KR100346050B1 - 칩부품의 부착구조 및 칩부품의 부착방법 - Google Patents

칩부품의 부착구조 및 칩부품의 부착방법 Download PDF

Info

Publication number
KR100346050B1
KR100346050B1 KR1020000016796A KR20000016796A KR100346050B1 KR 100346050 B1 KR100346050 B1 KR 100346050B1 KR 1020000016796 A KR1020000016796 A KR 1020000016796A KR 20000016796 A KR20000016796 A KR 20000016796A KR 100346050 B1 KR100346050 B1 KR 100346050B1
Authority
KR
South Korea
Prior art keywords
land
land portion
chip
pair
line
Prior art date
Application number
KR1020000016796A
Other languages
English (en)
Korean (ko)
Other versions
KR20000071525A (ko
Inventor
와타나베히데키
Original Assignee
알프스 덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 알프스 덴키 가부시키가이샤 filed Critical 알프스 덴키 가부시키가이샤
Publication of KR20000071525A publication Critical patent/KR20000071525A/ko
Application granted granted Critical
Publication of KR100346050B1 publication Critical patent/KR100346050B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Led Device Packages (AREA)
KR1020000016796A 1999-04-02 2000-03-31 칩부품의 부착구조 및 칩부품의 부착방법 KR100346050B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11-097074 1999-04-02
JP11097074A JP2000294893A (ja) 1999-04-02 1999-04-02 チップ部品の取付構造、並びにチップ部品の取付方法

Publications (2)

Publication Number Publication Date
KR20000071525A KR20000071525A (ko) 2000-11-25
KR100346050B1 true KR100346050B1 (ko) 2002-07-24

Family

ID=14182504

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020000016796A KR100346050B1 (ko) 1999-04-02 2000-03-31 칩부품의 부착구조 및 칩부품의 부착방법

Country Status (4)

Country Link
JP (1) JP2000294893A (zh)
KR (1) KR100346050B1 (zh)
CN (1) CN1269698A (zh)
TW (1) TW493363B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100665840B1 (ko) * 2004-12-10 2007-01-09 삼성전자주식회사 데이지 체인 구조의 메모리 모듈 및 그의 형성 방법
CN100544546C (zh) * 2005-10-27 2009-09-23 鸿富锦精密工业（深圳）有限公司 印刷电路板
JP5192984B2 (ja) * 2008-11-05 2013-05-08 アルプス電気株式会社 チップ部品の実装方法及びチップ部品を搭載した基板モジュール
CN109587970B (zh) * 2018-12-10 2020-12-01 福建鸿博光电科技有限公司 一种灯珠焊接方法

Also Published As

Publication number Publication date
JP2000294893A (ja) 2000-10-20
TW493363B (en) 2002-07-01
CN1269698A (zh) 2000-10-11
KR20000071525A (ko) 2000-11-25

Similar Documents

Publication Publication Date Title
US3693052A (en) Electrical component mounting
KR100370684B1 (ko) 전자회로유닛 및 전자회로유닛의 제조방법
US5886878A (en) Printed circuit board manufacturing method for through hole components with a metal case
KR100346050B1 (ko) 칩부품의 부착구조 및 칩부품의 부착방법
US7276840B2 (en) Structure with a plurality of substrates, its manufacturing method and crystal oscillator with the structure
JPH06302950A (ja) プリント配線板の上にハイブリッド回路を取り付ける方法
KR970025320A (ko) 회로기판
KR950035544A (ko) 회로 모듈 제조방법
JP3889962B2 (ja) 回路基板及びその製造方法
JPS6384190A (ja) チツプ部品搭載基板
EP0996317B1 (en) Structure and method for mounting an electronic circuit unit to a printed board
KR100287738B1 (ko) 인쇄회로기판용 표면실장 방법
JP2000228574A (ja) チップ部品の取付構造、並びにチップ部品の取付方法
JPH04243187A (ja) プリント基板
JPH10163587A (ja) プリント基板
KR20070069546A (ko) 통신 단말기의 디버그용 패턴을 갖는 인쇄회로기판 구조
JP3872600B2 (ja) 電子回路ユニットの取付方法
JP2000269628A (ja) リフローによるチップ部品の取付構造、並びにリフローによるチップ部品の取付方法
JPH0714673U (ja) 混成集積回路基板
JPH1140911A (ja) プリント基板
KR19980068062U (ko) 뒤틀림을 방지한 인쇄회로기판
JPH04105390A (ja) 基板機構
KR19980057208U (ko) 납 쇼트 방지 홀을 갖는 인쇄 회로 기판
JPS62128187A (ja) 高周波機器
JPH04154190A (ja) チップ部品の実装方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20050620

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee