KR100203822B1 - 용매 또는 분산제로서 물을 함유하는 감광성 조성물 및 그의 제조방법 - Google Patents

용매 또는 분산제로서 물을 함유하는 감광성 조성물 및 그의 제조방법 Download PDF

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Publication number
KR100203822B1
KR100203822B1 KR1019910023310A KR910023310A KR100203822B1 KR 100203822 B1 KR100203822 B1 KR 100203822B1 KR 1019910023310 A KR1019910023310 A KR 1019910023310A KR 910023310 A KR910023310 A KR 910023310A KR 100203822 B1 KR100203822 B1 KR 100203822B1
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South Korea
Prior art keywords
water
composition
substrate
coating
weight
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Expired - Fee Related
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KR1019910023310A
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English (en)
Korean (ko)
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KR920013026A (ko
Inventor
삐에르-일레으 살뱅 로제르
슐테스 아드리안
Original Assignee
월터 클리웨인, 한스 피터 위트린
시바 에스씨 홀딩아게
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Application filed by 월터 클리웨인, 한스 피터 위트린, 시바 에스씨 홀딩아게 filed Critical 월터 클리웨인, 한스 피터 위트린
Publication of KR920013026A publication Critical patent/KR920013026A/ko
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Publication of KR100203822B1 publication Critical patent/KR100203822B1/ko
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/04—Chromates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/148—Light sensitive titanium compound containing

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
  • Polyurethanes Or Polyureas (AREA)
KR1019910023310A 1990-12-18 1991-12-16 용매 또는 분산제로서 물을 함유하는 감광성 조성물 및 그의 제조방법 Expired - Fee Related KR100203822B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH401090 1990-12-18
CH4010/90-8 1990-12-18
CH04010/90-8 1990-12-18

Publications (2)

Publication Number Publication Date
KR920013026A KR920013026A (ko) 1992-07-28
KR100203822B1 true KR100203822B1 (ko) 1999-06-15

Family

ID=4268122

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910023310A Expired - Fee Related KR100203822B1 (ko) 1990-12-18 1991-12-16 용매 또는 분산제로서 물을 함유하는 감광성 조성물 및 그의 제조방법

Country Status (7)

Country Link
US (2) US5501942A (enExample)
EP (1) EP0493317B2 (enExample)
JP (1) JP2688583B2 (enExample)
KR (1) KR100203822B1 (enExample)
CA (1) CA2057725C (enExample)
DE (1) DE59108989D1 (enExample)
TW (1) TW208071B (enExample)

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US6325730B1 (en) 1992-04-24 2001-12-04 Spalding Sports Worldwide, Inc. Golf ball with soft core
US6315684B1 (en) 1992-04-24 2001-11-13 Spalding Sports Worldwide, Inc. Golf ball with soft core
US6422953B1 (en) 1992-04-24 2002-07-23 Spalding Sports Worldwide, Inc. Golf ball
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DE69502741T2 (de) * 1994-01-10 1998-10-01 Du Pont Lichtempfindliche wässrige Emulsion, lichtempfindlicher Film und Verfahren zur Herstellung
DE19510766A1 (de) * 1995-03-24 1996-09-26 Bayer Ag Epoxy(meth)acrylate, ein Verfahren zu ihrer Herstellung und ihre Verwendung
JP3877802B2 (ja) * 1995-05-02 2007-02-07 株式会社リコー エマルジョンインク及びこれを用いた印刷方法
US5512607A (en) * 1995-06-06 1996-04-30 W. R. Grace & Co.-Conn. Unsaturated epoxy ester with quaternary ammonium and phosphate groups
WO1996041240A1 (en) * 1995-06-07 1996-12-19 W.R. Grace & Co.-Conn. Water photoresist emulsions and methods of preparation thereof
US5925499A (en) * 1995-08-01 1999-07-20 Morton International, Inc. Epoxy-containing waterborne photoimageable composition
US5912106A (en) * 1996-09-10 1999-06-15 Ciba Specialty Chemicals Corporation Method for improving photoimage quality
AU721046B2 (en) * 1996-12-19 2000-06-22 Rohm And Haas Company Coating substrates
DE19718948A1 (de) * 1997-05-05 1998-11-12 Basf Ag Wässrige, strahlungshärtbare Beschichtungsmassen
JP4523679B2 (ja) * 1998-06-22 2010-08-11 太陽インキ製造株式会社 ハロゲンフリーの着色顔料を用いたプリント配線板用緑色レジストインキ組成物
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US6187374B1 (en) 1998-09-02 2001-02-13 Xim Products, Inc. Coatings with increased adhesion
US6048587A (en) * 1998-10-01 2000-04-11 Ricon Resins, Inc. Water-dispersible, radiation and thermally-curable polymeric compositions
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US6433038B1 (en) * 1999-03-16 2002-08-13 Seiko Epson Corporation Photocurable ink composition for ink jet recording and ink jet recording method using the same
JP2001222103A (ja) * 1999-08-05 2001-08-17 Nippon Paint Co Ltd 水性フォトソルダーレジスト組成物
US6342541B1 (en) * 1999-12-08 2002-01-29 Advanced Ceramics Research, Inc. Machinable positive image model material for shape deposition manufacturing
US6803112B1 (en) * 2000-03-29 2004-10-12 Sun Chemical Corporation Radiation curable aqueous compositions for low extractable film packaging
US7037953B2 (en) * 2000-03-29 2006-05-02 Sun Chemical Corporation Radiation curable aqueous compositions
DE10026955A1 (de) * 2000-05-30 2001-12-13 Daimler Chrysler Ag Materialsystem zur Verwendung beim 3D-Drucken
DE50205110D1 (de) * 2001-03-05 2006-01-05 Georg Gros Beschichtungsgemisch auf wasserbasis, verfahren zum aufbringen einer korrosionsschutzschicht mit diesem gemisch, derart beschichtete unterlage und deren verwendung
US7141614B2 (en) 2001-10-30 2006-11-28 Kaneka Corporation Photosensitive resin composition and photosensitive films and laminates made by using the same
CN1582416A (zh) * 2001-12-03 2005-02-16 昭和电工株式会社 光敏膜和印刷线路板用光敏组合物及其生产方法
US7713445B2 (en) * 2002-04-20 2010-05-11 Chemetall Gmbh Mixture for applying a non-corrosive, thin polymer coating which can be shaped in a low-abrasive manner, and method for producing the same
JP2004020643A (ja) * 2002-06-12 2004-01-22 Fuji Photo Film Co Ltd ドライフィルムレジスト及びプリント基板の製造方法
KR100629887B1 (ko) * 2003-05-14 2006-09-28 이규한 금속 칩스케일 반도체패키지 및 그 제조방법
JP4531475B2 (ja) * 2003-08-15 2010-08-25 株式会社半導体エネルギー研究所 半導体装置の作製方法
US20050056954A1 (en) * 2003-09-12 2005-03-17 Devlin Brian Gerrard Method for making contact lenses
TW200630447A (en) 2004-11-19 2006-09-01 Showa Denko Kk Resin cured film for flexible printed wiring board and production process thereof
US7863485B2 (en) * 2004-12-10 2011-01-04 Omnitech Environmental, Llc Additive and vehicle for inks, paints, coatings and adhesives
US7199192B2 (en) * 2004-12-21 2007-04-03 Callaway Golf Company Golf ball
CN101277979B (zh) 2005-09-30 2010-05-19 株式会社日本触媒 水性固化性树脂组合物
JP2012003225A (ja) 2010-01-27 2012-01-05 Fujifilm Corp ソルダーレジスト用重合性組成物及びソルダーレジストパターンの形成方法
JP5417364B2 (ja) 2011-03-08 2014-02-12 富士フイルム株式会社 固体撮像素子用硬化性組成物、並びに、これを用いた感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法
KR101313441B1 (ko) 2011-10-25 2013-10-01 주식회사 포스코 용접성, 내스크래치성 및 내식성이 우수한 표면처리 강판
KR102122284B1 (ko) * 2013-05-13 2020-06-12 제이에스알 가부시끼가이샤 중합체 조성물, 가교 중합체 및 타이어
KR102609535B1 (ko) * 2015-07-08 2023-12-04 주식회사 동진쎄미켐 포토레지스트 패턴 코팅용 조성물 및 이를 이용한 미세 패턴 형성 방법
TWI707004B (zh) * 2018-08-02 2020-10-11 臻鼎科技股份有限公司 感光樹脂組合物及其製備方法
CN114539843B (zh) * 2021-12-21 2023-03-28 深圳市容大感光科技股份有限公司 一种喷墨打印阻焊油墨组合物及其线路板

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Also Published As

Publication number Publication date
DE59108989D1 (de) 1998-06-25
TW208071B (enExample) 1993-06-21
EP0493317B1 (de) 1998-05-20
EP0493317A1 (de) 1992-07-01
JP2688583B2 (ja) 1997-12-10
CA2057725C (en) 2000-09-19
CA2057725A1 (en) 1992-06-19
US5691006A (en) 1997-11-25
US5501942A (en) 1996-03-26
KR920013026A (ko) 1992-07-28
JPH059407A (ja) 1993-01-19
EP0493317B2 (de) 2001-01-10

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