KR100516597B1 - 반도체 장치, 반도체 장치의 실장 구조, 액정 장치 및 전자 기기 - Google Patents

반도체 장치, 반도체 장치의 실장 구조, 액정 장치 및 전자 기기 Download PDF

Info

Publication number
KR100516597B1
KR100516597B1 KR10-2000-0010619A KR20000010619A KR100516597B1 KR 100516597 B1 KR100516597 B1 KR 100516597B1 KR 20000010619 A KR20000010619 A KR 20000010619A KR 100516597 B1 KR100516597 B1 KR 100516597B1
Authority
KR
South Korea
Prior art keywords
liquid crystal
electrode
semiconductor device
bump
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR10-2000-0010619A
Other languages
English (en)
Korean (ko)
Other versions
KR20000071406A (ko
Inventor
우치야마겐지
Original Assignee
세이코 엡슨 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세이코 엡슨 가부시키가이샤 filed Critical 세이코 엡슨 가부시키가이샤
Publication of KR20000071406A publication Critical patent/KR20000071406A/ko
Application granted granted Critical
Publication of KR100516597B1 publication Critical patent/KR100516597B1/ko
Assigned to 보에 테크놀로지 그룹 컴퍼니 리미티드 reassignment 보에 테크놀로지 그룹 컴퍼니 리미티드 권리의 전부이전등록 Assignors: 비오이 테크놀로지 (에이치케이) 리미티드
Assigned to 비오이 테크놀로지 (에이치케이) 리미티드 reassignment 비오이 테크놀로지 (에이치케이) 리미티드 권리의 전부이전등록 Assignors: 세이코 엡슨 가부시키가이샤
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01255—Changing the shapes of bumps by using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
KR10-2000-0010619A 1999-03-08 2000-03-03 반도체 장치, 반도체 장치의 실장 구조, 액정 장치 및 전자 기기 Expired - Lifetime KR100516597B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP99-060459 1999-03-08
JP06045999A JP3826605B2 (ja) 1999-03-08 1999-03-08 半導体装置の実装構造の製造方法、液晶装置、および電子機器

Publications (2)

Publication Number Publication Date
KR20000071406A KR20000071406A (ko) 2000-11-25
KR100516597B1 true KR100516597B1 (ko) 2005-09-22

Family

ID=13142881

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2000-0010619A Expired - Lifetime KR100516597B1 (ko) 1999-03-08 2000-03-03 반도체 장치, 반도체 장치의 실장 구조, 액정 장치 및 전자 기기

Country Status (5)

Country Link
US (1) US6448663B1 (https=)
JP (1) JP3826605B2 (https=)
KR (1) KR100516597B1 (https=)
CN (1) CN1181542C (https=)
TW (1) TW444300B (https=)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI240241B (en) * 2000-05-04 2005-09-21 Koninkl Philips Electronics Nv Assembly of a display device and an illumination system
US6642613B1 (en) * 2000-05-09 2003-11-04 National Semiconductor Corporation Techniques for joining an opto-electronic module to a semiconductor package
US6995753B2 (en) * 2000-06-06 2006-02-07 Semiconductor Energy Laboratory Co., Ltd. Display device and method of manufacturing the same
JP3892650B2 (ja) * 2000-07-25 2007-03-14 株式会社日立製作所 液晶表示装置
JP3781967B2 (ja) * 2000-12-25 2006-06-07 株式会社日立製作所 表示装置
JP3756418B2 (ja) * 2001-02-28 2006-03-15 株式会社日立製作所 液晶表示装置及びその製造方法
US6806938B2 (en) * 2001-08-30 2004-10-19 Kyocera Corporation Liquid crystal display device with particular on substrate wiring, portable terminal and display equipment provided with the liquid crystal display device
JP2003121815A (ja) * 2001-10-16 2003-04-23 Nec Access Technica Ltd Ｌｃｄの保持構造
JP3573150B2 (ja) 2002-01-25 2004-10-06 セイコーエプソン株式会社 半導体装置及びこれを含む電気光学装置
KR100499134B1 (ko) * 2002-10-28 2005-07-04 삼성전자주식회사 압축 접합 방법
JP2004184805A (ja) * 2002-12-05 2004-07-02 Tohoku Pioneer Corp 導電配線の接続構造
KR20040075377A (ko) * 2003-02-20 2004-08-30 삼성전자주식회사 구동 아이씨 및 이를 갖는 디스플레이 장치
CN1325983C (zh) * 2003-05-27 2007-07-11 友达光电股份有限公司 液晶显示面板的封装结构及其制作工艺
JP4004994B2 (ja) 2003-06-05 2007-11-07 株式会社アドバンスト・ディスプレイ 表示装置
CN100356559C (zh) * 2003-09-24 2007-12-19 财团法人工业技术研究院 倒装芯片封装结构及其制造方法
TWI277815B (en) * 2004-01-16 2007-04-01 Hannstar Display Corp Liquid crystal display and manufacturing method of liquid crystal display including substrate
CN100416343C (zh) * 2004-01-21 2008-09-03 友达光电股份有限公司 增加金属连线可靠度的结构
CN1297840C (zh) * 2004-03-25 2007-01-31 友达光电股份有限公司 显示器的导线结构
CN101189625B (zh) * 2005-05-31 2011-09-28 株式会社半导体能源研究所 半导体器件及其制造方法以及天线的制造方法
JP4851255B2 (ja) * 2006-07-14 2012-01-11 株式会社 日立ディスプレイズ 表示装置
JP4920330B2 (ja) * 2006-07-18 2012-04-18 ソニー株式会社 実装構造体の実装方法、発光ダイオードディスプレイの実装方法、発光ダイオードバックライトの実装方法および電子機器の実装方法
JP2008235556A (ja) * 2007-03-20 2008-10-02 Sumitomo Electric Ind Ltd 配線板モジュール及び該配線板モジュールの製造方法
KR101285273B1 (ko) * 2007-06-15 2013-07-23 엘지디스플레이 주식회사 이동통신기기
CN101216619B (zh) * 2008-01-10 2010-09-22 友达光电股份有限公司 平面显示器及其制造方法和光电装置及其制造方法
CN101556838B (zh) * 2008-04-09 2011-06-01 北京京东方光电科技有限公司 各向异性导电膜
TW201123377A (en) * 2009-12-16 2011-07-01 Raydium Semiconductor Corp Electronic chip and substrate with void
US9142533B2 (en) 2010-05-20 2015-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate interconnections having different sizes
KR101375298B1 (ko) * 2011-12-20 2014-03-19 제일모직주식회사 전도성 미립자 및 이를 포함하는 이방 전도성 필름
US9425136B2 (en) 2012-04-17 2016-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Conical-shaped or tier-shaped pillar connections
US9646923B2 (en) 2012-04-17 2017-05-09 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
US9299674B2 (en) 2012-04-18 2016-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Bump-on-trace interconnect
US9111817B2 (en) 2012-09-18 2015-08-18 Taiwan Semiconductor Manufacturing Company, Ltd. Bump structure and method of forming same
US8950011B2 (en) 2013-05-22 2015-02-03 International Business Machines Corporation Targeted sequencing of biomolecules by pulling through a liquid-liquid interface with an atomic force microscope
JP6645730B2 (ja) * 2014-01-28 2020-02-14 デクセリアルズ株式会社 接続体及び接続体の製造方法
KR20150094125A (ko) * 2014-02-10 2015-08-19 한국전자통신연구원 반도체 소자 및 이를 제조하는 방법
JP6476747B2 (ja) * 2014-10-28 2019-03-06 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
US10170403B2 (en) * 2014-12-17 2019-01-01 Kinsus Interconnect Technology Corp. Ameliorated compound carrier board structure of flip-chip chip-scale package
US10224305B2 (en) * 2015-05-22 2019-03-05 Sharp Kabushiki Kaisha Semiconductor device
CN106486511B (zh) * 2015-08-25 2020-04-28 上海和辉光电有限公司 一种显示器件及制备有机发光二极管显示面板的方法
TWI696300B (zh) 2016-03-15 2020-06-11 晶元光電股份有限公司 半導體裝置及其製造方法
JP6769721B2 (ja) * 2016-03-25 2020-10-14 デクセリアルズ株式会社 電子部品、異方性接続構造体、電子部品の設計方法
KR102761525B1 (ko) * 2016-12-07 2025-02-04 서울바이오시스 주식회사 디스플레이 장치 및 그의 전극 연결 방법
US11444048B2 (en) * 2017-10-05 2022-09-13 Texas Instruments Incorporated Shaped interconnect bumps in semiconductor devices
CN109037998B (zh) * 2018-08-08 2020-06-05 武汉华星光电半导体显示技术有限公司 电连接组件及显示装置、电连接方法
US11139262B2 (en) * 2019-02-07 2021-10-05 Micron Technology, Inc. Use of pre-channeled materials for anisotropic conductors
US20200411416A1 (en) * 2019-06-27 2020-12-31 Texas Instruments Incorporated Method of making a semiconductor package having projections

