JPWO2024009554A5 - - Google Patents

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Publication number
JPWO2024009554A5
JPWO2024009554A5 JP2023569727A JP2023569727A JPWO2024009554A5 JP WO2024009554 A5 JPWO2024009554 A5 JP WO2024009554A5 JP 2023569727 A JP2023569727 A JP 2023569727A JP 2023569727 A JP2023569727 A JP 2023569727A JP WO2024009554 A5 JPWO2024009554 A5 JP WO2024009554A5
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JP
Japan
Prior art keywords
metal post
opening
electronic component
core substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023569727A
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English (en)
Japanese (ja)
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JP7662057B2 (ja
JPWO2024009554A1 (https=
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Priority claimed from PCT/JP2023/006988 external-priority patent/WO2024009554A1/ja
Publication of JPWO2024009554A1 publication Critical patent/JPWO2024009554A1/ja
Publication of JPWO2024009554A5 publication Critical patent/JPWO2024009554A5/ja
Application granted granted Critical
Publication of JP7662057B2 publication Critical patent/JP7662057B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023569727A 2022-07-06 2023-02-27 基板及びモジュール Active JP7662057B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022109098 2022-07-06
JP2022109098 2022-07-06
PCT/JP2023/006988 WO2024009554A1 (ja) 2022-07-06 2023-02-27 基板及びモジュール

Publications (3)

Publication Number Publication Date
JPWO2024009554A1 JPWO2024009554A1 (https=) 2024-01-11
JPWO2024009554A5 true JPWO2024009554A5 (https=) 2024-06-11
JP7662057B2 JP7662057B2 (ja) 2025-04-15

Family

ID=89452948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023569727A Active JP7662057B2 (ja) 2022-07-06 2023-02-27 基板及びモジュール

Country Status (4)

Country Link
US (1) US20250071906A1 (https=)
JP (1) JP7662057B2 (https=)
CN (1) CN119096707A (https=)
WO (1) WO2024009554A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI833522B (zh) * 2022-12-23 2024-02-21 稜研科技股份有限公司 封裝結構
WO2026009567A1 (ja) * 2024-07-04 2026-01-08 株式会社村田製作所 電子部品集積モジュール、モジュール内蔵基板及び電子部品集積モジュールの製造方法
WO2026075093A1 (ja) * 2024-10-02 2026-04-09 株式会社村田製作所 電子部品内蔵基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291799A (ja) 2000-04-11 2001-10-19 Ngk Spark Plug Co Ltd 配線基板
JP2005210074A (ja) 2003-12-26 2005-08-04 Tdk Corp 多層基板及びパワーアンプモジュール
JP5540960B2 (ja) 2010-07-15 2014-07-02 日本電気株式会社 機能素子内蔵基板
KR20130014122A (ko) 2011-07-29 2013-02-07 삼성전기주식회사 전자 소자 내장 인쇄회로기판 및 그 제조방법
KR101514518B1 (ko) 2013-05-24 2015-04-22 삼성전기주식회사 전자부품 내장 인쇄회로기판 및 그 제조방법
WO2022124262A1 (ja) 2020-12-09 2022-06-16 株式会社村田製作所 高周波モジュール及び通信装置

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