TW278223B - - Google Patents

Info

Publication number
TW278223B
TW278223B TW083111241A TW83111241A TW278223B TW 278223 B TW278223 B TW 278223B TW 083111241 A TW083111241 A TW 083111241A TW 83111241 A TW83111241 A TW 83111241A TW 278223 B TW278223 B TW 278223B
Authority
TW
Taiwan
Application number
TW083111241A
Other languages
Chinese (zh)
Original Assignee
At & T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Corp filed Critical At & T Corp
Application granted granted Critical
Publication of TW278223B publication Critical patent/TW278223B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H10W20/01—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H10W70/66—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
TW083111241A 1994-04-01 1994-12-02 TW278223B (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/221,731 US5449955A (en) 1994-04-01 1994-04-01 Film circuit metal system for use with bumped IC packages

Publications (1)

Publication Number Publication Date
TW278223B true TW278223B (cg-RX-API-DMAC10.html) 1996-06-11

Family

ID=22829115

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083111241A TW278223B (cg-RX-API-DMAC10.html) 1994-04-01 1994-12-02

Country Status (6)

Country Link
US (1) US5449955A (cg-RX-API-DMAC10.html)
EP (1) EP0675674B1 (cg-RX-API-DMAC10.html)
JP (1) JP3373324B2 (cg-RX-API-DMAC10.html)
KR (1) KR100304993B1 (cg-RX-API-DMAC10.html)
DE (1) DE69500388T2 (cg-RX-API-DMAC10.html)
TW (1) TW278223B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103258809A (zh) * 2012-02-15 2013-08-21 稳懋半导体股份有限公司 三五族化合物半导体组件的铜金属连接线

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997041594A1 (en) * 1996-04-29 1997-11-06 Carl Shine Multilayer solder/barrier attach for semiconductor chip
US5989989A (en) * 1996-05-31 1999-11-23 Texas Instruments Incorporated Die and cube reroute process
DE19712219A1 (de) * 1997-03-24 1998-10-01 Bosch Gmbh Robert Verfahren zur Herstellung von Lothöckern definierter Größe
US6082610A (en) * 1997-06-23 2000-07-04 Ford Motor Company Method of forming interconnections on electronic modules
US6093966A (en) * 1998-03-20 2000-07-25 Motorola, Inc. Semiconductor device with a copper barrier layer and formation thereof
EP1110905A1 (en) * 1999-12-24 2001-06-27 SensoNor asa Micro-electromechanical device
KR100455678B1 (ko) * 2002-02-06 2004-11-06 마이크로스케일 주식회사 반도체 플립칩 패키지를 위한 솔더 범프 구조 및 그 제조방법
JP2003303842A (ja) * 2002-04-12 2003-10-24 Nec Electronics Corp 半導体装置およびその製造方法
TW550800B (en) * 2002-05-27 2003-09-01 Via Tech Inc Integrated circuit package without solder mask and method for the same
SG107600A1 (en) * 2002-06-27 2004-12-29 Agency Science Tech & Res Multilayer substrate metallization for ic interconnection
DE10238816B4 (de) * 2002-08-23 2008-01-10 Qimonda Ag Verfahren zur Herstellung von Anschlussbereichen einer integrierten Schaltung und integrierte Schaltung mit Anschlussbereichen
DE10239081B4 (de) * 2002-08-26 2007-12-20 Qimonda Ag Verfahren zur Herstellung einer Halbleitereinrichtung
DE10240921B4 (de) * 2002-09-02 2007-12-13 Qimonda Ag Verfahren und Anordnung zum selektiven Metallisieren von 3-D-Strukturen
DE10251658B4 (de) * 2002-11-01 2005-08-25 Atotech Deutschland Gmbh Verfahren zum Verbinden von zur Herstellung von Mikrostrukturbauteilen geeigneten, mikrostrukturierten Bauteillagen sowie Mikrostrukturbauteil
US7223695B2 (en) * 2004-09-30 2007-05-29 Intel Corporation Methods to deposit metal alloy barrier layers
WO2006070808A1 (ja) * 2004-12-28 2006-07-06 Rohm Co., Ltd. 半導体チップおよびその製造方法、半導体チップの電極構造およびその形成方法、ならびに半導体装置
US20080157910A1 (en) * 2006-12-29 2008-07-03 Park Chang-Min Amorphous soft magnetic layer for on-die inductively coupled wires
FR2952314B1 (fr) * 2009-11-12 2012-02-10 Sagem Defense Securite Procede de brasage, gyroscope et piece brasee
US9553063B2 (en) * 2010-11-16 2017-01-24 Mitsubishi Electric Corporation Semiconductor element, semiconductor device and method for manufacturing semiconductor element
JP2015012112A (ja) * 2013-06-28 2015-01-19 京セラサーキットソリューションズ株式会社 配線基板
CN112687556B (zh) * 2020-12-24 2023-07-18 中国电子科技集团公司第十三研究所 在基板表面集成bga焊盘的阻焊制备方法及结构
US11830806B2 (en) * 2021-04-29 2023-11-28 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and method of manufacturing the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3451030A (en) * 1966-07-01 1969-06-17 Gen Electric Solder-bonded semiconductor strain gauges
GB1202199A (en) * 1966-11-22 1970-08-12 G V Planer Ltd Improvements in or relating to thermoelectric devices
US3622385A (en) * 1968-07-19 1971-11-23 Hughes Aircraft Co Method of providing flip-chip devices with solderable connections
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
US4016050A (en) * 1975-05-12 1977-04-05 Bell Telephone Laboratories, Incorporated Conduction system for thin film and hybrid integrated circuits
DE2554691C2 (de) * 1974-12-10 1982-11-18 Western Electric Co., Inc., 10038 New York, N.Y. Verfahren zum Herstellen elektrischer Leiter auf einem isolierenden Substrat und danach hergestellte Dünnschichtschaltung
JPS5715432A (en) * 1980-07-01 1982-01-26 Mitsubishi Electric Corp Semiconductor element
GB2176938A (en) * 1985-06-24 1987-01-07 Nat Semiconductor Corp Pad metallization structure
US5288951A (en) 1992-10-30 1994-02-22 At&T Bell Laboratories Copper-based metallizations for hybrid integrated circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103258809A (zh) * 2012-02-15 2013-08-21 稳懋半导体股份有限公司 三五族化合物半导体组件的铜金属连接线

Also Published As

Publication number Publication date
JPH07297540A (ja) 1995-11-10
HK1000549A1 (en) 1998-04-03
KR100304993B1 (ko) 2001-11-30
KR950034675A (ko) 1995-12-28
JP3373324B2 (ja) 2003-02-04
EP0675674B1 (en) 1997-07-02
US5449955A (en) 1995-09-12
EP0675674A1 (en) 1995-10-04
DE69500388T2 (de) 1997-10-23
DE69500388D1 (de) 1997-08-07

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent