KR100510977B1 - 화학기계연마용 연마제 및 기판의 연마법 - Google Patents

화학기계연마용 연마제 및 기판의 연마법 Download PDF

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Publication number
KR100510977B1
KR100510977B1 KR10-2002-7001957A KR20027001957A KR100510977B1 KR 100510977 B1 KR100510977 B1 KR 100510977B1 KR 20027001957 A KR20027001957 A KR 20027001957A KR 100510977 B1 KR100510977 B1 KR 100510977B1
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KR
South Korea
Prior art keywords
polishing
abrasive
chemical mechanical
tantalum
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR10-2002-7001957A
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English (en)
Korean (ko)
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KR20020021408A (ko
Inventor
쿠라타야스시
카미가타야스오
우치다타케시
테라사키히로키
이가라시아키코
Original Assignee
히다치 가세고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20020021408A publication Critical patent/KR20020021408A/ko
Application granted granted Critical
Publication of KR100510977B1 publication Critical patent/KR100510977B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR10-2002-7001957A 1999-08-17 2000-08-17 화학기계연마용 연마제 및 기판의 연마법 Expired - Lifetime KR100510977B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-1999-00230930 1999-08-17
JP23093099 1999-08-17
JPJP-P-1999-00308665 1999-10-29
JP30866599 1999-10-29

Publications (2)

Publication Number Publication Date
KR20020021408A KR20020021408A (ko) 2002-03-20
KR100510977B1 true KR100510977B1 (ko) 2005-08-31

Family

ID=26529617

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2002-7001957A Expired - Lifetime KR100510977B1 (ko) 1999-08-17 2000-08-17 화학기계연마용 연마제 및 기판의 연마법

Country Status (8)

Country Link
US (2) US7744666B2 (https=)
EP (1) EP1211717B1 (https=)
JP (3) JP3954383B2 (https=)
KR (1) KR100510977B1 (https=)
CN (1) CN101792655B (https=)
AU (1) AU6594200A (https=)
TW (1) TW501197B (https=)
WO (1) WO2001013417A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101279963B1 (ko) * 2008-12-24 2013-07-05 제일모직주식회사 금속 배선 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마 방법

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Also Published As

Publication number Publication date
KR20020021408A (ko) 2002-03-20
US7744666B2 (en) 2010-06-29
CN101792655B (zh) 2013-05-01
EP1211717B1 (en) 2016-04-13
JP2011082537A (ja) 2011-04-21
US20060124597A1 (en) 2006-06-15
EP1211717A4 (en) 2007-03-28
WO2001013417A1 (fr) 2001-02-22
TW501197B (en) 2002-09-01
AU6594200A (en) 2001-03-13
US20060037251A1 (en) 2006-02-23
JP2012182473A (ja) 2012-09-20
EP1211717A1 (en) 2002-06-05
US7319072B2 (en) 2008-01-15
JP5472049B2 (ja) 2014-04-16
CN101792655A (zh) 2010-08-04
JP3954383B2 (ja) 2007-08-08

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