KR100304993B1 - 범프형집적회로패키지용막회로금속시스템 - Google Patents

범프형집적회로패키지용막회로금속시스템 Download PDF

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Publication number
KR100304993B1
KR100304993B1 KR1019950006964A KR19950006964A KR100304993B1 KR 100304993 B1 KR100304993 B1 KR 100304993B1 KR 1019950006964 A KR1019950006964 A KR 1019950006964A KR 19950006964 A KR19950006964 A KR 19950006964A KR 100304993 B1 KR100304993 B1 KR 100304993B1
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KR
South Korea
Prior art keywords
layer
gold
nickel
copper
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1019950006964A
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English (en)
Korean (ko)
Other versions
KR950034675A (ko
Inventor
리챠드폴드바익
마이클디.에반스
워렌제이.펜더가스트
Original Assignee
엘리 웨이스 , 알 비 레비
에이티 앤드 티 코포레이션
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Publication date
Application filed by 엘리 웨이스 , 알 비 레비, 에이티 앤드 티 코포레이션 filed Critical 엘리 웨이스 , 알 비 레비
Publication of KR950034675A publication Critical patent/KR950034675A/ko
Application granted granted Critical
Publication of KR100304993B1 publication Critical patent/KR100304993B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H10W20/01—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H10W70/66—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
KR1019950006964A 1994-04-01 1995-03-30 범프형집적회로패키지용막회로금속시스템 Expired - Lifetime KR100304993B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/221,731 US5449955A (en) 1994-04-01 1994-04-01 Film circuit metal system for use with bumped IC packages
US221,731 1994-04-01

Publications (2)

Publication Number Publication Date
KR950034675A KR950034675A (ko) 1995-12-28
KR100304993B1 true KR100304993B1 (ko) 2001-11-30

Family

ID=22829115

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950006964A Expired - Lifetime KR100304993B1 (ko) 1994-04-01 1995-03-30 범프형집적회로패키지용막회로금속시스템

Country Status (7)

Country Link
US (1) US5449955A (cg-RX-API-DMAC10.html)
EP (1) EP0675674B1 (cg-RX-API-DMAC10.html)
JP (1) JP3373324B2 (cg-RX-API-DMAC10.html)
KR (1) KR100304993B1 (cg-RX-API-DMAC10.html)
DE (1) DE69500388T2 (cg-RX-API-DMAC10.html)
HK (1) HK1000549A1 (cg-RX-API-DMAC10.html)
TW (1) TW278223B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030081172A (ko) * 2002-04-12 2003-10-17 엔이씨 일렉트로닉스 코포레이션 반도체 장치 및 그 제조 방법

