JPWO2024262604A5 - - Google Patents
Info
- Publication number
- JPWO2024262604A5 JPWO2024262604A5 JP2025528131A JP2025528131A JPWO2024262604A5 JP WO2024262604 A5 JPWO2024262604 A5 JP WO2024262604A5 JP 2025528131 A JP2025528131 A JP 2025528131A JP 2025528131 A JP2025528131 A JP 2025528131A JP WO2024262604 A5 JPWO2024262604 A5 JP WO2024262604A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- formula
- resin composition
- composition according
- integer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023102122 | 2023-06-22 | ||
| PCT/JP2024/022527 WO2024262604A1 (ja) | 2023-06-22 | 2024-06-21 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024262604A1 JPWO2024262604A1 (https=) | 2024-12-26 |
| JPWO2024262604A5 true JPWO2024262604A5 (https=) | 2026-03-24 |
Family
ID=93935891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025528131A Pending JPWO2024262604A1 (https=) | 2023-06-22 | 2024-06-21 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024262604A1 (https=) |
| KR (1) | KR20260011177A (https=) |
| CN (1) | CN121335936A (https=) |
| TW (1) | TW202506830A (https=) |
| WO (1) | WO2024262604A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3469608D1 (en) * | 1983-07-01 | 1988-04-07 | Philips Nv | Photosensitive polyamic acid derivative, method of manufacturing polyimide pattern on a substrate, and semiconductor device comprising a polyimide pattern obtained by using the said method |
| JPS61296032A (ja) * | 1985-06-25 | 1986-12-26 | Asahi Chem Ind Co Ltd | 硬化性ポリイミド |
| JPH11282160A (ja) * | 1998-03-31 | 1999-10-15 | Hitachi Chemical Dupont Microsystems Ltd | 感光性ポリイミド組成物、これを用いたパターン製造法及び半導体装置 |
| CN101463115B (zh) * | 2008-12-30 | 2011-05-11 | 华烁科技股份有限公司 | 一种无胶挠性单面覆铜板用热固性聚酰亚胺树脂及其应用 |
| JP2013083958A (ja) * | 2011-09-26 | 2013-05-09 | Nippon Steel & Sumikin Chemical Co Ltd | 感光性樹脂組成物、それを用いた硬化物及び半導体素子 |
| JP7212301B2 (ja) * | 2018-08-30 | 2023-01-25 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置 |
| US11535709B2 (en) * | 2019-03-05 | 2022-12-27 | Promerus, Llc | Reactive end group containing polyimides and polyamic acids and photosensitive compositions thereof |
| WO2020203834A1 (ja) * | 2019-04-02 | 2020-10-08 | 日本化薬株式会社 | ビスマレイミド化合物、それを用いた感光性樹脂組成物、その硬化物及び半導体素子 |
-
2024
- 2024-06-20 TW TW113122904A patent/TW202506830A/zh unknown
- 2024-06-21 WO PCT/JP2024/022527 patent/WO2024262604A1/ja not_active Ceased
- 2024-06-21 KR KR1020257042072A patent/KR20260011177A/ko active Pending
- 2024-06-21 JP JP2025528131A patent/JPWO2024262604A1/ja active Pending
- 2024-06-21 CN CN202480040315.0A patent/CN121335936A/zh active Pending