KR100461662B1 - 동 클래드 적층판 - Google Patents
동 클래드 적층판 Download PDFInfo
- Publication number
- KR100461662B1 KR100461662B1 KR10-2002-7005146A KR20027005146A KR100461662B1 KR 100461662 B1 KR100461662 B1 KR 100461662B1 KR 20027005146 A KR20027005146 A KR 20027005146A KR 100461662 B1 KR100461662 B1 KR 100461662B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper foil
- copper
- foil
- laminated board
- copper clad
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
Claims (4)
- 두께가 다른 동박을 양면에 맞붙인 양면 동 클래드 적층판에 있어서,한쪽 면 쪽에 동 클래드 적층판을 제조할 때의 열간 프레스 가공으로 재결정되지 않는 제1동박을 사용하고, 다른 면 쪽에 동 클래드 적층판을 제조할 때의 열간 프레스 가공으로 재결정되는 성질의 제2동박을 사용하며, 또한 제2동박의 두께가 제1동박보다도 두꺼운 것을 특징으로 하는 동 클래드 적층판.
- 두께가 다른 동박을 양면에 맞붙인 양면 동 클래드 적층판에 있어서,한쪽 면 쪽에 제1동박을 사용하고, 다른 면 쪽에 제1동박보다도 열간 프레스 가공으로 재결정되기 쉬운 성질을 가지는 제2동박을 사용하며, 또한 제2동박의 두께가 제1동박보다도 두꺼운 것을 특징으로 하는 동 클래드 적층판.
- 두께가 다른 동박을 양면에 맞붙인 양면 동 클래드 적층판에 있어서,한쪽 면 쪽에 제1동박을 사용하고, 다른 면 쪽에 제1동박보다도 열간 프레스 가공으로 가해지는 열량에 의해 가열수축하기 쉬운 성질을 가지는 제2동박을 사용하며, 또한 제2동박의 두께가 제1동박보다도 두꺼운 것을 특징으로 하는 동 클래드 적층판.
- 두께가 다른 동박을 양면에 맞붙인 양면 동 클래드 적층판에 있어서,한쪽 면 쪽에 제1동박을 사용하고, 다른 면 쪽에 제1동박보다도 낮은 영율(young's modulus)을 가지는 제2동박을 사용하며, 또한 제2동박의 두께가 제1동박보다도 두꺼운 것을 특징으로 하는 동 클래드 적층판.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2000-00255490 | 2000-08-25 | ||
JP2000255490A JP3396465B2 (ja) | 2000-08-25 | 2000-08-25 | 銅張積層板 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020043235A KR20020043235A (ko) | 2002-06-08 |
KR100461662B1 true KR100461662B1 (ko) | 2004-12-17 |
Family
ID=18744268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2002-7005146A KR100461662B1 (ko) | 2000-08-25 | 2001-08-22 | 동 클래드 적층판 |
Country Status (9)
Country | Link |
---|---|
US (2) | US7358189B2 (ko) |
EP (1) | EP1264683B1 (ko) |
JP (1) | JP3396465B2 (ko) |
KR (1) | KR100461662B1 (ko) |
CN (1) | CN1250394C (ko) |
AT (1) | ATE255004T1 (ko) |
DE (1) | DE60101320D1 (ko) |
TW (1) | TW511400B (ko) |
WO (1) | WO2002016129A1 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100477891C (zh) * | 2003-01-16 | 2009-04-08 | 富士通株式会社 | 多层布线基板及其制造方法、纤维强化树脂基板制造方法 |
JP4546044B2 (ja) * | 2003-05-29 | 2010-09-15 | 三井化学株式会社 | 反りの小さい樹脂金属積層板及びその製造方法 |
TW200704833A (en) * | 2005-06-13 | 2007-02-01 | Mitsui Mining & Smelting Co | Surface treated copper foil, process for producing surface treated copper foil, and surface treated copper foil with very thin primer resin layer |
JP5689284B2 (ja) * | 2009-11-11 | 2015-03-25 | 新日鉄住金化学株式会社 | フレキシブル両面銅張積層板の製造方法 |
JP5463205B2 (ja) | 2010-05-27 | 2014-04-09 | 日本メクトロン株式会社 | フレキシブル回路基板 |
US9105535B2 (en) | 2012-06-19 | 2015-08-11 | International Business Machines Corporation | Copper feature design for warpage control of substrates |
CN103225094B (zh) * | 2013-05-20 | 2015-09-09 | 深圳市博敏电子有限公司 | 一种盲孔板电镀单面电流保护方法 |
US9563732B1 (en) * | 2016-01-26 | 2017-02-07 | International Business Machines Corporation | In-plane copper imbalance for warpage prediction |
US11245075B2 (en) | 2020-05-25 | 2022-02-08 | International Business Machines Corporation | Optimum warp in organic substrates |
CN114698223B (zh) * | 2020-12-29 | 2024-06-14 | 广东生益科技股份有限公司 | 一种覆不对称金属箔的层压板和包含其的印刷线路板 |
CN114615834A (zh) * | 2022-04-11 | 2022-06-10 | 广州广合科技股份有限公司 | 一种不对称叠构pcb板的设计方法及pcb板 |
US12082334B2 (en) | 2022-04-14 | 2024-09-03 | Hamilton Sundstrand Corporation | Devices and methods to improve thermal conduction from SMT and chip on board components to chassis heat sinking |
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US3936548A (en) * | 1973-02-28 | 1976-02-03 | Perstorp Ab | Method for the production of material for printed circuits and material for printed circuits |
