TW444300B - Semiconductor device, structure for mounting the semiconductor device, liquid crystal device, and electronic equipment - Google Patents

Semiconductor device, structure for mounting the semiconductor device, liquid crystal device, and electronic equipment Download PDF

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Publication number
TW444300B
TW444300B TW089103081A TW89103081A TW444300B TW 444300 B TW444300 B TW 444300B TW 089103081 A TW089103081 A TW 089103081A TW 89103081 A TW89103081 A TW 89103081A TW 444300 B TW444300 B TW 444300B
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TW
Taiwan
Prior art keywords
liquid crystal
electrode
semiconductor device
substrate
protruding
Prior art date
Application number
TW089103081A
Other languages
English (en)
Inventor
Kenji Uchiyama
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of TW444300B publication Critical patent/TW444300B/zh

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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    • G02F1/1345Conductors connecting electrodes to cell terminals
    • G02F1/13452Conductors connecting driver circuitry and terminals of panels
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
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  • Manufacturing & Machinery (AREA)
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  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)

Description

¢443 Ο Ο A? Β7 經濟部智慧財產局員工消費合作社印製 五、發明說明d .) 發明所屬之技術領域 本發明係關於半導體裝置(以下,簡稱爲1C)、其 實裝構造'使用此實裝構造之液晶裝置、以及使用此液晶 裝置之電子機器《 先行技術 將面朝下接合(face-down bonding)形式的1C使用向異性 導電膜(A n i s 〇 t r 〇 p i c c ο n d u c t i v e f i 1 m / A C F)進行 C 〇 G (C h i ρ 0 η Glass)實裝,或者C〇F(Chip 〇n Film)實裝的方法,可以對應於 微細間距,同時可以將很多接點統括導電接續,所以適用 於對於構成液晶面板的多數條紋狀電極等之各電極端子或 是可撓配線基板的各電極端子實裝驅動用I C。 使用此向異性導電膜實裝I C時,如第8圖(A)所 示,在玻璃基板或是可撓配線基板等基板的I C實裝區域 9留下向異性導電膜6隻後,於此向異性導電膜6的表面 上配置驅動用I C13 >。其次,如第8圖(B)所示, 使用壓接頭5將驅動用I C 1 3 >熱壓接於基板側。結果 ,向異性導電膜6的樹脂部分溶融而流動。亦即,如第8 圖(C )所示,向異性導電膜6溶融流動,在硬化反應後 ,向異性導電膜6的樹脂部分固化的緣故,驅動用 I C 1 3 >被實裝於I c實裝區域9,同時驅動用 I c 1 3 >的突起電極1 3 0 z透過被包含於向異性導電 膜6的導電粒子6 0導電接續於基板側的電極端子1 6。 此處,在突起電極1 3 0 >與電極端子1 6之間中介的導 本纸張尺度適用中國國家標準<CNS〉A4規格(210 X 297公笼)-4- -------------裝------ 訂----I---* 線' - (請先閲讀背面之;i意事項再填寫本頁) 經濟部智慧財產局負工消費合作社印製 4443 0 0 at _____ 五、發明說明€ ) 電粒子6 0的數目對於電阻或可信賴性造成極大的影響。 於如此的實裝構造 > 從前驅動用IC1 3 >的突起電 極1 3 0係隔開1 0 0 左右的間距形成的'突起電極 1 3 0 /的形狀,係粗細一定的直線狀,或者與電極端子 1 6相對方向的表面爲彎曲的形狀 發明所欲解決之課題 然而,液晶裝置(液晶顯示裝置)伴隨著像素數的增 加,突起電極1 3 0 -也有高密度配置的傾向,所以有從 前的突起電極1 3 0 ~無法對應的問題點。亦即,於驅動 用IC13# |突起電極130~的間距高密度化至40 左右的話,如第8圖(B)所示,在向異性導電膜6 溶融時,相鄰的突起電極1 3 0 >之間導電粒子6 0高密 度地聚集,而有由於聚集的導電粒子6 0使突起電極 1 30 /彼此短路的問題點》但是,使突起電極1 30 > 變細的話,突起電極1 3 0 ~與電極端子1 6之間中介的 導電粒子6 0的數目減少,有損於電阻特性或是可信賴性 〇 在此,本發明的課題在於藉由改良突起電極的構造, 提供在以狹窄的間距彤成突起電極的場合,也不會使電氣 特性或可信賴性降低,可以透過向異性導電膜導電接續突 起電極與電極端子的I C、其實裝構造、液晶裝置以及電 子機器。 本紙張尺度適用中國國家標準(CNS)A4規格(2]0* 297公釐)7〇~ — — — — — — 丨丨 111' · i 奪 I I I I ^, 1111111· ^^ i J (請先閱讀背面之ii意事項再填寫本頁) Α7 444 3 Ο Ο _Β7___ 五、發明說明?) 供解決課題之手段 爲了解決上述課題,在本發明,提供一種半導體裝置 |係具備藉由透過包含導電粒子的向異性導電膜之壓接而 導電接續於基板側電極端子之面朝下接合(face-down bonding)用的複數突起電極之半導體裝置,其特徵爲:前述 突起電極,與相對方向於前述基板的電極端子之該突起電 極的表面側相比,接近根部處變細。 將適用本發明的半導體裝置透過向異性導電膜壓接於 基板而導電接續基板側的電極端子與半導體側的突起電極 時,向異性導電膜的樹脂部分會溶融而導電粒子在半導體 裝置與基板之間從半導體裝置的內側區域向外周側流出》 此處1相關於本發明的半導體裝置的突起電極,因爲根源 部分變細的緣故,即使高密度形成突起電極,在相鄰的突 起電極之間根源部分彼此還是隔著很寬的間隙。亦即,在 向異性導電膜的樹脂部分溶融而導電粒子在半導體裝置與 基板之間要從半導體裝置的內側區域向外周側流出時,因 爲相鄰的突起電極的根源之間不會滯留多數的導電粒子, 所以導電粒子不會使突起電極彼此短路。因此,即使高密 度形成半導體裝置的突起電極,也可以得到高可信賴性。 此外,突起電極,即使在根部變細,也因爲相對方向於基 板的電極端子的表面側變粗的緣故,所以基板的電極端子 與突起電極的相對向的面積很寬廣。因此,在突起電極與 電極端子之間中介著很多導電粒子的緣故,突起電極與電 極端子之間可以良好地導電接續。 本紙張尺度適用争國國家標準(CNS>A4規格<210 X 297公楚)-Ο7 -------------------f I 訂---------I ί {請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 4443 0 0 Α7 Β7 五、發明說明θ ) ,相關於本發明的半導體裝置的實裝構造可以適用於各 種半導體裝置,但是於液晶裝置,在構成基板間封入液晶 的液晶面板的基板、以及被電路接續於該液晶面板的配線 基板之中的任一基板上實裝相關於本發明的半導體裝置的 話,更具效果。亦即,將這種液晶裝置作爲例如行動電話 等之電子機器的顯示裝置使用時•要提高液晶裝置的顯示 品質必須要增加像素數,結果,被構成於液晶面板的電極 數目增大,電極端子也被高密度配置。然而,使用相關於 本發明的半導體裝置的實裝構造的化,即使電極端子以及 突起電極被高密度配置,突起電極彼此也不會由於導電粒 子而短路,而且可以在突起電極與電極端子之間確保多數 導電粒子而良好地導電接續突起電極與電極端子。 發明之實施型態 以下參照附圖說明本發明地實施型態 (全體構成) 第1圖係被動矩陣形式的液晶裝置的外觀之立體圖, 第2圖係其分解立體圖。任一圖面,對於液晶裝置之形成 像素之條紋電極,都是省略其詳細圖示而僅模式顯示其中 一部分而已。 於第1圖及第2圖,液晶裝置1 0,具有例如由透明 玻璃所形成的第1透明基板1 ,及同樣藉由透明的玻璃所 形成的第2透明基板2。於這些基板之一方藉由印刷等形
