JPH1116871A - 基板処理装置 - Google Patents
基板処理装置Info
- Publication number
- JPH1116871A JPH1116871A JP9164623A JP16462397A JPH1116871A JP H1116871 A JPH1116871 A JP H1116871A JP 9164623 A JP9164623 A JP 9164623A JP 16462397 A JP16462397 A JP 16462397A JP H1116871 A JPH1116871 A JP H1116871A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- substrate
- processing
- unit
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 121
- 238000012545 processing Methods 0.000 title claims abstract description 118
- 239000007788 liquid Substances 0.000 claims abstract description 126
- 238000001035 drying Methods 0.000 claims abstract description 64
- 238000000034 method Methods 0.000 claims description 12
- 238000005192 partition Methods 0.000 claims description 6
- 239000003595 mist Substances 0.000 abstract description 20
- 238000011010 flushing procedure Methods 0.000 abstract 5
- 230000002708 enhancing effect Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 41
- 238000005406 washing Methods 0.000 description 22
- 238000005530 etching Methods 0.000 description 11
- 238000005342 ion exchange Methods 0.000 description 6
- 239000007921 spray Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012993 chemical processing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9164623A JPH1116871A (ja) | 1997-06-20 | 1997-06-20 | 基板処理装置 |
| KR1019980012268A KR100269416B1 (ko) | 1997-06-20 | 1998-04-07 | 기판 처리 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9164623A JPH1116871A (ja) | 1997-06-20 | 1997-06-20 | 基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1116871A true JPH1116871A (ja) | 1999-01-22 |
| JPH1116871A5 JPH1116871A5 (enExample) | 2005-03-03 |
Family
ID=15796723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9164623A Pending JPH1116871A (ja) | 1997-06-20 | 1997-06-20 | 基板処理装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH1116871A (enExample) |
| KR (1) | KR100269416B1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001284310A (ja) * | 2000-03-31 | 2001-10-12 | Shibaura Mechatronics Corp | 基板の処理装置及び処理方法 |
| WO2005053006A1 (ja) * | 2003-11-25 | 2005-06-09 | Sumitomo Precision Products Co., Ltd. | 搬送式基板処理装置 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100432053B1 (ko) * | 2001-07-05 | 2004-05-17 | (주)케이.씨.텍 | 건조장치 |
| KR100725038B1 (ko) * | 2005-06-22 | 2007-06-07 | 세메스 주식회사 | 기판 처리 장치 |
-
1997
- 1997-06-20 JP JP9164623A patent/JPH1116871A/ja active Pending
-
1998
- 1998-04-07 KR KR1019980012268A patent/KR100269416B1/ko not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001284310A (ja) * | 2000-03-31 | 2001-10-12 | Shibaura Mechatronics Corp | 基板の処理装置及び処理方法 |
| WO2005053006A1 (ja) * | 2003-11-25 | 2005-06-09 | Sumitomo Precision Products Co., Ltd. | 搬送式基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR19990006382A (ko) | 1999-01-25 |
| KR100269416B1 (ko) | 2000-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040401 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040401 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050722 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050830 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051013 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060221 |