KR100371457B1 - 암전류 감소 가드링 - Google Patents

암전류 감소 가드링 Download PDF

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Publication number
KR100371457B1
KR100371457B1 KR10-2000-7003432A KR20007003432A KR100371457B1 KR 100371457 B1 KR100371457 B1 KR 100371457B1 KR 20007003432 A KR20007003432 A KR 20007003432A KR 100371457 B1 KR100371457 B1 KR 100371457B1
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KR
South Korea
Prior art keywords
region
photodiode
substrate
hdr
conductivity type
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Expired - Fee Related
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KR10-2000-7003432A
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English (en)
Korean (ko)
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KR20010030818A (ko
Inventor
클락로렌스티
베일리마크에이
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인텔 코오퍼레이션
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Publication of KR20010030818A publication Critical patent/KR20010030818A/ko
Application granted granted Critical
Publication of KR100371457B1 publication Critical patent/KR100371457B1/ko
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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/21Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
    • H10F30/28Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices being characterised by field-effect operation, e.g. junction field-effect phototransistors
    • H10F30/2823Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices being characterised by field-effect operation, e.g. junction field-effect phototransistors the devices being conductor-insulator-semiconductor devices, e.g. diodes or charge-coupled devices [CCD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/15Charge-coupled device [CCD] image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/807Pixel isolation structures

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
KR10-2000-7003432A 1997-09-30 1998-07-06 암전류 감소 가드링 Expired - Fee Related KR100371457B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/941,800 1997-09-30
US08/941,800 US5859450A (en) 1997-09-30 1997-09-30 Dark current reducing guard ring
US8/941,800 1997-09-30

Publications (2)

Publication Number Publication Date
KR20010030818A KR20010030818A (ko) 2001-04-16
KR100371457B1 true KR100371457B1 (ko) 2003-02-07

Family

ID=25477082

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2000-7003432A Expired - Fee Related KR100371457B1 (ko) 1997-09-30 1998-07-06 암전류 감소 가드링

Country Status (9)

Country Link
US (1) US5859450A (enExample)
EP (1) EP1034570B1 (enExample)
JP (1) JP4309574B2 (enExample)
KR (1) KR100371457B1 (enExample)
AU (1) AU8291798A (enExample)
DE (1) DE69833760T2 (enExample)
RU (1) RU2178600C1 (enExample)
TW (1) TW441119B (enExample)
WO (1) WO1999017380A1 (enExample)

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KR101804268B1 (ko) * 2010-11-02 2018-01-11 삼성전자주식회사 후면수광 이미지 센서에서 노이즈 차단을 위한 깊은 가드링 구조 및 잡음방지영역을 갖는 이미지센서 및 그 제조방법

