DE60101320D1 - Kupferkaschiertes laminat - Google Patents

Kupferkaschiertes laminat

Info

Publication number
DE60101320D1
DE60101320D1 DE60101320T DE60101320T DE60101320D1 DE 60101320 D1 DE60101320 D1 DE 60101320D1 DE 60101320 T DE60101320 T DE 60101320T DE 60101320 T DE60101320 T DE 60101320T DE 60101320 D1 DE60101320 D1 DE 60101320D1
Authority
DE
Germany
Prior art keywords
copper
foil
laminate
laminated laminate
copper laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60101320T
Other languages
English (en)
Inventor
Takuya Yamamoto
Seiji Nagatani
Masahiko Nakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Application granted granted Critical
Publication of DE60101320D1 publication Critical patent/DE60101320D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE60101320T 2000-08-25 2001-08-22 Kupferkaschiertes laminat Expired - Lifetime DE60101320D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000255490A JP3396465B2 (ja) 2000-08-25 2000-08-25 銅張積層板
PCT/JP2001/007172 WO2002016129A1 (fr) 2000-08-25 2001-08-22 Lamine plaque cuivre

Publications (1)

Publication Number Publication Date
DE60101320D1 true DE60101320D1 (de) 2004-01-08

Family

ID=18744268

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60101320T Expired - Lifetime DE60101320D1 (de) 2000-08-25 2001-08-22 Kupferkaschiertes laminat

Country Status (9)

Country Link
US (2) US7358189B2 (de)
EP (1) EP1264683B1 (de)
JP (1) JP3396465B2 (de)
KR (1) KR100461662B1 (de)
CN (1) CN1250394C (de)
AT (1) ATE255004T1 (de)
DE (1) DE60101320D1 (de)
TW (1) TW511400B (de)
WO (1) WO2002016129A1 (de)

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* Cited by examiner, † Cited by third party
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CN100477891C (zh) * 2003-01-16 2009-04-08 富士通株式会社 多层布线基板及其制造方法、纤维强化树脂基板制造方法
JP4546044B2 (ja) * 2003-05-29 2010-09-15 三井化学株式会社 反りの小さい樹脂金属積層板及びその製造方法
TW200704833A (en) * 2005-06-13 2007-02-01 Mitsui Mining & Smelting Co Surface treated copper foil, process for producing surface treated copper foil, and surface treated copper foil with very thin primer resin layer
JP5689284B2 (ja) * 2009-11-11 2015-03-25 新日鉄住金化学株式会社 フレキシブル両面銅張積層板の製造方法
JP5463205B2 (ja) 2010-05-27 2014-04-09 日本メクトロン株式会社 フレキシブル回路基板
US9105535B2 (en) 2012-06-19 2015-08-11 International Business Machines Corporation Copper feature design for warpage control of substrates
CN103225094B (zh) * 2013-05-20 2015-09-09 深圳市博敏电子有限公司 一种盲孔板电镀单面电流保护方法
US9563732B1 (en) * 2016-01-26 2017-02-07 International Business Machines Corporation In-plane copper imbalance for warpage prediction
US11245075B2 (en) 2020-05-25 2022-02-08 International Business Machines Corporation Optimum warp in organic substrates
CN114698223B (zh) * 2020-12-29 2024-06-14 广东生益科技股份有限公司 一种覆不对称金属箔的层压板和包含其的印刷线路板
CN114615834A (zh) * 2022-04-11 2022-06-10 广州广合科技股份有限公司 一种不对称叠构pcb板的设计方法及pcb板
US12082334B2 (en) 2022-04-14 2024-09-03 Hamilton Sundstrand Corporation Devices and methods to improve thermal conduction from SMT and chip on board components to chassis heat sinking

