TW208071B - - Google Patents

Info

Publication number
TW208071B
TW208071B TW080109862A TW80109862A TW208071B TW 208071 B TW208071 B TW 208071B TW 080109862 A TW080109862 A TW 080109862A TW 80109862 A TW80109862 A TW 80109862A TW 208071 B TW208071 B TW 208071B
Authority
TW
Taiwan
Application number
TW080109862A
Other languages
Chinese (zh)
Original Assignee
Ciba Geigy Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=4268122&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW208071(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ciba Geigy Ag filed Critical Ciba Geigy Ag
Application granted granted Critical
Publication of TW208071B publication Critical patent/TW208071B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/04—Chromates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/148—Light sensitive titanium compound containing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
  • Polyurethanes Or Polyureas (AREA)
TW080109862A 1990-12-18 1991-12-17 TW208071B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH401090 1990-12-18

Publications (1)

Publication Number Publication Date
TW208071B true TW208071B (enExample) 1993-06-21

Family

ID=4268122

Family Applications (1)

Application Number Title Priority Date Filing Date
TW080109862A TW208071B (enExample) 1990-12-18 1991-12-17

Country Status (7)

Country Link
US (2) US5501942A (enExample)
EP (1) EP0493317B2 (enExample)
JP (1) JP2688583B2 (enExample)
KR (1) KR100203822B1 (enExample)
CA (1) CA2057725C (enExample)
DE (1) DE59108989D1 (enExample)
TW (1) TW208071B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707004B (zh) * 2018-08-02 2020-10-11 臻鼎科技股份有限公司 感光樹脂組合物及其製備方法

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US6422953B1 (en) 1992-04-24 2002-07-23 Spalding Sports Worldwide, Inc. Golf ball
US6315684B1 (en) 1992-04-24 2001-11-13 Spalding Sports Worldwide, Inc. Golf ball with soft core
US6413172B1 (en) 1992-04-24 2002-07-02 Spalding Sports Worldwide, Inc. Golf ball with soft core
US6325730B1 (en) 1992-04-24 2001-12-04 Spalding Sports Worldwide, Inc. Golf ball with soft core
TW268031B (enExample) * 1993-07-02 1996-01-11 Ciba Geigy
US5741621A (en) * 1994-01-10 1998-04-21 E. I. Du Pont De Nemours And Company Process for using photoimageable films prepared for aqueous photoimageable liquid emulsions
DE69502741T2 (de) * 1994-01-10 1998-10-01 Du Pont Lichtempfindliche wässrige Emulsion, lichtempfindlicher Film und Verfahren zur Herstellung
DE19510766A1 (de) * 1995-03-24 1996-09-26 Bayer Ag Epoxy(meth)acrylate, ein Verfahren zu ihrer Herstellung und ihre Verwendung
JP3877802B2 (ja) * 1995-05-02 2007-02-07 株式会社リコー エマルジョンインク及びこれを用いた印刷方法
US5512607A (en) * 1995-06-06 1996-04-30 W. R. Grace & Co.-Conn. Unsaturated epoxy ester with quaternary ammonium and phosphate groups
WO1996041240A1 (en) * 1995-06-07 1996-12-19 W.R. Grace & Co.-Conn. Water photoresist emulsions and methods of preparation thereof
US5925499A (en) * 1995-08-01 1999-07-20 Morton International, Inc. Epoxy-containing waterborne photoimageable composition
US5912106A (en) * 1996-09-10 1999-06-15 Ciba Specialty Chemicals Corporation Method for improving photoimage quality
AU721046B2 (en) * 1996-12-19 2000-06-22 Rohm And Haas Company Coating substrates
DE19718948A1 (de) * 1997-05-05 1998-11-12 Basf Ag Wässrige, strahlungshärtbare Beschichtungsmassen
JP4523679B2 (ja) * 1998-06-22 2010-08-11 太陽インキ製造株式会社 ハロゲンフリーの着色顔料を用いたプリント配線板用緑色レジストインキ組成物
WO2000002091A1 (en) 1998-07-07 2000-01-13 Kansai Paint Co., Ltd. Water-based solder resist composition
US6187374B1 (en) 1998-09-02 2001-02-13 Xim Products, Inc. Coatings with increased adhesion
US6048587A (en) * 1998-10-01 2000-04-11 Ricon Resins, Inc. Water-dispersible, radiation and thermally-curable polymeric compositions
KR100674660B1 (ko) 1998-12-22 2007-01-26 훈츠만 어드밴스트 머티리얼스(스위처랜드)게엠베하 포토레지스트 코팅의 제조 방법
US6433038B1 (en) * 1999-03-16 2002-08-13 Seiko Epson Corporation Photocurable ink composition for ink jet recording and ink jet recording method using the same
JP2001222103A (ja) * 1999-08-05 2001-08-17 Nippon Paint Co Ltd 水性フォトソルダーレジスト組成物
US6342541B1 (en) * 1999-12-08 2002-01-29 Advanced Ceramics Research, Inc. Machinable positive image model material for shape deposition manufacturing
US7037953B2 (en) * 2000-03-29 2006-05-02 Sun Chemical Corporation Radiation curable aqueous compositions
US6803112B1 (en) * 2000-03-29 2004-10-12 Sun Chemical Corporation Radiation curable aqueous compositions for low extractable film packaging
DE10026955A1 (de) * 2000-05-30 2001-12-13 Daimler Chrysler Ag Materialsystem zur Verwendung beim 3D-Drucken
JP2004531597A (ja) * 2001-03-05 2004-10-14 グロス ゲオルク 水をベースとする被覆物混合物、該混合物を用いた腐食防止層の塗布法、この種の被覆された下地および該下地の使用
KR100589067B1 (ko) 2001-10-30 2006-06-14 가부시키가이샤 가네카 감광성 수지 조성물, 이것을 이용한 감광성 필름 및 적층체
CN1582416A (zh) * 2001-12-03 2005-02-16 昭和电工株式会社 光敏膜和印刷线路板用光敏组合物及其生产方法
US7482040B2 (en) * 2002-04-20 2009-01-27 Chemetall Gmbh Mixture for applying a polymeric corrosion-proof electrically weldable covering and method for producing this covering
JP2004020643A (ja) * 2002-06-12 2004-01-22 Fuji Photo Film Co Ltd ドライフィルムレジスト及びプリント基板の製造方法
KR100629887B1 (ko) * 2003-05-14 2006-09-28 이규한 금속 칩스케일 반도체패키지 및 그 제조방법
JP4531475B2 (ja) * 2003-08-15 2010-08-25 株式会社半導体エネルギー研究所 半導体装置の作製方法
US20050056954A1 (en) * 2003-09-12 2005-03-17 Devlin Brian Gerrard Method for making contact lenses
TW200630447A (en) 2004-11-19 2006-09-01 Showa Denko Kk Resin cured film for flexible printed wiring board and production process thereof
US7863485B2 (en) * 2004-12-10 2011-01-04 Omnitech Environmental, Llc Additive and vehicle for inks, paints, coatings and adhesives
US7199192B2 (en) * 2004-12-21 2007-04-03 Callaway Golf Company Golf ball
EP1948699A4 (en) 2005-09-30 2010-02-17 Nippon Catalytic Chem Ind AQUEOUS CURED RESIN COMPOSITION
JP2012003225A (ja) 2010-01-27 2012-01-05 Fujifilm Corp ソルダーレジスト用重合性組成物及びソルダーレジストパターンの形成方法
JP5417364B2 (ja) 2011-03-08 2014-02-12 富士フイルム株式会社 固体撮像素子用硬化性組成物、並びに、これを用いた感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法
KR101313441B1 (ko) 2011-10-25 2013-10-01 주식회사 포스코 용접성, 내스크래치성 및 내식성이 우수한 표면처리 강판
TWI538951B (zh) * 2013-05-13 2016-06-21 Jsr股份有限公司 聚合體、聚合體組成物、交聯聚合體及輪胎
KR102609535B1 (ko) * 2015-07-08 2023-12-04 주식회사 동진쎄미켐 포토레지스트 패턴 코팅용 조성물 및 이를 이용한 미세 패턴 형성 방법
CN114539843B (zh) * 2021-12-21 2023-03-28 深圳市容大感光科技股份有限公司 一种喷墨打印阻焊油墨组合物及其线路板

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707004B (zh) * 2018-08-02 2020-10-11 臻鼎科技股份有限公司 感光樹脂組合物及其製備方法

Also Published As

Publication number Publication date
EP0493317A1 (de) 1992-07-01
EP0493317B2 (de) 2001-01-10
CA2057725A1 (en) 1992-06-19
US5691006A (en) 1997-11-25
CA2057725C (en) 2000-09-19
JPH059407A (ja) 1993-01-19
JP2688583B2 (ja) 1997-12-10
KR920013026A (ko) 1992-07-28
EP0493317B1 (de) 1998-05-20
US5501942A (en) 1996-03-26
KR100203822B1 (ko) 1999-06-15
DE59108989D1 (de) 1998-06-25

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