KR100294145B1 - 전자부품및그제조방법 - Google Patents

전자부품및그제조방법 Download PDF

Info

Publication number
KR100294145B1
KR100294145B1 KR1019950004875A KR19950004875A KR100294145B1 KR 100294145 B1 KR100294145 B1 KR 100294145B1 KR 1019950004875 A KR1019950004875 A KR 1019950004875A KR 19950004875 A KR19950004875 A KR 19950004875A KR 100294145 B1 KR100294145 B1 KR 100294145B1
Authority
KR
South Korea
Prior art keywords
resin film
substrate
layer
conductive material
surface area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019950004875A
Other languages
English (en)
Korean (ko)
Other versions
KR950035554A (ko
Inventor
니시무라히토시
후지하시다카시
Original Assignee
무라타 야스타까
가부시키가이샤 무라타 매뉴팩쳐링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 무라타 야스타까, 가부시키가이샤 무라타 매뉴팩쳐링 filed Critical 무라타 야스타까
Publication of KR950035554A publication Critical patent/KR950035554A/ko
Application granted granted Critical
Publication of KR100294145B1 publication Critical patent/KR100294145B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3164—Partial encapsulation or coating the coating being a foil
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
KR1019950004875A 1994-03-10 1995-03-10 전자부품및그제조방법 Expired - Lifetime KR100294145B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6040051A JPH07249877A (ja) 1994-03-10 1994-03-10 電子部品
JP1994-40051 1994-03-10

Publications (2)

Publication Number Publication Date
KR950035554A KR950035554A (ko) 1995-12-30
KR100294145B1 true KR100294145B1 (ko) 2001-09-17

Family

ID=12570121

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950004875A Expired - Lifetime KR100294145B1 (ko) 1994-03-10 1995-03-10 전자부품및그제조방법

Country Status (5)

Country Link
JP (1) JPH07249877A (enrdf_load_stackoverflow)
KR (1) KR100294145B1 (enrdf_load_stackoverflow)
CN (1) CN1096744C (enrdf_load_stackoverflow)
DE (1) DE19507124A1 (enrdf_load_stackoverflow)
TW (1) TW274162B (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19548062A1 (de) * 1995-12-21 1997-06-26 Siemens Matsushita Components Elektrisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement - sowie ein Verfahren zu dessen Herstellung
ATE201803T1 (de) * 1996-04-04 2001-06-15 Langer Guenter Anordnung zur reduzierung der elektromagnetischen abstrahlung bei leiterkarten und anderen trägern elektronischer schaltungen
DE19613587C2 (de) * 1996-04-04 2000-02-17 Langer Guenter Anordnung zur Blockierung der elektromagnetischen Abstrahlung bei Leiterkarten und integrierten Schaltkreisen
DE19818824B4 (de) 1998-04-27 2008-07-31 Epcos Ag Elektronisches Bauelement und Verfahren zu dessen Herstellung
DE19820049C2 (de) * 1998-05-05 2001-04-12 Epcos Ag Thermomechanisches Verfahren zum Planarisieren einer fototechnisch strukturierbaren Schicht, insbesondere Verkapselung für elektronische Bauelemente
DE19854396C2 (de) * 1998-11-25 2002-02-07 Freudenberg Carl Kg Sensormodul
DE10049288B4 (de) * 2000-10-04 2004-07-15 Infineon Technologies Ag Elektronische Bauteile und eine Folienband zum Verpacken von Bonddrahtverbindungen elektronischer Bauteile sowie deren Herstellungsverfahren
DE10125744A1 (de) * 2001-05-21 2002-12-05 Siemens Ag Verfahren zur Abschirmung einer auf einer Leiterplatte realisierten elektrischen Schaltung und eine entsprechende Kombination einer Leiterplatte mit einer Abschirmung
JP3770210B2 (ja) * 2002-06-20 2006-04-26 株式会社村田製作所 圧電部品の製造方法
JP5086835B2 (ja) * 2008-02-20 2012-11-28 パナソニック株式会社 電動工具

Also Published As

Publication number Publication date
CN1096744C (zh) 2002-12-18
TW274162B (enrdf_load_stackoverflow) 1996-04-11
JPH07249877A (ja) 1995-09-26
KR950035554A (ko) 1995-12-30
CN1117666A (zh) 1996-02-28
DE19507124A1 (de) 1995-09-14

Similar Documents

Publication Publication Date Title
EP0637871B1 (en) Surface acoustic wave device mounted module
KR100294145B1 (ko) 전자부품및그제조방법
US4734608A (en) Elastic surface wave element
JP2002504773A (ja) 電子コンポーネントの作製方法、例えば、音響表面波で動作する表面波−コンポーネントの作製方法
US8441774B2 (en) Capacitance element, printed circuit board, semiconductor package, and semiconductor circuit
US4736128A (en) Surface acoustic wave device
EP0665642B1 (en) An electronic component device and its manufacturing method
EP0434451A2 (en) Cuffed tape wrap and fill wound capacitor
JPH08204497A (ja) 弾性表面波装置
JPS6053005A (ja) フラツトトランスフア用誘導性電子部品
JPH0818390A (ja) 弾性表面波装置
US4980798A (en) Cuffed tape wrap and fill wound capacitor
JP4454144B2 (ja) 高周波回路用パッケージ
KR100371573B1 (ko) 전극 패턴을 피복하는 수지막을 갖는 표면탄성파 장치
JPS60160684A (ja) 電磁シ−ルドプリント配線基板
KR102393573B1 (ko) 표면 탄성파 웨이퍼 레벨 패키지 및 그 제작 방법
JPH0964579A (ja) 電子部品
JPH0878954A (ja) 発振器およびその製造方法
JPH1188106A (ja) 弾性表面波素子の封止方法及びその封止構造
US20220190805A1 (en) Electronic component and method for manufacturing the same
JP3068719B2 (ja) 誘電体共振器の共振周波数調整方法
JPH02239714A (ja) 弾性表面波装置
JPH06283337A (ja) ノイズフィルタ及びその製造方法
JPH06188670A (ja) 圧電部品及びその製造方法
JPH0394506A (ja) 電子部品の製造方法

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19950310

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19961108

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19950310

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19990730

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 19991125

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 19990730

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

Patent event date: 19991222

Comment text: Request for Trial against Decision on Refusal

Patent event code: PJ02012R01D

Patent event date: 19991125

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Appeal kind category: Appeal against decision to decline refusal

Decision date: 20001215

Appeal identifier: 1999101004616

Request date: 19991222

J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 19991222

Effective date: 20001215

PJ1301 Trial decision

Patent event code: PJ13011S01D

Patent event date: 20001218

Comment text: Trial Decision on Objection to Decision on Refusal

Appeal kind category: Appeal against decision to decline refusal

Request date: 19991222

Decision date: 20001215

Appeal identifier: 1999101004616

PS0901 Examination by remand of revocation
S901 Examination by remand of revocation
GRNO Decision to grant (after opposition)
PS0701 Decision of registration after remand of revocation

Patent event date: 20010217

Patent event code: PS07012S01D

Comment text: Decision to Grant Registration

Patent event date: 20010111

Patent event code: PS07011S01I

Comment text: Notice of Trial Decision (Remand of Revocation)

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20010412

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20010413

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20040331

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20050408

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20060410

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20070411

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20080411

Start annual number: 8

End annual number: 8

PR1001 Payment of annual fee

Payment date: 20090410

Start annual number: 9

End annual number: 9

PR1001 Payment of annual fee

Payment date: 20100412

Start annual number: 10

End annual number: 10

PR1001 Payment of annual fee

Payment date: 20110407

Start annual number: 11

End annual number: 11

PR1001 Payment of annual fee

Payment date: 20120323

Start annual number: 12

End annual number: 12

FPAY Annual fee payment

Payment date: 20130318

Year of fee payment: 13

PR1001 Payment of annual fee

Payment date: 20130318

Start annual number: 13

End annual number: 13

FPAY Annual fee payment

Payment date: 20140320

Year of fee payment: 14

PR1001 Payment of annual fee

Payment date: 20140320

Start annual number: 14

End annual number: 14

EXPY Expiration of term
PC1801 Expiration of term

Termination date: 20150910

Termination category: Expiration of duration