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WO1997041594A1 (en) * 1996-04-29 1997-11-06 Carl Shine Multilayer solder/barrier attach for semiconductor chip
US5989989A (en) * 1996-05-31 1999-11-23 Texas Instruments Incorporated Die and cube reroute process
DE19712219A1 (de) * 1997-03-24 1998-10-01 Bosch Gmbh Robert Verfahren zur Herstellung von Lothöckern definierter Größe
US6082610A (en) * 1997-06-23 2000-07-04 Ford Motor Company Method of forming interconnections on electronic modules
US6093966A (en) * 1998-03-20 2000-07-25 Motorola, Inc. Semiconductor device with a copper barrier layer and formation thereof
EP1110905A1 (en) 1999-12-24 2001-06-27 SensoNor asa Micro-electromechanical device
KR100455678B1 (ko) * 2002-02-06 2004-11-06 마이크로스케일 주식회사 반도체 플립칩 패키지를 위한 솔더 범프 구조 및 그 제조방법
TW550800B (en) * 2002-05-27 2003-09-01 Via Tech Inc Integrated circuit package without solder mask and method for the same
SG107600A1 (en) * 2002-06-27 2004-12-29 Agency Science Tech & Res Multilayer substrate metallization for ic interconnection
DE10238816B4 (de) * 2002-08-23 2008-01-10 Qimonda Ag Verfahren zur Herstellung von Anschlussbereichen einer integrierten Schaltung und integrierte Schaltung mit Anschlussbereichen
DE10239081B4 (de) * 2002-08-26 2007-12-20 Qimonda Ag Verfahren zur Herstellung einer Halbleitereinrichtung
DE10240921B4 (de) * 2002-09-02 2007-12-13 Qimonda Ag Verfahren und Anordnung zum selektiven Metallisieren von 3-D-Strukturen
DE10251658B4 (de) * 2002-11-01 2005-08-25 Atotech Deutschland Gmbh Verfahren zum Verbinden von zur Herstellung von Mikrostrukturbauteilen geeigneten, mikrostrukturierten Bauteillagen sowie Mikrostrukturbauteil
US7223695B2 (en) * 2004-09-30 2007-05-29 Intel Corporation Methods to deposit metal alloy barrier layers
US7956460B2 (en) * 2004-12-28 2011-06-07 Rohm Co., Ltd. Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device
US20080157910A1 (en) * 2006-12-29 2008-07-03 Park Chang-Min Amorphous soft magnetic layer for on-die inductively coupled wires
FR2952314B1 (fr) * 2009-11-12 2012-02-10 Sagem Defense Securite Procede de brasage, gyroscope et piece brasee
DE112011103782B4 (de) * 2010-11-16 2019-05-09 Mitsubishi Electric Corporation Halbleiterelement, Halbleitervorrichtung und Verfahren zum Herstellen eines Halbleiterelements
CN103258809A (zh) * 2012-02-15 2013-08-21 稳懋半导体股份有限公司 三五族化合物半导体组件的铜金属连接线
JP2015012112A (ja) * 2013-06-28 2015-01-19 京セラサーキットソリューションズ株式会社 配線基板
CN112687556B (zh) * 2020-12-24 2023-07-18 中国电子科技集团公司第十三研究所 在基板表面集成bga焊盘的阻焊制备方法及结构
US11830806B2 (en) * 2021-04-29 2023-11-28 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and method of manufacturing the same

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US3451030A (en) * 1966-07-01 1969-06-17 Gen Electric Solder-bonded semiconductor strain gauges
GB1202199A (en) * 1966-11-22 1970-08-12 G V Planer Ltd Improvements in or relating to thermoelectric devices
US3622385A (en) * 1968-07-19 1971-11-23 Hughes Aircraft Co Method of providing flip-chip devices with solderable connections
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
US4016050A (en) * 1975-05-12 1977-04-05 Bell Telephone Laboratories, Incorporated Conduction system for thin film and hybrid integrated circuits
DE2554691C2 (de) * 1974-12-10 1982-11-18 Western Electric Co., Inc., 10038 New York, N.Y. Verfahren zum Herstellen elektrischer Leiter auf einem isolierenden Substrat und danach hergestellte Dünnschichtschaltung
JPS5715432A (en) * 1980-07-01 1982-01-26 Mitsubishi Electric Corp Semiconductor element
GB2176938A (en) * 1985-06-24 1987-01-07 Nat Semiconductor Corp Pad metallization structure
US5288951A (en) 1992-10-30 1994-02-22 At&T Bell Laboratories Copper-based metallizations for hybrid integrated circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030081172A (ko) * 2002-04-12 2003-10-17 엔이씨 일렉트로닉스 코포레이션 반도체 장치 및 그 제조 방법

Also Published As

Publication number Publication date
DE69500388D1 (de) 1997-08-07
DE69500388T2 (de) 1997-10-23
EP0675674B1 (en) 1997-07-02
EP0675674A1 (en) 1995-10-04
HK1000549A1 (en) 1998-04-03
JP3373324B2 (ja) 2003-02-04
JPH07297540A (ja) 1995-11-10
TW278223B (cg-RX-API-DMAC10.html) 1996-06-11
US5449955A (en) 1995-09-12
KR950034675A (ko) 1995-12-28

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