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5473197A (en) * 1993-05-28 1995-12-05 Kabushiki Kaisha Toshiba Semiconductor device having bump electrodes with a trapezoidal cross-section along one axis
US5844314A (en) * 1996-12-18 1998-12-01 Lg Electronics Inc. Bump comprising protuberances and a method of forming the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5226232A (en) * 1990-05-18 1993-07-13 Hewlett-Packard Company Method for forming a conductive pattern on an integrated circuit
JP3225800B2 (ja) * 1995-08-09 2001-11-05 三菱電機株式会社 半導体装置
US5903056A (en) * 1997-04-21 1999-05-11 Lucent Technologies Inc. Conductive polymer film bonding technique

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5473197A (en) * 1993-05-28 1995-12-05 Kabushiki Kaisha Toshiba Semiconductor device having bump electrodes with a trapezoidal cross-section along one axis
US5844314A (en) * 1996-12-18 1998-12-01 Lg Electronics Inc. Bump comprising protuberances and a method of forming the same

Also Published As

Publication number Publication date
TW444300B (en) 2001-07-01
US6448663B1 (en) 2002-09-10
JP3826605B2 (ja) 2006-09-27
JP2000260798A (ja) 2000-09-22
US20020100974A1 (en) 2002-08-01
KR20000071406A (ko) 2000-11-25
CN1266283A (zh) 2000-09-13
CN1181542C (zh) 2004-12-22

Similar Documents

Publication Publication Date Title
KR100516597B1 (ko) 반도체 장치, 반도체 장치의 실장 구조, 액정 장치 및 전자 기기
US6542374B1 (en) Circuit board, method for manufacturing the circuit board, and display device and electronic equipment employing the circuit board
US7060602B2 (en) Method of manufacturing electronic part and mounting electronic part
JP2001230511A (ja) 接続構造、電気光学装置および電子機器
KR100622170B1 (ko) 전자 부품의 실장 방법, 전자 부품의 실장 구조, 전자부품 모듈 및 전자 기기
CN1171117C (zh) 电光装置、电光装置的制造方法及电子装置
JP2006113436A (ja) 表示装置
KR100485965B1 (ko) Ｉｃ 칩, ｉｃ 구조체, 액정장치 및 전자기기
US6775149B1 (en) Multichip mounted structure, electro-optical apparatus, and electronic apparatus
US7004376B2 (en) Solder printing mask, wiring board and production method thereof, electrooptical apparatus and production method thereof and electronic device and production method thereof
US6741315B1 (en) Liquid crystal device and electronic apparatus
JP4103835B2 (ja) 電子部品の製造方法
KR20040088347A (ko) 전기 광학 장치, 이 전기 광학 장치를 구비한 전자 기기,및 이 전기 광학 장치의 제조 방법
JP2001230001A (ja) 接続構造、電気光学装置および電子機器
JP3695265B2 (ja) 表示装置及び電子機器
JPH09101533A (ja) 液晶表示装置
JP2001318619A (ja) 電気光学装置、電気光学装置の製造方法および電子機器
JP2000284261A (ja) 液晶装置及び電子機器
JP2001131527A (ja) 導電接着剤、実装構造体、電気光学装置および電子機器
JP3675185B2 (ja) 配線基板、液晶装置及び電子機器
JPS60225120A (ja) 液晶表示装置
JP3567781B2 (ja) 液晶装置、液晶装置の製造方法及び電子機器
JP2000275672A (ja) 液晶装置、液晶装置の製造方法及び電子機器
JP3760624B2 (ja) 液晶表示装置およびそれを利用した電子機器
JP2000183112A (ja) 半導体チップの実装構造、液晶装置及び電子機器

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20120821

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20130819

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20140826

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20150819

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20160818

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

FPAY Annual fee payment

Payment date: 20170823

Year of fee payment: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20190819

Year of fee payment: 15

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PC1801 Expiration of term

St.27 status event code: N-4-6-H10-H14-oth-PC1801

Not in force date: 20200304

Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000