JPWO2025109919A1 - - Google Patents
Info
- Publication number
- JPWO2025109919A1 JPWO2025109919A1 JP2025559097A JP2025559097A JPWO2025109919A1 JP WO2025109919 A1 JPWO2025109919 A1 JP WO2025109919A1 JP 2025559097 A JP2025559097 A JP 2025559097A JP 2025559097 A JP2025559097 A JP 2025559097A JP WO2025109919 A1 JPWO2025109919 A1 JP WO2025109919A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023197160 | 2023-11-21 | ||
| PCT/JP2024/036978 WO2025109919A1 (ja) | 2023-11-21 | 2024-10-17 | 半導体装置および電力変換装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025109919A1 true JPWO2025109919A1 (https=) | 2025-05-30 |
| JPWO2025109919A5 JPWO2025109919A5 (https=) | 2026-02-09 |
Family
ID=95826515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025559097A Pending JPWO2025109919A1 (https=) | 2023-11-21 | 2024-10-17 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025109919A1 (https=) |
| WO (1) | WO2025109919A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002110867A (ja) * | 2000-10-02 | 2002-04-12 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP2008153430A (ja) * | 2006-12-18 | 2008-07-03 | Mitsubishi Electric Corp | 放熱基板並びに熱伝導性シートおよびこれらを用いたパワーモジュール |
| JP5246143B2 (ja) * | 2009-11-24 | 2013-07-24 | 富士電機株式会社 | 半導体モジュールおよびその製造方法ならびに電気機器 |
| JP6301602B2 (ja) * | 2013-07-22 | 2018-03-28 | ローム株式会社 | パワーモジュールおよびその製造方法 |
| WO2019235267A1 (ja) * | 2018-06-04 | 2019-12-12 | ローム株式会社 | 半導体装置 |
-
2024
- 2024-10-17 WO PCT/JP2024/036978 patent/WO2025109919A1/ja active Pending
- 2024-10-17 JP JP2025559097A patent/JPWO2025109919A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025109919A1 (ja) | 2025-05-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251110 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251110 |