本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ZTZ (請先閲讀背面之ijL意事項再填寫本頁》
裝-------—訂-------I 經濟部智慧时產局員工消費合作社印製 4443 0 0 經濟部智慧財產局員工消费合作社印製 Α7 Β7 五、發明說明p ) 成密封劑3,而夾著此密封劑3黏著固定第1透明基板1 與第2透明基板2。第1透明基板1與第2透明基板2之 間隙(液晶胞間隙)之中,以密封劑3所區隔形成的液晶 封入區域4 0內被封入液晶4 1。於第1透明基板1的外 側表面藉由黏著劑等被貼覆偏光板4 a,於第2透明基板 2的外側表面也藉由黏著劑等貼覆偏光板(未圖示)。 第2透明基板2較第1透明基板1更大,所以在第2 透明基板2上重疊第1透明基板1的狀態下,第2透明基 板2有一部份從第1透明基板1的下端緣伸出。 於此伸出部分形成IC實裝區域91此處半導體裝置 之驅動用IC13藉由面朝下接合被COG實裝。在此部 分之實裝構造在稍後詳述,將向異性導電膜夾在第2透明 基板2與驅動用I C 1 3之間,再藉由將此加熱壓接而進 行接合=亦即,在此部分,處於透過向異性導電膜在第2 透明基板2的IC實裝區域9的電極端子上導電接續驅動 用IC13的突起電極的狀態。 此外,於第2透明基板2,較I C實裝區域9更爲下 端之側被形成輸入端子2,於這些輸入端子以熱密封等方 法接續著可撓印刷配線基板(未圖示)。 進而,雖在第1、2圖中省略詳細圖示,但在第1透 明基板1 ,被形成在液晶封入區域4 0的內側延伸於橫方 向的複數條紋電極,及在液晶封入區域4 0的外側將條紋 狀電極配線接續於各端子之用的配線圖案所構成的電極圖 案(薄膜圖案)。此電極圖案,係以透明的IT〇(銦錫 本紙張尺度通用令囷國家標準(CNS)A4規格(2〗〇χ 297公釐) -------------裝--------訂------I ·線I J (请先閱讀背面之主t事項再填寫本頁) 經濟部智慧財產局員工消费合作社印製 4 443 0 0 A; Β7 五、發明說明p ) 氧化物)等形成。此外,於第2透明基板2的內側表面, 也被形成在液晶封入區域4 0的內側延伸於縱方向的複數 條紋電極,及在液晶封入區域4 0的外側將條紋狀電極配 線接續於IC實裝區域9等之用的配線圖案所構成的電極 圖案(薄膜圖案)。此電極圖案,也是以透明的IT〇膜 等來形成。 將如此構成的第1透明基板1與第2透明基板2在指 定處所謀求導電接續,同時如第1圖所示貼合形成面板( 液晶面板)的話,第1透明基板1的條紋狀電極與第2透 明基板2的條紋狀電極係相互交叉,於各交叉部分構成像 素。此外,於第1透明基板1與第2透明基板2之間隙, 在液晶封入區域4 0被封入液晶4 1。亦即,對驅動用 I C 1 3送入驅動用電力以及驅動訊號的話,驅動用 I C 1 3,根據驅動訊號對希望的適當的條紋狀電極施加 電壓而控制各像素之液晶4 1的配向狀態,所以在液晶裝 置10顯示出所要的影像。 (驅動用IC13的實裝構造) - 第3圖(A) 、 (B)分別是與驅動用IC13的第 2透明基板2之實裝圖的平面圖,以及其X — X —剖面圖 。第4圖(A)〜(C)係將驅動用IC實裝於基板上的 方法之工程圖β 於第1、2圖所示的液晶裝置,在1C實裝區域9聚 集多數的配線圖案的端部,該配線圖案的先端部分成爲電 本紙張尺度適用中國园家標準(CNS)A4規格(210 X 297公爱)-9- ------------------------------^ I i (請先閱讀背面之注意事項再填寫本頁> 4443 0 0 經濟部智慧財產局員工消费合作社印製 A7 B7 五、發明說明f ) 極端子。亦即,於液晶裝置1 0要提高顯示品質的話,需 要增加像素數,結果,被構成於液晶面板的條紋狀電極增 大’因此,電極端子1 6 (參照第4圖)也被高密度配置 亦即,如第3圖(A)所示,在驅動用IC13,與 第2透明電極2之實裝面1 3 a所形成的面朝下接合用的 複數突起電極1 3 0,也是液晶裝置1 0越增加像素數, 越被高密度配置。