JP7662057B2 - 基板及びモジュール - Google Patents

基板及びモジュール Download PDF

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Publication number
JP7662057B2
JP7662057B2 JP2023569727A JP2023569727A JP7662057B2 JP 7662057 B2 JP7662057 B2 JP 7662057B2 JP 2023569727 A JP2023569727 A JP 2023569727A JP 2023569727 A JP2023569727 A JP 2023569727A JP 7662057 B2 JP7662057 B2 JP 7662057B2
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JP
Japan
Prior art keywords
metal post
electronic component
opening
core substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023569727A
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English (en)
Japanese (ja)
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JPWO2024009554A5 (https=
JPWO2024009554A1 (https=
Inventor
竜一 久保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2024009554A1 publication Critical patent/JPWO2024009554A1/ja
Publication of JPWO2024009554A5 publication Critical patent/JPWO2024009554A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2023569727A 2022-07-06 2023-02-27 基板及びモジュール Active JP7662057B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022109098 2022-07-06
JP2022109098 2022-07-06
PCT/JP2023/006988 WO2024009554A1 (ja) 2022-07-06 2023-02-27 基板及びモジュール

Publications (3)

Publication Number Publication Date
JPWO2024009554A1 JPWO2024009554A1 (https=) 2024-01-11
JPWO2024009554A5 JPWO2024009554A5 (https=) 2024-06-11
JP7662057B2 true JP7662057B2 (ja) 2025-04-15

Family

ID=89452948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023569727A Active JP7662057B2 (ja) 2022-07-06 2023-02-27 基板及びモジュール

Country Status (4)

Country Link
US (1) US20250071906A1 (https=)
JP (1) JP7662057B2 (https=)
CN (1) CN119096707A (https=)
WO (1) WO2024009554A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI833522B (zh) * 2022-12-23 2024-02-21 稜研科技股份有限公司 封裝結構
WO2026009567A1 (ja) * 2024-07-04 2026-01-08 株式会社村田製作所 電子部品集積モジュール、モジュール内蔵基板及び電子部品集積モジュールの製造方法
WO2026075093A1 (ja) * 2024-10-02 2026-04-09 株式会社村田製作所 電子部品内蔵基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291799A (ja) 2000-04-11 2001-10-19 Ngk Spark Plug Co Ltd 配線基板
JP2005210074A (ja) 2003-12-26 2005-08-04 Tdk Corp 多層基板及びパワーアンプモジュール
JP2012023237A (ja) 2010-07-15 2012-02-02 Nec Corp 機能素子内蔵基板
US20130027896A1 (en) 2011-07-29 2013-01-31 Samsung Electro-Mechanics Co., Ltd. Electronic component embedded printed circuit board and method of manufacturing the same
JP2014229908A (ja) 2013-05-24 2014-12-08 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品内臓印刷回路基板及びその製造方法
WO2022124262A1 (ja) 2020-12-09 2022-06-16 株式会社村田製作所 高周波モジュール及び通信装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291799A (ja) 2000-04-11 2001-10-19 Ngk Spark Plug Co Ltd 配線基板
JP2005210074A (ja) 2003-12-26 2005-08-04 Tdk Corp 多層基板及びパワーアンプモジュール
JP2012023237A (ja) 2010-07-15 2012-02-02 Nec Corp 機能素子内蔵基板
US20130027896A1 (en) 2011-07-29 2013-01-31 Samsung Electro-Mechanics Co., Ltd. Electronic component embedded printed circuit board and method of manufacturing the same
JP2014229908A (ja) 2013-05-24 2014-12-08 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品内臓印刷回路基板及びその製造方法
WO2022124262A1 (ja) 2020-12-09 2022-06-16 株式会社村田製作所 高周波モジュール及び通信装置

Also Published As

Publication number Publication date
US20250071906A1 (en) 2025-02-27
CN119096707A (zh) 2024-12-06
WO2024009554A1 (ja) 2024-01-11
JPWO2024009554A1 (https=) 2024-01-11

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