JPWO2024014410A5 - - Google Patents

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Publication number
JPWO2024014410A5
JPWO2024014410A5 JP2024533691A JP2024533691A JPWO2024014410A5 JP WO2024014410 A5 JPWO2024014410 A5 JP WO2024014410A5 JP 2024533691 A JP2024533691 A JP 2024533691A JP 2024533691 A JP2024533691 A JP 2024533691A JP WO2024014410 A5 JPWO2024014410 A5 JP WO2024014410A5
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JP
Japan
Prior art keywords
recess
semiconductor device
power semiconductor
convex portion
protrusion
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Application number
JP2024533691A
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English (en)
Japanese (ja)
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JPWO2024014410A1 (https=
JP7766804B2 (ja
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Priority claimed from PCT/JP2023/025284 external-priority patent/WO2024014410A1/ja
Publication of JPWO2024014410A1 publication Critical patent/JPWO2024014410A1/ja
Publication of JPWO2024014410A5 publication Critical patent/JPWO2024014410A5/ja
Application granted granted Critical
Publication of JP7766804B2 publication Critical patent/JP7766804B2/ja
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JP2024533691A 2022-07-14 2023-07-07 パワー半導体装置および電力変換装置 Active JP7766804B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022113036 2022-07-14
JP2022113036 2022-07-14
PCT/JP2023/025284 WO2024014410A1 (ja) 2022-07-14 2023-07-07 パワー半導体装置および電力変換装置

Publications (3)

Publication Number Publication Date
JPWO2024014410A1 JPWO2024014410A1 (https=) 2024-01-18
JPWO2024014410A5 true JPWO2024014410A5 (https=) 2024-10-01
JP7766804B2 JP7766804B2 (ja) 2025-11-10

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ID=89536667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024533691A Active JP7766804B2 (ja) 2022-07-14 2023-07-07 パワー半導体装置および電力変換装置

Country Status (4)

Country Link
US (1) US20250301760A1 (https=)
JP (1) JP7766804B2 (https=)
CN (1) CN119487992A (https=)
WO (1) WO2024014410A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024237110A1 (https=) * 2023-05-16 2024-11-21

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5556531B2 (ja) * 2010-09-17 2014-07-23 株式会社デンソー 電子モジュールの取付構造
JP5831273B2 (ja) 2012-02-09 2015-12-09 三菱電機株式会社 半導体装置およびその製造方法
JP5975909B2 (ja) 2013-03-14 2016-08-23 三菱電機株式会社 半導体装置
CN109891579B (zh) 2016-10-31 2023-06-20 三菱电机株式会社 半导体装置及其制造方法
US11152280B2 (en) 2016-11-24 2021-10-19 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same

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