亦即,突起電極1 3 0沿著晶片的邊 1 3 b以狹窄的間距,例如以4 Ο μ m左右的間距被形成 。突起電極1 30的表面形狀,大約爲邊長1 5//m至 之四角型,相鄰的突起電極1 30彼此,在其表 面1 3 1約僅間隔2 5 // m至2 0 β m之狹窄間隙。 此處,驅動用IC13的突起電極130 *如第3圖 (B )所示,較相對方向於第2透明基板2的電極端子 1 6的表面1 3 1之側更接近根源部分1 3 2處變細。因 此,鄰接的突起電極1 3 0彼此,在其表面1 3 1約僅間 隔2 5 //m至2 0 之狹窄間隙,但是在根源部分 1 3 2則爲隔著較表面1 3 1側更寬的間隙。 以下說明如此構成的驅動用I C 1 3的實裝工程,同 時說明相關於本型態的IC實裝構造。 把相關於本型態的驅動用IC13實裝於第2透明基 板2的I C實裝區域9時,首先如第4圖(A)所示,在 第2透明基板2的IC實裝區域9留下向異性導電膜6之 後,於此向異性導電膜6的表面上,使突起電極1 3 0朝 — tl — — — — — — I I I 1 ' — — — — — II -----it (請先閲讀背面之iit事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公爱) 4443 00 經濟部智慧財產局員工消费合作社印*1衣 A7 B7 五、發明說明p ) 下而配置驅動用I c 1 3。在此向異性導電膜6,係在塑 膠製的球(b a 11 )的表面被形成金屬膜之導電粒子 6 0分散於熱硬化樹脂中的狀態下。 其次,如第4圖(B )所示,使用壓接頭5將驅動用 I C 1 3熱壓接於基板側。結果,向異性導電膜6的樹脂 部分溶融。 亦即,如第4圖(C )所示,向異性導電膜6溶融流 動,而在硬化反應後*向異性導電膜6的樹脂部分固化的 緣故,驅動用I C 1 3在被實裝於I C實裝區域9的同時 ,驅動用I C13的突起電極130,透過被包含於向異 性導電膜6的導電粒子6 0導電接續於基板側的電極端子 16° 如此實裝驅動用I C 1 3時,向異性導電膜6溶融樹 脂部分,如第3圖(A)的箭頭A所示,樹脂部分或導電 粒子6 0在驛動用I C 1 3與第2透明基板2之間,通過 突起電極1 3 0之間從驅動用I C 1 3的內側區域向外周 側流出。此處,在本型態,驅動用I C 1 3的突起電極 130,如第3圖(B)以及第4圖(A)〜(C)所示 ,因爲根源部分1 3 2變細的緣故,即使高密度形成突起 電極1 3 0,在相鄰的突起電極1 3 0之間根源部分 1 3 2彼此也隔著寬廣的間隙。亦即,向異性導電膜6的 樹脂部分或導電粒子6 0穿過突起電極1 3 0之間時,穿 過根源部分1 3 0之間的寬廣間隙。因此,在突起電極 1 3 0之間不會有多數的導電粒子6 0滯留,導電粒子 本紙張尺度適用中0 S家標準(CNS)A4規格(210 X 297公楚)-11- ------r------------------------I y (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 4443 0 0 A7 B7 五、發明說明?) 6 0不會使突起電極1 3 0彼此短路。因此,即使高密度 形成驅動用I C 1 3的突起電極1 3 0,也可得高可信賴 性。此外,突起電極130,因爲相對方向於第2透明基 板2的電極端子1 6之表面1 3 1側變粗的緣故,第2透 明基板2 2的電極端子1 6與突起電極1 3 0之對向面積 很寬。因此,突起電極13 0與電極端子1 6之間,成爲 中介著多數的導電粒子6 0 |突起電極1 3 0與電極端子 1 6可以良好地導.電接續。 (驅動用I C 1 3的突起電極1 3 0的製造方法) 以下參照第5圖說明使用於這種實裝構造的驅動用 I C 1 3的製造工程之中',形成突起電極1 3 0的方法。 第5圖(A)〜(E)係顯示突起電極1 3 0之形成方法 的工程剖面圖。 首先,如第5圖(A)所示,在構成驅動用I C 1 3 的半導體基板1 3 5的表面形成電極1 3 6之後’如第5 圖(B)所示,塗布感光性的光阻劑1 50。此感光性的 光阻劑1 5 0係負片形式。亦即,透過曝光遮罩1 5 1曝 光感光性的光阻劑1 5 0時,感光性的光阻劑1 5 0之中 ,僅有以曝光遮罩1 5 1的遮光部分1 5 2覆蓋的區域’ 如第5圖(C )所示,在蝕刻工程(顯影工程)中被除去 〇 如此進行在形成指定圖案的光阻劑1 5 0時’在如第 5圖(B )所示的曝光工程,因爲被照射的光在感光性的 夂纸張又度適用申S國家標準(CNS>A4規格(210 * 297公® ) -127 I t----------- -------I I 訂·!------1 <請先閱讀背面之注患事項再填寫本頁) 4443 0 0 A7 B7 經濟部智慧財產局員工消f合作社印製 五、發明說明(IQ ) 光阻劑1 5 0內於橫方向亦會擴散的緣故,曝光部分 1 5 5與非曝光部分1 5 6的境界成爲逆傾斜的形狀。亦 即’如第5圖C C )所示,光阻劑1 5 0的開孔部分 1 5 7,其側面壁成爲具有逆向傾斜形狀。 如此形成指定圖案的光阻劑1 5 0之後,對電極 1 36的表面施以電鍍。結果,如第5圖(D)所示,在 電極1· 3 6的表面側以掩埋光阻劑1 5 0的開孔部分 1 5 7的方式被施以電鍍1 3 5。 亦即,電鍍結束之後,除去光阻劑1 5 0的話,如第 5圖(E)所示,較表面131之側更接近根源部分 1 3 2處可以形成較細的突起電極1 3 0。 (電子機器之搭載例) 第7圖係顯示相關於本發明的電子機器之一實施型態 的行動.電話機。此處所示的行動電話機3 0,被構成爲將 天線31、喇叭32、液晶裝置10、按鍵開關33、麥 克風3 4等各種構成要素收容於作爲筐體的外裝外殼3 6 。此外,外裝外殼3 6的內部,設有搭載洪控制上述各構 成要素的動作之用的控制電路的控制電路基板3 7。液晶 裝置10係由第1圖所示的液晶裝置10所構成。 在此行動電話機3 0,透過按鍵開關3 3以及麥克風 3 4輸入的訊號,或由天線3 1收訊到的收訊資料等被輸 入製控制電路基板3 7上的控制電路。而該控制電路|根 據輸入的各種資料在液晶裝置10的顯示面內顯示數字、 本紙張尺度適用中S國家標準(CNS)A4規格(2】0 X 297公釐) -13- ---------------------訂-------I (請先閱璜背面之注意事項再填寫本頁> 經濟部智慧財產局員工消費合作社印製 4 443 0 Ο Α7 Β7_ 五、發明說明ί1 ) 文字、圖案等影像,進而,從天線送出送訊資料。此外, 在第7圖的實施型態,顯示在行動電話機使用本發明的液 晶裝置的場合作爲電子機器之例,但是本發明之液晶裝置 ,除此之外,也可以適用於例如攜帶式行動終端、電子手 冊、攝影機的觀景窗等。 此外,第6圖(a) 、 (b),係顯示搭載本型態的 液晶裝置1 0的行動電話機(電子機器)的重要部位之剖 面圖。 作爲搭載本型態的液晶裝置10的電子機器之一例, 在第6圖所示的行動電話1 0 0,於液晶裝置1 0的第1 透明基板1之側|有壓克力樹脂製或是聚碳酸酯製的透明 導光板1 9被重疊配置,由此導光板1 9與第2透明基板 2之間拉出可撓配線基板1 2 0,被導電以及機械地接續 於行動電話1 0 0本體的電路基板之印刷配線基板9 0。 鄰接於導光板19之側(或者端部),被配置朝向導光板 1 9的端部(光線入射部)射出光的背光用發光元件5 ◦ 。作爲這樣的背光用發光元件5 0使用L E D等,實裝於 印刷配線基板9 0上。在本實施例背光用發光元件5 0是 被實裝於印刷配線基板9 0上,但只要是可以朝向導光板 1 9入射的位置亦可被實裝於可撓配線基板1 2 0上,或 者實裝於印刷配線基板9 0以外的其他副基板a此處*液 晶裝置10係藉由雙面膠帶被固定於於導光體19同時以 框體1 10壓住。此外,導光板19固定液晶裝置10同 時藉由與印刷配線基板9 0之嵌合等方法保持爲一體’同 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -14- ----------ί·裝-------I 訂---I--- - * 線 Ϊ i <請先閱讀背面之注意事項再填寫本頁) 4443 0 0 Α7 Β7 五、發明說明(2 ) 時也被固定於行動電話100的框體1 10。此外’於第 2透明基板2之側覆蓋有外蓋玻璃111。 (其他實施型態) 又,在上述實施型態,顯示對構成液晶面板的第2透 明基板2 COG實裝驅動用I C 1 3之例,但是亦有驅動 用I C1 3對於對液晶面板電路接續的可撓配線基板 COF實裝的場合。這種場合,也只要參照第4圖(A) 〜(C)所說明的實裝工程,取代第2透明基板2,在可 撓配線基扳上透過向異性導電膜6實裝驅動用IC即可。 發明之效果 如以上所說明的,在本發明因爲I c的突起電極在根 源部分變細,所以即使高密度形成突起電極,在相鄰的突 起電極之間根源部彼此也隔著寬廣的間隔β亦即,透過向 異性導電膜將I C實裝於基板時,向異性導電膜溶融而從 突起電極之間流出時,相鄰的突起電極的根源部彼此之間 不會滯留多數的導電粒子,因此導電粒子不會使突起電極 彼此短路。因此|即使高密度形成I C的突起電極,也可 得高可信賴度。此外,突起電極,因爲相對方向於基板的 電極端子的表面側變粗,所以基板的電極端子與突起電極 相對方向的面積很寬。因此,在突起電極與電極端子之間 ,中介著多數導電粒子,所以突起電極與電極端子可以良 好地導電接續。 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) '15- (請先閱讀背面之注意事項再填寫本頁) ' ------I I ^ - — II--> 1 I I. 經濟部智慧財產局員工消費合作社印製 4443 0 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明03 〉 圖面之簡單說明 第1圖係顯示適用本發明的液晶裝置的外觀之立體圖 〇 第2圖係顯示第1圖之液晶裝置的分解立體圖。 第3圖(A ) 、( B )分別是顯示於第1圖的形成於 驅動用I C的突起電極的配置之平面圖,以及其X- X z 剖面圖。 第4圖(A)〜(C)係將顯示於第3圖的驅動用 1c實裝於構成液晶面板的第2透明基板上的工程之工程 剖面圖。 第5圖(A)〜(E)係顯示第3圖的驅動用I C的 突起電極之形成方法的工程剖面圖。 第6圖(A) 、 (B)分別係顯示適用本發明的搭載 液晶裝置的行動電話(電子機器)的重要部位之剖面圖。 第7圖係顯示適用本發明的搭載液晶裝置的行動電話 (電子機器)的說明圖。 第8圖(A)〜(C)係顯示對基板之從前的驅動用 IC的實裝工程之工程剖面圖。 主要元件符號說明 1 第1透明基板 2 第2透明基板 3 密封劑 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公芨)-16- -------------- --------訂 -----, {請先閉讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 4443 00 A7 _B7 五、發明說明《Η ) 6 向; 異性 導 電 膜 9 I C實 裝 區 域 1 0 液£ f曰裝 置 1 3 驅動用 I C 1 6 電極端 子 1 9 導光板 4 0 液b f日封 入 區 域 4 1 液^ r0 5 0 背光用 發 光 元 件 6 0 向異性 導 電 膜 之 導 電 粒 子 9 0 印刷配 線 基 板 1 0 0 行 動 電 話 ( 電 子 機 器) 1 1 0 框 體 1 1 1 外 蓋 玻 璃 1 2 0 可 撓 配 線 基 板 1 3 0 突 起 電 極 1 3 1 突 起 電 極 的 表 面 1 3 2 突 起 電 極 的根 源 部 分 ------------装--------訂- --------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中舀因家標準(CNS)A4規格(210x297公釐) T7

Claims (1)

  1. A8B8CSD8 4443 Ο Ο 六、申請專利範圍 1 . 一種半導體裝置,係具備藉由透過包含導電粒子 的向異性導電膜之壓接而導電接續於基板側電極端子之面 朝下接合(f a c e - d 〇 w n b ο n d i n g)用的複數突起電極之半導體裝 置,其特徵爲: 前述突起電極,與相對方向於前述基板的電極端子之 該突起電極的表面側相比,接近根部處變細。 2 . —種半導體裝置之實裝構造,其特徵係使用前述 向異性導電膜將申請專利範圍第1項之半導體裝置壓接於 前述基板。 3 . —種液晶裝置,係使用申請專利範圍第2項之半 導體裝置的實裝構造之液晶裝置*其特徵爲:構成基板間 被封入液晶的液晶面板的基板,以及被導電接續於該液晶 面板的配線基板之中的至少一方基板上被實裝前述半導體 裝置。 4 . 一種電子機器,其特徵爲:裝設有申請專利範圍 第3項之液晶裝置。 (請先閱讀背面之注意事項再填寫本頁) r ---- I---I ----I----I 經濟部智慧財產局具工消費合作社印製 n * -.1 I I n · 本紙張尺度適用令國國家標準(CNS>A4規格(210* 297公釐) -18-
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