线尾146。正如名称所暗示的那样,球形焊接操作可以导致在预焊接台112上形成的球形焊接引线147b。球形焊接本身在现有技术中是众所周知的引线焊接技术,因此,省略对它的详细描述。
图12例示了可以执行的小球形成操作(图4的183)。高压电火花片143可以将高压电火花施加在线尾上以形成小球149。在这个示范性实施例中,小球149可以在预焊接台112的上面形成。但是,应该认识到,本发明不局限于这一点。例如,小球149可以在布线衬底120的上面形成。
可以进行单元引线焊接(unit wire bonding)操作(图4的185)以便连接半导体芯片和布线衬底。单元引线焊接操作可以在毛细管132从预焊接台112移动到布线衬底120之后进行。检查操作(图4的187)可以由WBMS 138来执行,以确定引线焊接部分的偏移分离。在检查操作期间,WBMS 138可以确定(例如)是否有必要进行重新引线焊接和生成适当错误消息。
如果引线焊接部分偏移分离在容限内(图4的187上的“好”),那么,可以重新开始引线焊接处理(图4的170)。如果引线焊接部分偏移分离超出容限(图4的187上的“不好”),那么,引线焊接设备可以停止运行和生成警告操作人员的错误(图4的189)。通常,由于(例如)毛细管132的磨损和/或扭曲,可能会发生错过目标焊接位置的故障。于是,周期性地检查包括毛细管132在内的引线焊接单元130也许是适当的。
图13示出了拉线操作(图4的177)的另一个示范性、非限制性实施例。如图7所示,引线焊接单元130可以夹住断线141并可以移动到预焊接台112以形成线尾。
参照图13的(a),将状态设置成即使线夹133可能打开,引线141也可以相对于线夹133保持在当前位置上。例如,通过可以吹在引线卷轴提供的引线141上的气体142,引线可以保持在平衡状态。气体142可以将张力施加在线夹133上方的引线141上和超声波振动可以作用在换能器131上。这样,换能器131的超声波振动在线夹133的下方施加拉线力,这个拉线力可以相当于施加在线夹133上方的引线141上的张力。
参照图13的(b),线夹133可以打开。
参照图13的(c),换能器131可以向上移动预定距离。引线141与换能器131相比,可以相对不活动,因此,可以被拉过毛细管132。
参照图13的(d),线夹133可以闭合以夹住引线141。
参照图13的(e),换能器131可以向下移动到形成小球的位置以完成拉线操作。
在这个示范性实施例中,引线可以被线夹夹住和释放。但是,应该认识到,本发明不局限于这一点。例如,正如下面更详细讨论的那样,辅助线夹可以进一步用来加上附加夹线功能。
图14是按照本发明的另一个示范性、非限制性实施例、含有辅助线夹244的引线焊接设备250的示意图方块图。这里,引线焊接设备250可以包括辅助线夹244和传感器245。辅助线夹244可以安装在线夹233和毛细管232之间,并且,辅助线夹244可以被配置成夹住引线241。传感器245可以安装在毛细管232的下面。传感器245可以被配置成测量引线241拉过毛细管232的长度并检测在线尾上形成的小球的位置。
传感器245可以测量引线241拉过毛细管232的长度,以确定毛细管232的运动距离。传感器245可以包括光学传感器、光学摄像机或在现有技术中众所周知的其它一些传统传感器。
辅助线夹244可以是滚筒型辅助线夹或平板型辅助线夹。辅助线夹244的打开和闭合可以由控制器235控制。这个示范性实施例在结构上和在功能上都可以与第一示范性实施例相似。但是,在这个示范性实施例中,可以利用辅助线夹244和传感器245进行拉线操作。
图15例示了可以利用滚筒型的辅助线夹244a进行的拉线操作,滚筒型的辅助线夹244a可以包括一对联动滚筒。如图15的(a)所示,如果引线241非有意断开,线夹233(与图2的线夹133类似)可以闭合以夹住断线241。
参照图15的(b),传感器245可以检测到引线的暴露端部246a的长度,并且将线长信息发送到控制器(图14的235)。辅助线夹244a可以闭合以夹住断线241和线夹233可以打开。
滚筒型辅助线夹244a可以由附在上面的电机驱动转动。可以让电机转动起来以调整暴露端部246a的位置。
参照图15的(c),控制器(图14的235)可以激励电机使辅助线夹244a的滚筒转动,从而拉动穿过毛细管232的引线的暴露端部246a。暴露端部246a可以拉过毛细管232与传感器245提供的线长信息相对应的长度。
参照图15的(d),打开的线夹233可以闭合以夹住引线241。辅助线夹244a可以打开。
滚筒型辅助线夹244a可以使换能器231不作垂直运动就可以进行拉线操作。
图16例示了可以利用平板型的辅助线夹244b进行的拉线操作,平板型的辅助线夹244b可以包括一对联动平板。平板型辅助线夹244b可以与线夹233类似。
参照图16的(a),如果引线241非有意断开,那么,线夹233(与图2的线夹133类似)可以闭合以夹住断线241。传感器245可以测量引线的暴露端部246a的长度,并且将线长信息发送到控制器(图14的235)和主计算机(图14的237)。控制器(图14的235)可以根据传感器245提供的线长信息控制线夹233和辅助线夹244b的打开和闭合。主计算机(图14的237)可以控制换能器231的垂直运动。
参照图16的(b),辅助线夹244b可以闭合以夹住断线241。线夹233可以打开。
参照图16的(c),换能器231可以向上移动到预定高度。换能器231可以朝着辅助线夹244b移动,以便换能器231的顶端可以位于与辅助线夹244b的下端相邻的地方。此外,换能器231可以背向辅助线夹244b移动,以便线夹233的下端可以位于与辅助线夹244b的顶端相邻的地方。
