JPWO2024237110A1 - - Google Patents
Info
- Publication number
- JPWO2024237110A1 JPWO2024237110A1 JP2025520513A JP2025520513A JPWO2024237110A1 JP WO2024237110 A1 JPWO2024237110 A1 JP WO2024237110A1 JP 2025520513 A JP2025520513 A JP 2025520513A JP 2025520513 A JP2025520513 A JP 2025520513A JP WO2024237110 A1 JPWO2024237110 A1 JP WO2024237110A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
- H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
- H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023080518 | 2023-05-16 | ||
| PCT/JP2024/016811 WO2024237110A1 (ja) | 2023-05-16 | 2024-05-01 | パワーモジュール、パワーモジュールの製造方法、および電力変換装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024237110A1 true JPWO2024237110A1 (https=) | 2024-11-21 |
| JPWO2024237110A5 JPWO2024237110A5 (https=) | 2025-08-13 |
Family
ID=93519108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025520513A Pending JPWO2024237110A1 (https=) | 2023-05-16 | 2024-05-01 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024237110A1 (https=) |
| WO (1) | WO2024237110A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119601549A (zh) * | 2024-11-25 | 2025-03-11 | 黑龙江汇芯半导体有限公司 | 一种半导体电路 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014179394A (ja) * | 2013-03-14 | 2014-09-25 | Mitsubishi Electric Corp | 半導体装置 |
| JP2016086134A (ja) * | 2014-10-29 | 2016-05-19 | 三菱電機株式会社 | ヒートシンク、ヒートシンク一体型パワーモジュールおよびそれらの製造方法 |
| WO2018079396A1 (ja) * | 2016-10-31 | 2018-05-03 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| WO2018097027A1 (ja) * | 2016-11-24 | 2018-05-31 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250301760A1 (en) * | 2022-07-14 | 2025-09-25 | Mitsubishi Electric Corporation | Power semiconductor device and power conversion device |
-
2024
- 2024-05-01 JP JP2025520513A patent/JPWO2024237110A1/ja active Pending
- 2024-05-01 WO PCT/JP2024/016811 patent/WO2024237110A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014179394A (ja) * | 2013-03-14 | 2014-09-25 | Mitsubishi Electric Corp | 半導体装置 |
| JP2016086134A (ja) * | 2014-10-29 | 2016-05-19 | 三菱電機株式会社 | ヒートシンク、ヒートシンク一体型パワーモジュールおよびそれらの製造方法 |
| WO2018079396A1 (ja) * | 2016-10-31 | 2018-05-03 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| WO2018097027A1 (ja) * | 2016-11-24 | 2018-05-31 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024237110A1 (ja) | 2024-11-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
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