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3936548A (en) * 1973-02-28 1976-02-03 Perstorp Ab Method for the production of material for printed circuits and material for printed circuits
US4313995A (en) * 1976-11-08 1982-02-02 Fortin Laminating Corporation Circuit board and method for producing same
JPS58140240A (ja) * 1982-02-15 1983-08-19 松下電工株式会社 両面銅張積層板
US4751146A (en) * 1985-07-09 1988-06-14 Showa Denko Kabushiki Kaisha Printed circuit boards
JPH0639155B2 (ja) * 1986-02-21 1994-05-25 名幸電子工業株式会社 銅張積層板の製造方法
US5102749A (en) * 1988-01-27 1992-04-07 W. R. Grace & Co.-Conn. Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite
US5436301A (en) * 1988-05-09 1995-07-25 Teijin Limited Epoxy resin-impregnated prepreg
DE68923904T2 (de) * 1988-05-20 1996-03-14 Mitsubishi Gas Chemical Co Verfahren zur Herstellung eines mit einer dünnen Kupferfolie kaschierten Substrats für Schaltungsplatten.
DE3924225C2 (de) * 1988-07-22 1994-01-27 Mitsubishi Electric Corp Verfahren zur Herstellung eines Keramik-Metall-Verbundsubstrats sowie Keramik-Metall-Verbundsubstrat
US5254191A (en) * 1990-10-04 1993-10-19 E. I. Du Pont De Nemours And Company Method for reducing shrinkage during firing of ceramic bodies
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
JPH05309782A (ja) * 1992-05-15 1993-11-22 Matsushita Electric Works Ltd 銅張り積層板の製造方法
US5785789A (en) * 1993-03-18 1998-07-28 Digital Equipment Corporation Low dielectric constant microsphere filled layers for multilayer electrical structures
JPH0722731A (ja) * 1993-06-30 1995-01-24 Matsushita Electric Works Ltd 両面銅張り積層板の製造方法
JPH0732544A (ja) * 1993-07-22 1995-02-03 Mitsui Mining & Smelting Co Ltd 紙基材銅張積層板およびその製造方法
JPH07314603A (ja) * 1993-12-28 1995-12-05 Nippon Denkai Kk 銅張積層体、多層プリント回路板及びそれらの処理方法
EP0675673A3 (de) * 1994-03-30 1997-03-05 Nitto Denko Corp Verstärkung für flexible Leiterplatte und verstärkte flexible Leiterplatte.
US6027826A (en) * 1994-06-16 2000-02-22 The United States Of America As Represented By The Secretary Of The Air Force Method for making ceramic-metal composites and the resulting composites
JPH08193188A (ja) * 1995-01-18 1996-07-30 Mitsui Mining & Smelting Co Ltd 銅箔用接着剤および該接着剤付き銅箔
US5679230A (en) * 1995-08-21 1997-10-21 Oak-Mitsui, Inc. Copper foil for printed circuit boards
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JPH1034820A (ja) * 1996-07-18 1998-02-10 Mitsui Petrochem Ind Ltd 非対称両面フレキシブル金属箔積層板の製造方法
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JPH10330983A (ja) * 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
US6270889B1 (en) * 1998-01-19 2001-08-07 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
JP3612594B2 (ja) * 1998-05-29 2005-01-19 三井金属鉱業株式会社 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法
JP3856581B2 (ja) * 1999-01-18 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2001089892A (ja) * 1999-09-21 2001-04-03 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びその製造方法並びにそのキャリア箔付電解銅箔を用いた銅張積層板
US6575146B1 (en) * 1999-10-22 2003-06-10 Toyota Jidosha Kabushiki Kaisha Diagnostic apparatus for an evaporated fuel system, and vehicle control apparatus for a vehicle equipped with the diagnostic apparatus
JP3670179B2 (ja) * 1999-11-11 2005-07-13 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いた銅張積層板
JP3521074B2 (ja) * 2000-01-06 2004-04-19 三井金属鉱業株式会社 電解銅箔の物性検査方法
KR20010076396A (ko) * 2000-01-25 2001-08-11 히라이 가쯔히꼬 폴리페닐렌 설파이드 필름과 그 제조방법 및 회로기판
US6489035B1 (en) * 2000-02-08 2002-12-03 Gould Electronics Inc. Applying resistive layer onto copper
US6660406B2 (en) * 2000-07-07 2003-12-09 Mitsui Mining & Smelting Co., Ltd. Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit
JP2002033581A (ja) * 2000-07-13 2002-01-31 Mitsui Mining & Smelting Co Ltd 銅張積層板の製造方法
US6893742B2 (en) * 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement

Also Published As

Publication number Publication date
US20080171220A1 (en) 2008-07-17
JP3396465B2 (ja) 2003-04-14
CN1388777A (zh) 2003-01-01
EP1264683A1 (de) 2002-12-11
US7358189B2 (en) 2008-04-15
CN1250394C (zh) 2006-04-12
KR20020043235A (ko) 2002-06-08
US7851053B2 (en) 2010-12-14
EP1264683B1 (de) 2003-11-26
EP1264683A4 (de) 2003-02-12
TW511400B (en) 2002-11-21
ATE255004T1 (de) 2003-12-15
WO2002016129A1 (fr) 2002-02-28
JP2002067221A (ja) 2002-03-05
US20020041032A1 (en) 2002-04-11
KR100461662B1 (ko) 2004-12-17

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Legal Events

Date Code Title Description
8332 No legal effect for de