参照图16的(d),线夹233可以闭合以夹住断线241和辅助线夹244b可以打开。这里,引线241不会改变位置。
参照图16的(e),换能器231可以背向辅助线夹244b移动到形成小球的位置。引线241可以与换能器231和线夹233一起移动。
由于换能器231的垂直运动可能受辅助线夹244b限制,换能器231的单独垂直运动不足以将在毛细管232下面的暴露端部246a拉动所需量。因此,可以重复如(b)到(e)所示的运动,以便将在毛细管232下面的暴露端部246a拉到与传感器245提供的线长信息相对应的长度。例如,如果从传感器245发送到主计算机(图14的237)的线长信息小于换能器231的向上移动距离,换能器231的单独垂直运动可能足以完成拉线操作。相反,如果从传感器245发送到主计算机(图14的237)的线长信息大于换能器231的向上移动距离,重复换能器231的垂直运动,以便将暴露端部246a拉到与传感器245提供的线长信息相对应的长度。线夹233和辅助线夹244b的操作可以与换能器231的垂直运动一致进行。
当实现平板型辅助线夹244b时,线夹233和辅助线夹244b可以交替夹住引线241,并且换能器231可以重复地作垂直运动,从而将在毛细管232下面的引线246a拉到与传感器245提供的线长信息相对应的长度。
小球(可以通过预引线焊接操作形成)的位置可以利用传感器245来调整。
按照这些示范性实施例,控制器可以控制线夹的打开和闭合,从而基本上与发生断线同时地夹住非有意断线。因此,本发明可以防止断线滑过毛细管(和从中移出)。
断线的末端可以在可以安装在转移轨上的预焊接台上消除。因此,可以使可能由断线的使用引起的引线焊接故障的发生降到最低程度。
并且,从夹线操作到小球形成操作的一系列操作可以自动进行,从而提高了引线焊接设备的操作效率。
尽管已经对本发明的某些示范性实施例作了详细描述,但本领域的普通技术人员应该明白,可以对本发明的新基本概念作许多改变和/或改进。这样的改变和改进仍然在如所附权利要求书限定的本发明的精神和范围之外。
Claims (25)
1.一种引线焊接设备,包括:
容纳含有至少一个半导体芯片的至少一个布线衬底的转移轨;
被配置成通过引线将半导体芯片和布线衬底电连接的引线焊接单元;
引线焊接单元包括:
含有接纳引线的毛细管的换能器;
可与毛细管一起移动的线夹;
被配置成监视换能器上的电流的引线焊接监视系统;
响应接收到引线焊接监视系统提供的断线信号,闭合线夹以夹住断线的控制器;和
安装在转移轨上的预焊接台,在预焊接台,断线的末端从毛细管中移出。
2.根据权利要求1所述的设备,其中,预焊接台沿着转移轨的安装方向延伸。
3.根据权利要求1所述的设备,其中,引线焊接单元安装在引线供应卷轴和转移轨之间,并且引线焊接单元进一步包括用于夹住引线的辅助线夹。
4.根据权利要求3所述的设备,其中,辅助线夹是起拉动穿过毛细管的引线作用的一对滚筒。
5.根据权利要求3所述的设备,其中,辅助线夹是随着换能器作垂直运动,与线夹交替地夹住引线以拉动穿过毛细管的引线的一对平板。
6.根据权利要求5所述的设备,其中,换能器可沿着第一方向移动,以便换能器的顶端处在与辅助线夹的下端相邻的地方,并且换能器可沿着与第一方向相反的第二方向移动,以便线夹的下端处在与辅助线夹的顶端相邻的地方。
7.根据权利要求3所述的设备,进一步包括:
安装在毛细管的下端的传感器,该传感器用于测量在从毛细管伸出的引线的线尾上形成的小球的位置。
8.一种自动形成小球的方法,包括:
响应接收到引线焊接监视系统提供的断线信号,通过控制器闭合线夹以便夹住断线;
将引线移动到形成线尾的特定位置;
打开线夹并将穿过毛细管的引线拉到预定长度;
将拉动的引线预引线焊接到特定位置以形成线尾;和
将火花施加在线尾上以形成小球。
9.根据权利要求8所述的方法,其中,线夹夹住的引线的末端位于毛细管的内部。
10.根据权利要求8所述的方法,其中,形成线尾的特定位置在预焊接台上。
11.根据权利要求8所述的方法,其中,形成线尾的特定位置在布线衬底的虚设衬底焊接区上。
12.根据权利要求8所述的方法,其中,将引线移动到特定位置包括:
将换能器从在布线衬底上面的位置移动到特定位置;和
朝着特定位置的上表面移动换能器。
13.根据权利要求12所述的方法,其中,拉动引线包括:
使超声波振动作用在换能器上以穿过毛细管拉动引线;和
闭合线夹。
14.根据权利要求12所述的方法,其中,拉动引线包括:
使换能器向上移动到预定高度和穿过毛细管拉动引线;
闭合线夹;和
使换能器向下移动到形成小球的位置。
15.根据权利要求12所述的方法,进一步包括:
用安装在线夹和毛细管之间的辅助线夹夹住引线。
16.根据权利要求15所述的方法,其中,辅助线夹是一对滚筒,并且拉动引线包括:
用一对滚筒夹住引线并打开线夹;
通过转动滚筒穿过毛细管拉动引线;和
闭合线夹以夹住引线并打开滚筒。
17.根据权利要求15所述的方法,其中,辅助线夹是一对平板,并且拉动引线包括:
用辅助线夹夹住引线并打开线夹;
使换能器向上移动到预定高度以便将穿过毛细管的引线拉动预定长度;
闭合线夹以夹住引线和打开辅助线夹;和
使换能器向下移动到形成小球的位置。
18.根据权利要求8所述的方法,其中,拉动引线进一步包括检测引线是否被拉动毛细管达预定长度。
19.根据权利要求18所述的方法,其中,检测包括:
将换能器移向特定位置;和
根据拉动的引线和特定位置之间的接触监视换能器上的电流,从而检测引线。
20.根据权利要求18所述的方法,其中,检测包括:
将高压电火花施加在引线上;和
监视换能器上的电流,从而检测引线。
21.根据权利要求8所述的方法,其中,预引线焊接是楔形焊接。