US4313995A (en) * | 1976-11-08 | 1982-02-02 | Fortin Laminating Corporation | Circuit board and method for producing same |
JPS58140240A (ja) * | 1982-02-15 | 1983-08-19 | 松下電工株式会社 | 両面銅張積層板 |
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JPH0639155B2 (ja) * | 1986-02-21 | 1994-05-25 | 名幸電子工業株式会社 | 銅張積層板の製造方法 |
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US5436301A (en) * | 1988-05-09 | 1995-07-25 | Teijin Limited | Epoxy resin-impregnated prepreg |
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JPH05309782A (ja) * | 1992-05-15 | 1993-11-22 | Matsushita Electric Works Ltd | 銅張り積層板の製造方法 |
US5785789A (en) * | 1993-03-18 | 1998-07-28 | Digital Equipment Corporation | Low dielectric constant microsphere filled layers for multilayer electrical structures |
JPH0722731A (ja) * | 1993-06-30 | 1995-01-24 | Matsushita Electric Works Ltd | 両面銅張り積層板の製造方法 |
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JPH10330983A (ja) * | 1997-05-30 | 1998-12-15 | Fukuda Metal Foil & Powder Co Ltd | 電解銅箔及びその製造方法 |
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JP3612594B2 (ja) * | 1998-05-29 | 2005-01-19 | 三井金属鉱業株式会社 | 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法 |
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US6575146B1 (en) * | 1999-10-22 | 2003-06-10 | Toyota Jidosha Kabushiki Kaisha | Diagnostic apparatus for an evaporated fuel system, and vehicle control apparatus for a vehicle equipped with the diagnostic apparatus |
JP3670179B2 (ja) * | 1999-11-11 | 2005-07-13 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いた銅張積層板 |
JP3521074B2 (ja) * | 2000-01-06 | 2004-04-19 | 三井金属鉱業株式会社 | 電解銅箔の物性検査方法 |
KR20010076396A (ko) * | 2000-01-25 | 2001-08-11 | 히라이 가쯔히꼬 | 폴리페닐렌 설파이드 필름과 그 제조방법 및 회로기판 |
US6489035B1 (en) * | 2000-02-08 | 2002-12-03 | Gould Electronics Inc. | Applying resistive layer onto copper |
US6660406B2 (en) * | 2000-07-07 | 2003-12-09 | Mitsui Mining & Smelting Co., Ltd. | Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit |
JP2002033581A (ja) * | 2000-07-13 | 2002-01-31 | Mitsui Mining & Smelting Co Ltd | 銅張積層板の製造方法 |
US6893742B2 (en) * | 2001-02-15 | 2005-05-17 | Olin Corporation | Copper foil with low profile bond enhancement |
-
2000
- 2000-08-25 JP JP2000255490A patent/JP3396465B2/ja not_active Expired - Fee Related
-
2001
- 2001-08-03 TW TW090118985A patent/TW511400B/zh not_active IP Right Cessation
- 2001-08-10 US US09/925,740 patent/US7358189B2/en not_active Expired - Fee Related
- 2001-08-22 KR KR10-2002-7005146A patent/KR100461662B1/ko active IP Right Grant
- 2001-08-22 AT AT01958387T patent/ATE255004T1/de not_active IP Right Cessation
- 2001-08-22 EP EP01958387A patent/EP1264683B1/en not_active Expired - Lifetime
- 2001-08-22 CN CNB018025293A patent/CN1250394C/zh not_active Expired - Fee Related
- 2001-08-22 WO PCT/JP2001/007172 patent/WO2002016129A1/ja active IP Right Grant
- 2001-08-22 DE DE60101320T patent/DE60101320D1/de not_active Expired - Lifetime
-
2008
- 2008-02-25 US US12/036,537 patent/US7851053B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20080171220A1 (en) | 2008-07-17 |
JP3396465B2 (ja) | 2003-04-14 |
CN1388777A (zh) | 2003-01-01 |
EP1264683A1 (en) | 2002-12-11 |
US7358189B2 (en) | 2008-04-15 |
CN1250394C (zh) | 2006-04-12 |
KR20020043235A (ko) | 2002-06-08 |
US7851053B2 (en) | 2010-12-14 |
EP1264683B1 (en) | 2003-11-26 |
EP1264683A4 (en) | 2003-02-12 |
TW511400B (en) | 2002-11-21 |
ATE255004T1 (de) | 2003-12-15 |
WO2002016129A1 (fr) | 2002-02-28 |
JP2002067221A (ja) | 2002-03-05 |
US20020041032A1 (en) | 2002-04-11 |
DE60101320D1 (de) | 2004-01-08 |
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