JPWO2025109919A5 - - Google Patents

Info

Publication number
JPWO2025109919A5
JPWO2025109919A5 JP2025559097A JP2025559097A JPWO2025109919A5 JP WO2025109919 A5 JPWO2025109919 A5 JP WO2025109919A5 JP 2025559097 A JP2025559097 A JP 2025559097A JP 2025559097 A JP2025559097 A JP 2025559097A JP WO2025109919 A5 JPWO2025109919 A5 JP WO2025109919A5
Authority
JP
Japan
Prior art keywords
insulating layer
die pad
lead
semiconductor element
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025559097A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025109919A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/036978 external-priority patent/WO2025109919A1/ja
Publication of JPWO2025109919A1 publication Critical patent/JPWO2025109919A1/ja
Publication of JPWO2025109919A5 publication Critical patent/JPWO2025109919A5/ja
Pending legal-status Critical Current

Links

JP2025559097A 2023-11-21 2024-10-17 Pending JPWO2025109919A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023197160 2023-11-21
PCT/JP2024/036978 WO2025109919A1 (ja) 2023-11-21 2024-10-17 半導体装置および電力変換装置

Publications (2)

Publication Number Publication Date
JPWO2025109919A1 JPWO2025109919A1 (https=) 2025-05-30
JPWO2025109919A5 true JPWO2025109919A5 (https=) 2026-02-09

Family

ID=95826515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025559097A Pending JPWO2025109919A1 (https=) 2023-11-21 2024-10-17

Country Status (2)

Country Link
JP (1) JPWO2025109919A1 (https=)
WO (1) WO2025109919A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110867A (ja) * 2000-10-02 2002-04-12 Toshiba Corp 半導体装置及びその製造方法
JP2008153430A (ja) * 2006-12-18 2008-07-03 Mitsubishi Electric Corp 放熱基板並びに熱伝導性シートおよびこれらを用いたパワーモジュール
JP5246143B2 (ja) * 2009-11-24 2013-07-24 富士電機株式会社 半導体モジュールおよびその製造方法ならびに電気機器
JP6301602B2 (ja) * 2013-07-22 2018-03-28 ローム株式会社 パワーモジュールおよびその製造方法
WO2019235267A1 (ja) * 2018-06-04 2019-12-12 ローム株式会社 半導体装置

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