22.根据权利要求8所述的方法,其中,预引线焊接是球形焊接。
23.根据权利要求8所述的方法,进一步包括:
将引线从特定位置移动到布线衬底;
单元引线焊接半导体芯片到布线衬底;和
检查引线焊接部分的偏移分离。
24.一种引线焊接单元,包括:
含有接纳引线的毛细管的换能器,该引线可沿着拉线方向穿过毛细管以便电连接衬底到半导体芯片;
固定通过毛细管的引线的线夹;
监视换能器上的电流,并且一旦检测到指示断线的电流变化,就生成断线信号的系统;和
响应接收到引线焊接监视系统提供的断线信号,闭合线夹的专用控制器。
25.一种在引线焊接处理期间夹住引线的方法,该方法包括:
使换能器振动以穿过毛细管拉动引线;
监视换能器上的电流;和
一旦检测到指示断线的电流变化,就生成断线信号;
其中,系统生成断线信号并将断线信号供应给控制线夹闭合的专用控制器,以便夹住断线。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR95437/03 | 2003-12-23 | ||
KR95437/2003 | 2003-12-23 | ||
KR20030095437 | 2003-12-23 | ||
KR20400/2004 | 2004-03-25 | ||
KR10-2004-0020400A KR100526060B1 (ko) | 2003-12-23 | 2004-03-25 | 자기 복구형 와이어 본딩 장치 및 그를 이용한 자동 볼형성 방법 |
KR20400/04 | 2004-03-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1638075A CN1638075A (zh) | 2005-07-13 |
CN100365785C true CN100365785C (zh) | 2008-01-30 |
Family
ID=34680742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100923304A Active CN100365785C (zh) | 2003-12-23 | 2004-11-08 | 用于夹住引线的引线焊接设备和方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7481351B2 (zh) |
JP (1) | JP5008014B2 (zh) |
CN (1) | CN100365785C (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7044356B2 (en) * | 2003-12-11 | 2006-05-16 | Texas Instruments Incorporated | Roller wire brake for wire bonding machine |
JP4547330B2 (ja) * | 2005-12-28 | 2010-09-22 | 株式会社新川 | ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法 |
JP4530984B2 (ja) * | 2005-12-28 | 2010-08-25 | 株式会社新川 | ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法 |
US7896218B2 (en) * | 2007-06-28 | 2011-03-01 | Western Digital Technologies, Inc. | Apparatus and method for conductive metal ball bonding with electrostatic discharge detection |
TWI405278B (zh) * | 2010-05-20 | 2013-08-11 | Advanced Semiconductor Eng | 固定治具及打線機台 |
CN102303189B (zh) * | 2011-08-15 | 2014-07-16 | 佛山市顺德区德芯智能科技有限公司 | 用于双界面焊接封装机的ic卡焊接装置及其控制方法 |
CN103107111B (zh) * | 2011-11-11 | 2017-03-01 | 飞思卡尔半导体公司 | 用于监测线接合中无空气球(fab)形成的方法和装置 |
US9314869B2 (en) * | 2012-01-13 | 2016-04-19 | Asm Technology Singapore Pte. Ltd. | Method of recovering a bonding apparatus from a bonding failure |
CN103151277B (zh) * | 2012-12-31 | 2016-01-20 | 气派科技股份有限公司 | 一种提高集成电路封装中键合机台效率的方法 |
US9165842B2 (en) * | 2014-01-15 | 2015-10-20 | Kulicke And Soffa Industries, Inc. | Short tail recovery techniques in wire bonding operations |
TWI517277B (zh) * | 2014-02-14 | 2016-01-11 | 新川股份有限公司 | 打線裝置以及半導體裝置的製造方法 |
JP5950994B2 (ja) * | 2014-12-26 | 2016-07-13 | 株式会社新川 | 実装装置 |
CN105364250A (zh) * | 2015-11-20 | 2016-03-02 | 中冶南方(武汉)自动化有限公司 | 一种自动焊锡系统及其控制方法 |
TWI555601B (zh) * | 2015-12-21 | 2016-11-01 | 矽品精密工業股份有限公司 | 打線裝置及排除不良銲線之方法 |
CN106102441A (zh) * | 2016-08-09 | 2016-11-09 | 深圳翠涛自动化设备股份有限公司 | 一种焊线机的断线检测系统及方法 |
KR101801727B1 (ko) | 2016-11-08 | 2017-11-28 | 디아이티 주식회사 | 기판 검사 장치 |
CN108375998B (zh) * | 2018-03-15 | 2024-05-17 | 宁波尚进自动化科技有限公司 | 一种具有摩擦力的线夹开关状态控制方法及系统 |
EP3603826B1 (en) * | 2018-07-31 | 2023-05-10 | Infineon Technologies AG | Method for calibrating an ultrasonic bonding machine |
CN110270788B (zh) * | 2019-05-28 | 2021-02-12 | 广东工业大学 | 一种高速精密焊线平台及其控制方法 |
KR20210140957A (ko) * | 2020-05-14 | 2021-11-23 | 삼성전자주식회사 | 반도체 패키지의 와이어 본딩 방법 |
WO2023164468A1 (en) * | 2022-02-23 | 2023-08-31 | Atieva, Inc. | Wire bonding apparatus with active wire feeding for forming wire bonds |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4213556A (en) * | 1978-10-02 | 1980-07-22 | General Motors Corporation | Method and apparatus to detect automatic wire bonder failure |
US4266710A (en) * | 1978-11-22 | 1981-05-12 | Kulicke And Soffa Industries Inc. | Wire bonding apparatus |
US5326015A (en) * | 1993-03-29 | 1994-07-05 | Kulicke And Soffa Investments, Inc. | Wire bonder tail length monitor |
US6156990A (en) * | 1998-06-22 | 2000-12-05 | Kulicke & Soffa Industries, Inc. | Long-wearing impervious conductive wire clamp |
CN1430253A (zh) * | 2001-12-28 | 2003-07-16 | 精工爱普生株式会社 | 焊接方法以及焊接装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2799770A (en) * | 1955-06-01 | 1957-07-16 | Rca Corp | Welding apparatus |
JPH01241138A (ja) * | 1988-03-23 | 1989-09-26 | Toshiba Corp | 半導体装置のワイヤボンディング方法 |
JPH0278239A (ja) * | 1988-09-14 | 1990-03-19 | Hitachi Ltd | ワイヤボンディング方法 |
US5238173A (en) * | 1991-12-04 | 1993-08-24 | Kaijo Corporation | Wire bonding misattachment detection apparatus and that detection method in a wire bonder |
JPH05259232A (ja) * | 1992-03-16 | 1993-10-08 | Fujitsu Ltd | ワイヤボンディング装置 |
KR0180671B1 (ko) | 1995-12-15 | 1999-04-15 | 김주용 | 와이어오픈 자동제거장치 및 방법 |
KR100193903B1 (ko) * | 1995-12-30 | 1999-06-15 | 윤종용 | 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치 |
JPH10107059A (ja) | 1996-09-26 | 1998-04-24 | Nec Kansai Ltd | ワイヤボンダ |
JPH11233551A (ja) | 1998-02-13 | 1999-08-27 | Kaijo Corp | ワイヤボンディング装置 |
US6667625B1 (en) * | 2001-12-31 | 2003-12-23 | Charles F. Miller | Method and apparatus for detecting wire in an ultrasonic bonding tool |