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US6545711B1 (en) * 1998-11-02 2003-04-08 Agilent Technologies, Inc. Photo diode pixel sensor array having a guard ring
US6073343A (en) * 1998-12-22 2000-06-13 General Electric Company Method of providing a variable guard ring width between detectors on a substrate
US6147366A (en) * 1999-02-08 2000-11-14 Intel Corporation On chip CMOS optical element
US6310366B1 (en) * 1999-06-16 2001-10-30 Micron Technology, Inc. Retrograde well structure for a CMOS imager
US6445014B1 (en) * 1999-06-16 2002-09-03 Micron Technology Inc. Retrograde well structure for a CMOS imager
US6512401B2 (en) * 1999-09-10 2003-01-28 Intel Corporation Output buffer for high and low voltage bus
US7133074B1 (en) 1999-09-28 2006-11-07 Zoran Corporation Image sensor circuits including sampling circuits used therein for performing correlated double sampling
US6465862B1 (en) * 1999-10-05 2002-10-15 Brannon Harris Method and apparatus for implementing efficient CMOS photo sensors
US6194258B1 (en) 2000-01-18 2001-02-27 Taiwan Semiconductor Manufacturing Company Method of forming an image sensor cell and a CMOS logic circuit device
US6627475B1 (en) 2000-01-18 2003-09-30 Taiwan Semiconductor Manufacturing Company Buried photodiode structure for CMOS image sensor
DE10003472C1 (de) 2000-01-27 2001-04-26 Infineon Technologies Ag Zufallszahlengenerator
US6309905B1 (en) 2000-01-31 2001-10-30 Taiwan Semiconductor Manufacturing Company Stripe photodiode element with high quantum efficiency for an image sensor cell
EP1208599A1 (en) 2000-03-09 2002-05-29 Koninklijke Philips Electronics N.V. Solid state imaging sensor in a submicron technology and method of manufacturing and use of a solid state imaging sensor
US6365926B1 (en) 2000-09-20 2002-04-02 Eastman Kodak Company CMOS active pixel with scavenging diode
KR20020096336A (ko) * 2001-06-19 2002-12-31 삼성전자 주식회사 씨모스형 촬상 장치
US20030049925A1 (en) * 2001-09-10 2003-03-13 Layman Paul Arthur High-density inter-die interconnect structure
KR100454074B1 (ko) * 2001-12-26 2004-10-26 동부전자 주식회사 반도체 소자의 이미지 센서 제조 방법
US6534356B1 (en) 2002-04-09 2003-03-18 Taiwan Semiconductor Manufacturing Company Method of reducing dark current for an image sensor device via use of a polysilicon pad
AU2002354316A1 (en) * 2002-11-05 2004-06-07 Akademia Gorniczo-Hutnicza Monolithic active pixel dosimeter
US6818930B2 (en) * 2002-11-12 2004-11-16 Micron Technology, Inc. Gated isolation structure for imagers
KR100907884B1 (ko) * 2002-12-31 2009-07-15 동부일렉트로닉스 주식회사 반도체 포토 다이오드 및 이의 제조 방법
US6897082B2 (en) * 2003-06-16 2005-05-24 Micron Technology, Inc. Method of forming well for CMOS imager
KR100535924B1 (ko) * 2003-09-22 2005-12-09 동부아남반도체 주식회사 시모스 이미지 센서 및 그 제조방법
US7180049B2 (en) * 2004-11-08 2007-02-20 Taiwan Semiconductor Manufacturing Co., Ltd. Image sensor with optical guard rings and method for forming the same
US7348651B2 (en) * 2004-12-09 2008-03-25 Taiwan Semiconductor Manufacturing Co., Ltd. Pinned photodiode fabricated with shallow trench isolation
US7342268B2 (en) * 2004-12-23 2008-03-11 International Business Machines Corporation CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom
US7564083B2 (en) * 2005-02-25 2009-07-21 United Microelectronics Corp. Active pixel sensor
EP1921685A4 (en) * 2005-08-31 2014-12-17 Fujitsu Semiconductor Ltd PHOTODIODE, SOLID IMAGING DEVICE, AND METHOD FOR MANUFACTURING SAME
US8259293B2 (en) * 2007-03-15 2012-09-04 Johns Hopkins University Deep submicron and nano CMOS single photon photodetector pixel with event based circuits for readout data-rate reduction communication system
US7598575B1 (en) 2007-09-12 2009-10-06 National Semiconductor Corporation Semiconductor die with reduced RF attenuation
US8188578B2 (en) * 2008-05-29 2012-05-29 Mediatek Inc. Seal ring structure for integrated circuits
US8815634B2 (en) * 2008-10-31 2014-08-26 Varian Semiconductor Equipment Associates, Inc. Dark currents and reducing defects in image sensors and photovoltaic junctions
US8138531B2 (en) * 2009-09-17 2012-03-20 International Business Machines Corporation Structures, design structures and methods of fabricating global shutter pixel sensor cells
US9171726B2 (en) * 2009-11-06 2015-10-27 Infineon Technologies Ag Low noise semiconductor devices
JP5631668B2 (ja) * 2010-09-02 2014-11-26 Nttエレクトロニクス株式会社 アバランシ・フォトダイオード
RU2497319C1 (ru) * 2012-02-28 2013-10-27 Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "Высшая школа экономики" Печатная плата для бортовой радиоэлектронной аппаратуры космических аппаратов
KR102678796B1 (ko) * 2023-01-13 2024-06-26 주식회사 트루픽셀 단일 광자 검출기, 전자 장치, 및 라이다 장치

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JPS58115873A (ja) * 1981-12-28 1983-07-09 Fujitsu Ltd 半導体受光素子
JPH036860A (ja) * 1989-06-02 1991-01-14 Nec Corp 固体撮像素子
JPH0582823A (ja) * 1991-09-20 1993-04-02 Sharp Corp フオトトランジスタ
JPH0677452A (ja) * 1992-06-26 1994-03-18 Nikon Corp 固体撮像装置
JPH09321332A (ja) * 1996-05-31 1997-12-12 Oki Electric Ind Co Ltd 半導体受光素子の製造方法
JPH10209486A (ja) * 1998-03-09 1998-08-07 Toshiba Corp 半導体受光装置及びその製造方法

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JPH036860A (ja) * 1989-06-02 1991-01-14 Nec Corp 固体撮像素子
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Publication number Priority date Publication date Assignee Title
KR101804268B1 (ko) * 2010-11-02 2018-01-11 삼성전자주식회사 후면수광 이미지 센서에서 노이즈 차단을 위한 깊은 가드링 구조 및 잡음방지영역을 갖는 이미지센서 및 그 제조방법

Also Published As

Publication number Publication date
RU2178600C1 (ru) 2002-01-20
DE69833760D1 (de) 2006-05-04
WO1999017380A1 (en) 1999-04-08
HK1029439A1 (en) 2001-03-30
DE69833760T2 (de) 2006-09-07
JP2001518719A (ja) 2001-10-16
EP1034570A1 (en) 2000-09-13
EP1034570A4 (en) 2002-09-25
US5859450A (en) 1999-01-12
TW441119B (en) 2001-06-16
AU8291798A (en) 1999-04-23
KR20010030818A (ko) 2001-04-16
EP1034570B1 (en) 2006-03-08
JP4309574B2 (ja) 2009-08-05

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