JPWO2024009554A1 - - Google Patents

Info

Publication number
JPWO2024009554A1
JPWO2024009554A1 JP2023569727A JP2023569727A JPWO2024009554A1 JP WO2024009554 A1 JPWO2024009554 A1 JP WO2024009554A1 JP 2023569727 A JP2023569727 A JP 2023569727A JP 2023569727 A JP2023569727 A JP 2023569727A JP WO2024009554 A1 JPWO2024009554 A1 JP WO2024009554A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023569727A
Other languages
Japanese (ja)
Other versions
JP7662057B2 (ja
JPWO2024009554A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024009554A1 publication Critical patent/JPWO2024009554A1/ja
Publication of JPWO2024009554A5 publication Critical patent/JPWO2024009554A5/ja
Application granted granted Critical
Publication of JP7662057B2 publication Critical patent/JP7662057B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2023569727A 2022-07-06 2023-02-27 基板及びモジュール Active JP7662057B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022109098 2022-07-06
JP2022109098 2022-07-06
PCT/JP2023/006988 WO2024009554A1 (ja) 2022-07-06 2023-02-27 基板及びモジュール

Publications (3)

Publication Number Publication Date
JPWO2024009554A1 true JPWO2024009554A1 (https=) 2024-01-11
JPWO2024009554A5 JPWO2024009554A5 (https=) 2024-06-11
JP7662057B2 JP7662057B2 (ja) 2025-04-15

Family

ID=89452948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023569727A Active JP7662057B2 (ja) 2022-07-06 2023-02-27 基板及びモジュール

Country Status (4)

Country Link
US (1) US20250071906A1 (https=)
JP (1) JP7662057B2 (https=)
CN (1) CN119096707A (https=)
WO (1) WO2024009554A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI833522B (zh) * 2022-12-23 2024-02-21 稜研科技股份有限公司 封裝結構
WO2026009567A1 (ja) * 2024-07-04 2026-01-08 株式会社村田製作所 電子部品集積モジュール、モジュール内蔵基板及び電子部品集積モジュールの製造方法
WO2026075093A1 (ja) * 2024-10-02 2026-04-09 株式会社村田製作所 電子部品内蔵基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291799A (ja) * 2000-04-11 2001-10-19 Ngk Spark Plug Co Ltd 配線基板
JP2005210074A (ja) * 2003-12-26 2005-08-04 Tdk Corp 多層基板及びパワーアンプモジュール
JP2012023237A (ja) * 2010-07-15 2012-02-02 Nec Corp 機能素子内蔵基板
US20130027896A1 (en) * 2011-07-29 2013-01-31 Samsung Electro-Mechanics Co., Ltd. Electronic component embedded printed circuit board and method of manufacturing the same
JP2014229908A (ja) * 2013-05-24 2014-12-08 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品内臓印刷回路基板及びその製造方法
WO2022124262A1 (ja) * 2020-12-09 2022-06-16 株式会社村田製作所 高周波モジュール及び通信装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291799A (ja) * 2000-04-11 2001-10-19 Ngk Spark Plug Co Ltd 配線基板
JP2005210074A (ja) * 2003-12-26 2005-08-04 Tdk Corp 多層基板及びパワーアンプモジュール
JP2012023237A (ja) * 2010-07-15 2012-02-02 Nec Corp 機能素子内蔵基板
US20130027896A1 (en) * 2011-07-29 2013-01-31 Samsung Electro-Mechanics Co., Ltd. Electronic component embedded printed circuit board and method of manufacturing the same
JP2014229908A (ja) * 2013-05-24 2014-12-08 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品内臓印刷回路基板及びその製造方法
WO2022124262A1 (ja) * 2020-12-09 2022-06-16 株式会社村田製作所 高周波モジュール及び通信装置

Also Published As

Publication number Publication date
US20250071906A1 (en) 2025-02-27
JP7662057B2 (ja) 2025-04-15
CN119096707A (zh) 2024-12-06
WO2024009554A1 (ja) 2024-01-11

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