KR100269416B1 - 기판 처리 장치 - Google Patents
기판 처리 장치 Download PDFInfo
- Publication number
- KR100269416B1 KR100269416B1 KR1019980012268A KR19980012268A KR100269416B1 KR 100269416 B1 KR100269416 B1 KR 100269416B1 KR 1019980012268 A KR1019980012268 A KR 1019980012268A KR 19980012268 A KR19980012268 A KR 19980012268A KR 100269416 B1 KR100269416 B1 KR 100269416B1
- Authority
- KR
- South Korea
- Prior art keywords
- liquid
- substrate
- opening
- drying
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 claims abstract description 136
- 239000000758 substrate Substances 0.000 claims abstract description 114
- 238000001035 drying Methods 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims description 25
- 238000007599 discharging Methods 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 71
- 238000005406 washing Methods 0.000 abstract description 50
- 239000003595 mist Substances 0.000 abstract description 19
- 238000005530 etching Methods 0.000 description 10
- 238000005342 ion exchange Methods 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP97-164623 | 1997-06-20 | ||
| JP9164623A JPH1116871A (ja) | 1997-06-20 | 1997-06-20 | 基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990006382A KR19990006382A (ko) | 1999-01-25 |
| KR100269416B1 true KR100269416B1 (ko) | 2000-12-01 |
Family
ID=15796723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980012268A Expired - Lifetime KR100269416B1 (ko) | 1997-06-20 | 1998-04-07 | 기판 처리 장치 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH1116871A (enExample) |
| KR (1) | KR100269416B1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001284310A (ja) * | 2000-03-31 | 2001-10-12 | Shibaura Mechatronics Corp | 基板の処理装置及び処理方法 |
| KR100432053B1 (ko) * | 2001-07-05 | 2004-05-17 | (주)케이.씨.텍 | 건조장치 |
| JP4365192B2 (ja) * | 2003-11-25 | 2009-11-18 | 住友精密工業株式会社 | 搬送式基板処理装置 |
| KR100725038B1 (ko) * | 2005-06-22 | 2007-06-07 | 세메스 주식회사 | 기판 처리 장치 |
-
1997
- 1997-06-20 JP JP9164623A patent/JPH1116871A/ja active Pending
-
1998
- 1998-04-07 KR KR1019980012268A patent/KR100269416B1/ko not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR19990006382A (ko) | 1999-01-25 |
| JPH1116871A (ja) | 1999-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19980407 |
|
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19980407 Comment text: Request for Examination of Application |
|
| PG1501 | Laying open of application | ||
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20000501 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20000720 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20000720 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| O035 | Opposition [patent]: request for opposition | ||
| PO0301 | Opposition |
Comment text: Request for Opposition Patent event code: PO03011R01D Patent event date: 20010227 Opposition date: 20010227 Opposition identifier: 102001000036 Registration number: 1002694160000 |
|
| G171 | Publication of modified document after post-grant opposition [patent] | ||
| O132 | Decision on opposition [patent] | ||
| PG1701 | Publication of correction |
Patent event code: PG17011E02I Patent event date: 20020618 Comment text: Request for Publication of Correction by Opposition Publication date: 20020624 |
|
| PO1301 | Decision on opposition |
Comment text: Decision on Opposition Patent event date: 20020624 Patent event code: PO13011S01D |
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| O074 | Maintenance of registration after opposition [patent]: final registration of opposition | ||
| PO0702 | Maintenance of registration after opposition |
Patent event code: PO07021S01D Patent event date: 20020902 Comment text: Final Registration of Opposition |
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