CN1181542C - 半导体装置、半导体装置的安装结构、液晶装置和电子装置 - Google Patents

半导体装置、半导体装置的安装结构、液晶装置和电子装置 Download PDF

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Publication number
CN1181542C
CN1181542C CNB001041207A CN00104120A CN1181542C CN 1181542 C CN1181542 C CN 1181542C CN B001041207 A CNB001041207 A CN B001041207A CN 00104120 A CN00104120 A CN 00104120A CN 1181542 C CN1181542 C CN 1181542C
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CN
China
Prior art keywords
liquid crystal
electrode
semiconductor device
substrate
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CNB001041207A
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English (en)
Chinese (zh)
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CN1266283A (zh
Inventor
������ɽ����
内山宪治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
BOE Technology HK Ltd
Original Assignee
Seiko Epson Corp
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Publication date
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Publication of CN1266283A publication Critical patent/CN1266283A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01255—Changing the shapes of bumps by using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
CNB001041207A 1999-03-08 2000-03-07 半导体装置、半导体装置的安装结构、液晶装置和电子装置 Expired - Lifetime CN1181542C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60459/1999 1999-03-08
JP06045999A JP3826605B2 (ja) 1999-03-08 1999-03-08 半導体装置の実装構造の製造方法、液晶装置、および電子機器

Publications (2)

Publication Number Publication Date
CN1266283A CN1266283A (zh) 2000-09-13
CN1181542C true CN1181542C (zh) 2004-12-22

Family

ID=13142881

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB001041207A Expired - Lifetime CN1181542C (zh) 1999-03-08 2000-03-07 半导体装置、半导体装置的安装结构、液晶装置和电子装置

Country Status (5)

Country Link
US (1) US6448663B1 (https=)
JP (1) JP3826605B2 (https=)
KR (1) KR100516597B1 (https=)
CN (1) CN1181542C (https=)
TW (1) TW444300B (https=)

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US6995753B2 (en) * 2000-06-06 2006-02-07 Semiconductor Energy Laboratory Co., Ltd. Display device and method of manufacturing the same
JP3892650B2 (ja) * 2000-07-25 2007-03-14 株式会社日立製作所 液晶表示装置
JP3781967B2 (ja) * 2000-12-25 2006-06-07 株式会社日立製作所 表示装置
JP3756418B2 (ja) * 2001-02-28 2006-03-15 株式会社日立製作所 液晶表示装置及びその製造方法
US6806938B2 (en) * 2001-08-30 2004-10-19 Kyocera Corporation Liquid crystal display device with particular on substrate wiring, portable terminal and display equipment provided with the liquid crystal display device
JP2003121815A (ja) * 2001-10-16 2003-04-23 Nec Access Technica Ltd Ｌｃｄの保持構造
JP3573150B2 (ja) 2002-01-25 2004-10-06 セイコーエプソン株式会社 半導体装置及びこれを含む電気光学装置
KR100499134B1 (ko) * 2002-10-28 2005-07-04 삼성전자주식회사 압축 접합 방법
JP2004184805A (ja) * 2002-12-05 2004-07-02 Tohoku Pioneer Corp 導電配線の接続構造
KR20040075377A (ko) * 2003-02-20 2004-08-30 삼성전자주식회사 구동 아이씨 및 이를 갖는 디스플레이 장치
CN1325983C (zh) * 2003-05-27 2007-07-11 友达光电股份有限公司 液晶显示面板的封装结构及其制作工艺
JP4004994B2 (ja) 2003-06-05 2007-11-07 株式会社アドバンスト・ディスプレイ 表示装置
CN100356559C (zh) * 2003-09-24 2007-12-19 财团法人工业技术研究院 倒装芯片封装结构及其制造方法
TWI277815B (en) * 2004-01-16 2007-04-01 Hannstar Display Corp Liquid crystal display and manufacturing method of liquid crystal display including substrate
CN100416343C (zh) * 2004-01-21 2008-09-03 友达光电股份有限公司 增加金属连线可靠度的结构
CN1297840C (zh) * 2004-03-25 2007-01-31 友达光电股份有限公司 显示器的导线结构
CN101189625B (zh) * 2005-05-31 2011-09-28 株式会社半导体能源研究所 半导体器件及其制造方法以及天线的制造方法
JP4851255B2 (ja) * 2006-07-14 2012-01-11 株式会社 日立ディスプレイズ 表示装置
JP4920330B2 (ja) * 2006-07-18 2012-04-18 ソニー株式会社 実装構造体の実装方法、発光ダイオードディスプレイの実装方法、発光ダイオードバックライトの実装方法および電子機器の実装方法
JP2008235556A (ja) * 2007-03-20 2008-10-02 Sumitomo Electric Ind Ltd 配線板モジュール及び該配線板モジュールの製造方法
KR101285273B1 (ko) * 2007-06-15 2013-07-23 엘지디스플레이 주식회사 이동통신기기
CN101216619B (zh) * 2008-01-10 2010-09-22 友达光电股份有限公司 平面显示器及其制造方法和光电装置及其制造方法
CN101556838B (zh) * 2008-04-09 2011-06-01 北京京东方光电科技有限公司 各向异性导电膜
TW201123377A (en) * 2009-12-16 2011-07-01 Raydium Semiconductor Corp Electronic chip and substrate with void
US9142533B2 (en) 2010-05-20 2015-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate interconnections having different sizes
KR101375298B1 (ko) * 2011-12-20 2014-03-19 제일모직주식회사 전도성 미립자 및 이를 포함하는 이방 전도성 필름
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JP6645730B2 (ja) * 2014-01-28 2020-02-14 デクセリアルズ株式会社 接続体及び接続体の製造方法
KR20150094125A (ko) * 2014-02-10 2015-08-19 한국전자통신연구원 반도체 소자 및 이를 제조하는 방법
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CN106486511B (zh) * 2015-08-25 2020-04-28 上海和辉光电有限公司 一种显示器件及制备有机发光二极管显示面板的方法
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Also Published As

Publication number Publication date
TW444300B (en) 2001-07-01
US6448663B1 (en) 2002-09-10
JP3826605B2 (ja) 2006-09-27
JP2000260798A (ja) 2000-09-22
US20020100974A1 (en) 2002-08-01
KR20000071406A (ko) 2000-11-25
KR100516597B1 (ko) 2005-09-22
CN1266283A (zh) 2000-09-13

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SE01 Entry into force of request for substantive examination
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Effective date of registration: 20160612

Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No.

Patentee after: BOE TECHNOLOGY GROUP Co.,Ltd.

Address before: Hongkong, China

Patentee before: BOE Technology (Hongkong) Co.,Ltd.

Effective date of registration: 20160612

Address after: Hongkong, China

Patentee after: BOE Technology (Hongkong) Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: Seiko Epson Corp.

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Granted publication date: 20041222

CX01 Expiry of patent term