US7004373B1 (en) * | 2003-04-07 | 2006-02-28 | West Bond, Inc. | Wire bond fault detection method and apparatus |
-
2004
- 2004-08-30 US US10/928,402 patent/US7481351B2/en active Active
- 2004-11-08 CN CNB2004100923304A patent/CN100365785C/zh active Active
- 2004-12-22 JP JP2004372150A patent/JP5008014B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4213556A (en) * | 1978-10-02 | 1980-07-22 | General Motors Corporation | Method and apparatus to detect automatic wire bonder failure |
US4266710A (en) * | 1978-11-22 | 1981-05-12 | Kulicke And Soffa Industries Inc. | Wire bonding apparatus |
US5326015A (en) * | 1993-03-29 | 1994-07-05 | Kulicke And Soffa Investments, Inc. | Wire bonder tail length monitor |
US6156990A (en) * | 1998-06-22 | 2000-12-05 | Kulicke & Soffa Industries, Inc. | Long-wearing impervious conductive wire clamp |
CN1430253A (zh) * | 2001-12-28 | 2003-07-16 | 精工爱普生株式会社 | 焊接方法以及焊接装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1638075A (zh) | 2005-07-13 |
US20050133563A1 (en) | 2005-06-23 |
US7481351B2 (en) | 2009-01-27 |
JP2005184009A (ja) | 2005-07-07 |
JP5008014B2 (ja) | 2012-08-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100365785C (zh) | 用于夹住引线的引线焊接设备和方法 | |
US4213556A (en) | Method and apparatus to detect automatic wire bonder failure | |
US4771930A (en) | Apparatus for supplying uniform tail lengths | |
TWI634602B (zh) | 在線接合操作中之短尾恢復技術 | |
US20070029367A1 (en) | Semiconductor device | |
KR20130045808A (ko) | 와이어 본더를 위한 자동 와이어 테일 조정 시스템 | |
US5326015A (en) | Wire bonder tail length monitor | |
CN104037099A (zh) | 在焊线操作中未粘接状况下的自动返工过程 | |
EP0983607A1 (en) | Bump forming method and bump bonder | |
US5468927A (en) | Wire bonding apparatus | |
KR930007837B1 (ko) | 와이어 본딩장치 | |
KR100526060B1 (ko) | 자기 복구형 와이어 본딩 장치 및 그를 이용한 자동 볼형성 방법 | |
JP2005251919A (ja) | バンプボンディング装置及びバンプ不着検出方法 | |
JP3384442B2 (ja) | ボンディングワイヤ不良検出方法 | |
CN210548748U (zh) | Led焊线机 | |
US8678266B2 (en) | Wire bonding method | |
JPH10303201A (ja) | キャピラリーと、その使用方法と、バンプ形成装置 | |
KR20070084867A (ko) | 와이어 고정 수단을 갖는 와이어 본딩 장치 및 그를 이용한와이어 테일 형성 방법 | |
KR100273694B1 (ko) | 반도체패키지용와이어본딩기의와이어본딩감지방법및그장치 | |
CN111715976B (zh) | Led焊线机 | |
JP3201371B2 (ja) | ワイヤボンディング装置 | |
KR100273237B1 (ko) | 반도체패키지의와이어본딩공정용와이어공급장치 | |
KR100465958B1 (ko) | 전기로의 용강 유출 차단장치 | |
JP3908640B2 (ja) | ワイヤボンディング方法及び装置 | |
CN117300294A (zh) | 焊接控制方法及装置、介质、设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |