KR0185790B1 - 반도체 장치의 제조방법 - Google Patents

반도체 장치의 제조방법 Download PDF

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Publication number
KR0185790B1
KR0185790B1 KR1019950002160A KR19950002160A KR0185790B1 KR 0185790 B1 KR0185790 B1 KR 0185790B1 KR 1019950002160 A KR1019950002160 A KR 1019950002160A KR 19950002160 A KR19950002160 A KR 19950002160A KR 0185790 B1 KR0185790 B1 KR 0185790B1
Authority
KR
South Korea
Prior art keywords
lead
die pad
semiconductor device
mold
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019950002160A
Other languages
English (en)
Korean (ko)
Other versions
KR950025963A (ko
Inventor
테쯔야 우에다
카즈나리 미찌이
유따까 코야마
나오또 우에다
Original Assignee
기다오까 다까시
미쓰비시 뎅끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 기다오까 다까시, 미쓰비시 뎅끼 가부시끼가이샤 filed Critical 기다오까 다까시
Publication of KR950025963A publication Critical patent/KR950025963A/ko
Application granted granted Critical
Publication of KR0185790B1 publication Critical patent/KR0185790B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H10W74/016—
    • H10W70/442—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/932—
    • H10W74/00—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1019950002160A 1994-02-07 1995-02-07 반도체 장치의 제조방법 Expired - Lifetime KR0185790B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP94-13751 1994-02-07
JP6013751A JP2866572B2 (ja) 1994-02-07 1994-02-07 半導体製造方法
JP94-013751 1994-02-07

Publications (2)

Publication Number Publication Date
KR950025963A KR950025963A (ko) 1995-09-18
KR0185790B1 true KR0185790B1 (ko) 1999-03-20

Family

ID=11841960

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950002160A Expired - Lifetime KR0185790B1 (ko) 1994-02-07 1995-02-07 반도체 장치의 제조방법

Country Status (5)

Country Link
US (1) US5508232A (cg-RX-API-DMAC10.html)
JP (1) JP2866572B2 (cg-RX-API-DMAC10.html)
KR (1) KR0185790B1 (cg-RX-API-DMAC10.html)
DE (1) DE19503823C2 (cg-RX-API-DMAC10.html)
TW (1) TW269740B (cg-RX-API-DMAC10.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260550A (ja) * 1996-03-22 1997-10-03 Mitsubishi Electric Corp 半導体装置
US6600215B1 (en) * 1998-04-02 2003-07-29 Micron Technology, Inc. Method and apparatus for coupling a semiconductor die to die terminals
TW434756B (en) 1998-06-01 2001-05-16 Hitachi Ltd Semiconductor device and its manufacturing method
US6221748B1 (en) * 1999-08-19 2001-04-24 Micron Technology, Inc. Apparatus and method for providing mechanically pre-formed conductive leads
US6199743B1 (en) 1999-08-19 2001-03-13 Micron Technology, Inc. Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
KR100391124B1 (ko) * 2001-05-18 2003-07-12 에쓰에쓰아이 주식회사 반도체 패키지의 베이스, 이를 이용한 반도체 패키지 및그 제조방법
US20060278962A1 (en) * 2005-06-09 2006-12-14 Tessera, Inc. Microelectronic loop packages
JP2008218776A (ja) * 2007-03-06 2008-09-18 Renesas Technology Corp 半導体装置
US7763958B1 (en) * 2007-05-25 2010-07-27 National Semiconductor Corporation Leadframe panel for power packages
TWI462194B (zh) * 2011-08-25 2014-11-21 南茂科技股份有限公司 半導體封裝結構及其製作方法
DE112015007224B4 (de) * 2015-12-23 2022-06-30 Intel Corporation Umgekehrt montiertes Gull-Wing Elektronikgehäuse
US10867894B2 (en) * 2018-10-11 2020-12-15 Asahi Kasei Microdevices Corporation Semiconductor element including encapsulated lead frames
JP2024112603A (ja) * 2023-02-08 2024-08-21 三菱電機株式会社 半導体装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4445271A (en) * 1981-08-14 1984-05-01 Amp Incorporated Ceramic chip carrier with removable lead frame support and preforated ground pad
JP2582013B2 (ja) * 1991-02-08 1997-02-19 株式会社東芝 樹脂封止型半導体装置及びその製造方法
JPS5966157A (ja) * 1982-10-08 1984-04-14 Fujitsu Ltd 半導体装置及びその製造方法
JPS60113932A (ja) * 1983-11-26 1985-06-20 Mitsubishi Electric Corp 樹脂封止半導体装置の組立方法
JPH01201947A (ja) * 1988-02-05 1989-08-14 Nec Corp 半導体装置
US5018003A (en) * 1988-10-20 1991-05-21 Mitsubishi Denki Kabushiki Kaisha Lead frame and semiconductor device
JPH02253650A (ja) * 1989-03-28 1990-10-12 Nec Corp リードフレーム
US5278101A (en) * 1989-06-28 1994-01-11 Kabushiki Kaisha Toshiba Semiconductor device and method for manufacturing the same
US5334872A (en) * 1990-01-29 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad
JPH0760837B2 (ja) * 1990-03-13 1995-06-28 株式会社東芝 樹脂封止型半導体装置
US5202288A (en) * 1990-06-01 1993-04-13 Robert Bosch Gmbh Method of manufacturing an electronic circuit component incorporating a heat sink
JP2877479B2 (ja) * 1990-09-27 1999-03-31 株式会社東芝 半導体装置用リードフレーム
JPH04192450A (ja) * 1990-11-27 1992-07-10 Sumitomo Metal Mining Co Ltd 複合リードフレーム
JPH04249348A (ja) * 1991-02-05 1992-09-04 Toshiba Corp 樹脂封止型半導体装置およびその製造方法
JP3215851B2 (ja) * 1991-02-13 2001-10-09 日立化成工業株式会社 樹脂封止型半導体装置およびその製造法
US5214846A (en) * 1991-04-24 1993-06-01 Sony Corporation Packaging of semiconductor chips
KR100552353B1 (ko) * 1992-03-27 2006-06-20 가부시키가이샤 히타치초엘에스아이시스템즈 리이드프레임및그것을사용한반도체집적회로장치와그제조방법
US5327008A (en) * 1993-03-22 1994-07-05 Motorola Inc. Semiconductor device having universal low-stress die support and method for making the same

Also Published As

Publication number Publication date
DE19503823A1 (de) 1995-08-10
DE19503823C2 (de) 2001-01-25
US5508232A (en) 1996-04-16
KR950025963A (ko) 1995-09-18
JPH07221243A (ja) 1995-08-18
JP2866572B2 (ja) 1999-03-08
TW269740B (cg-RX-API-DMAC10.html) 1996-02-01

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