KR100225166B1 - 폴리히드릭 페놀 및 그것을 사용하여 수득한 에폭시수지 - Google Patents

폴리히드릭 페놀 및 그것을 사용하여 수득한 에폭시수지

Info

Publication number
KR100225166B1
KR100225166B1 KR1019920018659A KR920018659A KR100225166B1 KR 100225166 B1 KR100225166 B1 KR 100225166B1 KR 1019920018659 A KR1019920018659 A KR 1019920018659A KR 920018659 A KR920018659 A KR 920018659A KR 100225166 B1 KR100225166 B1 KR 100225166B1
Authority
KR
South Korea
Prior art keywords
epoxy resin
group
carbon atoms
glycidyl ether
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019920018659A
Other languages
English (en)
Korean (ko)
Other versions
KR930007997A (ko
Inventor
가즈오 다께베
다까시 모리모또
유따까 시오미
야스히데 스기야마
시게끼 나이또오
노리아끼 사이또
슈이찌 가나가와
구니마사 가미오
Original Assignee
고사이 아끼오
스미또모 가가꾸 고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP26365891A external-priority patent/JPH0597946A/ja
Priority claimed from JP13060092A external-priority patent/JPH05320320A/ja
Application filed by 고사이 아끼오, 스미또모 가가꾸 고오교오 가부시끼가이샤 filed Critical 고사이 아끼오
Publication of KR930007997A publication Critical patent/KR930007997A/ko
Application granted granted Critical
Publication of KR100225166B1 publication Critical patent/KR100225166B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/20—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Compounds (AREA)
KR1019920018659A 1991-10-11 1992-10-10 폴리히드릭 페놀 및 그것을 사용하여 수득한 에폭시수지 Expired - Fee Related KR100225166B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP26365891A JPH0597946A (ja) 1991-10-11 1991-10-11 フエノール類とナフトアルデヒド類との縮合物、そのグリシジルエーテル化物及びエポキシ樹脂組成物
JP91-263658 1991-10-11
JP92-130600 1992-05-22
JP13060092A JPH05320320A (ja) 1992-05-22 1992-05-22 エポキシ樹脂組成物及び樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
KR930007997A KR930007997A (ko) 1993-05-20
KR100225166B1 true KR100225166B1 (ko) 1999-10-15

Family

ID=26465691

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920018659A Expired - Fee Related KR100225166B1 (ko) 1991-10-11 1992-10-10 폴리히드릭 페놀 및 그것을 사용하여 수득한 에폭시수지

Country Status (8)

Country Link
US (1) US5478871A (enExample)
EP (1) EP0536748B1 (enExample)
KR (1) KR100225166B1 (enExample)
CA (1) CA2079821A1 (enExample)
DE (1) DE69222109T2 (enExample)
MY (1) MY108461A (enExample)
SG (1) SG50417A1 (enExample)
TW (1) TW206247B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160135163A (ko) * 2014-03-20 2016-11-25 디아이씨 가부시끼가이샤 노볼락형 페놀성 수산기 함유 수지, 그 제조 방법, 경화성 조성물, 레지스트용 조성물 및 컬러 레지스트

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG87725A1 (en) * 1992-09-21 2002-04-16 Sumitomo Bakelite Co Epoxy resin composition
DE4310525A1 (de) * 1993-03-31 1994-10-06 Basf Lacke & Farben Dreilagiges Metallrohrbeschichtungsmittel sowie Verfahren zur Außenbeschichtung von Metallrohren im Dreilagenverfahren
TW475926B (en) * 1996-06-06 2002-02-11 Sumitomo Chemical Co Novel ester compound and thermosetting resin composition using the same
US6201094B1 (en) * 1998-09-22 2001-03-13 Borden Chemical, Inc. Phenol-novolacs with improved optical properties
US6001950A (en) 1998-09-22 1999-12-14 Borden Chemical, Inc. Phenol-novolacs with improved optical properties
US6239248B1 (en) 1998-09-22 2001-05-29 Borden Chemical, Inc. Phenol-novolacs with improved optical properties
JP3707043B2 (ja) * 1999-03-18 2005-10-19 三菱瓦斯化学株式会社 プリント配線板用プリプレグ及び積層板
BR0111221A (pt) * 2000-06-05 2003-03-18 Borden Chemicals Inc Condensados glioxal-fenólicos com fluorescência intensificada
US6379800B1 (en) 2000-06-05 2002-04-30 Borden Chemical, Inc. Glyoxal-phenolic condensates with enhanced fluorescence
JP2002037859A (ja) * 2000-07-19 2002-02-06 Sumitomo Chem Co Ltd 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
US6660811B2 (en) * 2001-01-30 2003-12-09 Dainippon Ink And Chemicals, Inc. Epoxy resin composition and curing product thereof
KR100799146B1 (ko) * 2003-08-21 2008-01-29 아사히 가세이 케미칼즈 가부시키가이샤 감광성 조성물 및 그 경화물
US7348100B2 (en) * 2003-10-21 2008-03-25 Valence Technology, Inc. Product and method for the processing of precursors for lithium phosphate active materials
US20120296011A1 (en) * 2010-01-29 2012-11-22 Nipponkayaku Kabushikikaisha Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof
JP5853959B2 (ja) * 2010-12-28 2016-02-09 三菱瓦斯化学株式会社 芳香族炭化水素樹脂、リソグラフィー用下層膜形成組成物及び多層レジストパターンの形成方法
KR101869929B1 (ko) * 2011-06-03 2018-06-21 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 페놀계 수지 및 리소그래피용 하층막 형성 재료
US9902803B2 (en) 2012-03-14 2018-02-27 Korea Institute Of Industrial Technology Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group
WO2021079711A1 (ja) * 2019-10-25 2021-04-29 Dic株式会社 多官能フェノール樹脂、多官能エポキシ樹脂、それらを含む硬化性樹脂組成物及びその硬化物
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1187232A (en) * 1980-04-17 1985-05-14 John R. Blickensderfer Phenolic friction particles
JPS62167318A (ja) * 1986-01-20 1987-07-23 Teijin Ltd エポキシ樹脂の硬化方法
JPS6225116A (ja) * 1986-07-17 1987-02-03 Agency Of Ind Science & Technol 新規ポリグリシジルエ−テルから得られる樹脂
JPH01271415A (ja) * 1988-04-22 1989-10-30 Dainippon Ink & Chem Inc 熱硬化性エポキシ樹脂組成物
JP2628099B2 (ja) * 1989-08-18 1997-07-09 武田薬品工業株式会社 軟質ウレタンフォームの製造法
JP2679010B2 (ja) * 1989-08-23 1997-11-19 工業技術院長 有機強磁性体及びその製造方法
US4960634A (en) * 1990-03-14 1990-10-02 International Business Machines Corporation Epoxy composition of increased thermal conductivity and use thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160135163A (ko) * 2014-03-20 2016-11-25 디아이씨 가부시끼가이샤 노볼락형 페놀성 수산기 함유 수지, 그 제조 방법, 경화성 조성물, 레지스트용 조성물 및 컬러 레지스트
KR102287568B1 (ko) 2014-03-20 2021-08-10 디아이씨 가부시끼가이샤 노볼락형 페놀성 수산기 함유 수지, 그 제조 방법, 경화성 조성물, 레지스트용 조성물 및 컬러 레지스트

Also Published As

Publication number Publication date
DE69222109T2 (de) 1998-01-29
EP0536748A1 (en) 1993-04-14
MY108461A (en) 1996-09-30
CA2079821A1 (en) 1993-04-12
DE69222109D1 (de) 1997-10-16
SG50417A1 (en) 1998-07-20
KR930007997A (ko) 1993-05-20
EP0536748B1 (en) 1997-09-10
TW206247B (enExample) 1993-05-21
US5478871A (en) 1995-12-26

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