JPWO2024075704A5 - - Google Patents
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- Publication number
- JPWO2024075704A5 JPWO2024075704A5 JP2024515144A JP2024515144A JPWO2024075704A5 JP WO2024075704 A5 JPWO2024075704 A5 JP WO2024075704A5 JP 2024515144 A JP2024515144 A JP 2024515144A JP 2024515144 A JP2024515144 A JP 2024515144A JP WO2024075704 A5 JPWO2024075704 A5 JP WO2024075704A5
- Authority
- JP
- Japan
- Prior art keywords
- ions
- semiconductor processing
- processing solution
- concentration
- ion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024211777A JP2025023273A (ja) | 2022-10-03 | 2024-12-04 | 半導体用処理液 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022159584 | 2022-10-03 | ||
| JP2022159584 | 2022-10-03 | ||
| PCT/JP2023/035958 WO2024075704A1 (ja) | 2022-10-03 | 2023-10-02 | 半導体用処理液 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024211777A Division JP2025023273A (ja) | 2022-10-03 | 2024-12-04 | 半導体用処理液 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024075704A1 JPWO2024075704A1 (https=) | 2024-04-11 |
| JPWO2024075704A5 true JPWO2024075704A5 (https=) | 2024-10-03 |
| JP7600466B2 JP7600466B2 (ja) | 2024-12-16 |
Family
ID=90608159
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024515144A Active JP7600466B2 (ja) | 2022-10-03 | 2023-10-02 | 半導体用処理液 |
| JP2024211777A Pending JP2025023273A (ja) | 2022-10-03 | 2024-12-04 | 半導体用処理液 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024211777A Pending JP2025023273A (ja) | 2022-10-03 | 2024-12-04 | 半導体用処理液 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250084309A1 (https=) |
| JP (2) | JP7600466B2 (https=) |
| KR (2) | KR20250160213A (https=) |
| TW (1) | TWI897049B (https=) |
| WO (1) | WO2024075704A1 (https=) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100980607B1 (ko) * | 2007-11-08 | 2010-09-07 | 주식회사 하이닉스반도체 | 루테늄 연마용 슬러리 및 그를 이용한 연마 방법 |
| US8211800B2 (en) * | 2010-08-23 | 2012-07-03 | Kabushiki Kaisha Toshiba | Ru cap metal post cleaning method and cleaning chemical |
| KR102022139B1 (ko) * | 2012-03-16 | 2019-09-17 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 |
| JP2014103179A (ja) * | 2012-11-16 | 2014-06-05 | Fujifilm Corp | 半導体基板のエッチング液、これを用いたエッチング方法及び半導体素子の製造方法 |
| JP2016139774A (ja) * | 2015-01-23 | 2016-08-04 | 富士フイルム株式会社 | パターン処理方法、半導体基板製品の製造方法およびパターン構造の前処理液 |
| CN111684570B (zh) * | 2018-01-16 | 2024-02-27 | 株式会社德山 | 含有次氯酸根离子的半导体晶圆的处理液 |
| CN111684575B (zh) * | 2018-02-05 | 2023-09-29 | 富士胶片株式会社 | 药液、药液的制造方法、基板的处理方法 |
| JP6901998B2 (ja) | 2018-06-15 | 2021-07-14 | 株式会社トクヤマ | ４級アルキルアンモニウムイオン、亜塩素酸イオン、及び次亜塩素酸イオンを含む酸化性組成物 |
| JP7050184B2 (ja) * | 2019-09-27 | 2022-04-07 | 株式会社トクヤマ | ルテニウムの半導体用処理液及びその製造方法 |
| JP6874231B1 (ja) * | 2019-09-27 | 2021-05-19 | 株式会社トクヤマ | ＲｕＯ４ガスの発生抑制剤及びＲｕＯ４ガスの発生抑制方法 |
| WO2021210310A1 (ja) * | 2020-04-16 | 2021-10-21 | 富士フイルムエレクトロニクスマテリアルズ株式会社 | 処理液、化学的機械的研磨方法、半導体基板の処理方法 |
| JP7375032B2 (ja) * | 2020-08-07 | 2023-11-07 | 株式会社トクヤマ | 半導体ウエハ用処理液 |
| JP2022099242A (ja) * | 2020-12-22 | 2022-07-04 | 東京応化工業株式会社 | 精製オルト過ヨウ素酸水溶液の製造方法、半導体素子の製造方法及びオルト過ヨウ素酸水溶液 |
-
2023
- 2023-10-02 US US18/707,255 patent/US20250084309A1/en active Pending
- 2023-10-02 KR KR1020257035452A patent/KR20250160213A/ko active Pending
- 2023-10-02 KR KR1020257010612A patent/KR102877889B1/ko active Active
- 2023-10-02 WO PCT/JP2023/035958 patent/WO2024075704A1/ja not_active Ceased
- 2023-10-02 JP JP2024515144A patent/JP7600466B2/ja active Active
- 2023-10-03 TW TW112137896A patent/TWI897049B/zh active
-
2024
- 2024-12-04 JP JP2024211777A patent/JP2025023273A/ja active Pending
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