JP7766804B2 - パワー半導体装置および電力変換装置 - Google Patents

パワー半導体装置および電力変換装置

Info

Publication number
JP7766804B2
JP7766804B2 JP2024533691A JP2024533691A JP7766804B2 JP 7766804 B2 JP7766804 B2 JP 7766804B2 JP 2024533691 A JP2024533691 A JP 2024533691A JP 2024533691 A JP2024533691 A JP 2024533691A JP 7766804 B2 JP7766804 B2 JP 7766804B2
Authority
JP
Japan
Prior art keywords
recess
semiconductor device
power semiconductor
heat sink
convex portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024533691A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024014410A1 (https=
JPWO2024014410A5 (https=
Inventor
晴菜 多田
泰之 三田
正喜 後藤
達志 森貞
隼人 寺田
穂隆 六分一
嘉教 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2024014410A1 publication Critical patent/JPWO2024014410A1/ja
Publication of JPWO2024014410A5 publication Critical patent/JPWO2024014410A5/ja
Application granted granted Critical
Publication of JP7766804B2 publication Critical patent/JP7766804B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D80/00—Assemblies of multiple devices comprising at least one device covered by this subclass
    • H10D80/20—Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups H10D1/00 - H10D48/00, e.g. assemblies comprising capacitors, power FETs or Schottky diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
    • H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
    • H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using DC to AC converters or inverters
    • H02P27/08—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using DC to AC converters or inverters with pulse width modulation

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
JP2024533691A 2022-07-14 2023-07-07 パワー半導体装置および電力変換装置 Active JP7766804B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022113036 2022-07-14
JP2022113036 2022-07-14
PCT/JP2023/025284 WO2024014410A1 (ja) 2022-07-14 2023-07-07 パワー半導体装置および電力変換装置

Publications (3)

Publication Number Publication Date
JPWO2024014410A1 JPWO2024014410A1 (https=) 2024-01-18
JPWO2024014410A5 JPWO2024014410A5 (https=) 2024-10-01
JP7766804B2 true JP7766804B2 (ja) 2025-11-10

Family

ID=89536667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024533691A Active JP7766804B2 (ja) 2022-07-14 2023-07-07 パワー半導体装置および電力変換装置

Country Status (4)

Country Link
US (1) US20250301760A1 (https=)
JP (1) JP7766804B2 (https=)
CN (1) CN119487992A (https=)
WO (1) WO2024014410A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024237110A1 (https=) * 2023-05-16 2024-11-21

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013165122A (ja) 2012-02-09 2013-08-22 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2014179394A (ja) 2013-03-14 2014-09-25 Mitsubishi Electric Corp 半導体装置
WO2018079396A1 (ja) 2016-10-31 2018-05-03 三菱電機株式会社 半導体装置およびその製造方法
WO2018097027A1 (ja) 2016-11-24 2018-05-31 三菱電機株式会社 半導体装置およびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5556531B2 (ja) * 2010-09-17 2014-07-23 株式会社デンソー 電子モジュールの取付構造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013165122A (ja) 2012-02-09 2013-08-22 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2014179394A (ja) 2013-03-14 2014-09-25 Mitsubishi Electric Corp 半導体装置
WO2018079396A1 (ja) 2016-10-31 2018-05-03 三菱電機株式会社 半導体装置およびその製造方法
WO2018097027A1 (ja) 2016-11-24 2018-05-31 三菱電機株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPWO2024014410A1 (https=) 2024-01-18
US20250301760A1 (en) 2025-09-25
WO2024014410A1 (ja) 2024-01-18
CN119487992A (zh) 2025-02-18

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