JPWO2024004263A1 - - Google Patents

Info

Publication number
JPWO2024004263A1
JPWO2024004263A1 JP2023579251A JP2023579251A JPWO2024004263A1 JP WO2024004263 A1 JPWO2024004263 A1 JP WO2024004263A1 JP 2023579251 A JP2023579251 A JP 2023579251A JP 2023579251 A JP2023579251 A JP 2023579251A JP WO2024004263 A1 JPWO2024004263 A1 JP WO2024004263A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023579251A
Other languages
Japanese (ja)
Other versions
JP7537637B2 (ja
JPWO2024004263A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024004263A1 publication Critical patent/JPWO2024004263A1/ja
Publication of JPWO2024004263A5 publication Critical patent/JPWO2024004263A5/ja
Application granted granted Critical
Publication of JP7537637B2 publication Critical patent/JP7537637B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2023579251A 2022-06-27 2023-02-17 基板 Active JP7537637B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022102606 2022-06-27
JP2022102606 2022-06-27
PCT/JP2023/005690 WO2024004263A1 (ja) 2022-06-27 2023-02-17 基板

Publications (3)

Publication Number Publication Date
JPWO2024004263A1 true JPWO2024004263A1 (https=) 2024-01-04
JPWO2024004263A5 JPWO2024004263A5 (https=) 2024-06-04
JP7537637B2 JP7537637B2 (ja) 2024-08-21

Family

ID=89381915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023579251A Active JP7537637B2 (ja) 2022-06-27 2023-02-17 基板

Country Status (4)

Country Link
US (1) US20250056729A1 (https=)
JP (1) JP7537637B2 (https=)
CN (1) CN119032635A (https=)
WO (1) WO2024004263A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022125554A1 (de) * 2022-10-04 2024-04-04 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Package mit Komponententräger mit Hohlraum und elektronischer Komponente sowie funktionellem Füllmedium darin
US20240243036A1 (en) * 2023-01-12 2024-07-18 Qualcomm Incorporated Cavity-embedded tunable filter
WO2026009567A1 (ja) * 2024-07-04 2026-01-08 株式会社村田製作所 電子部品集積モジュール、モジュール内蔵基板及び電子部品集積モジュールの製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004349672A (ja) * 2002-07-10 2004-12-09 Ngk Spark Plug Co Ltd 充填材及びそれを用いた多層配線基板並びに多層配線基板の製造方法
WO2006011508A1 (ja) * 2004-07-30 2006-02-02 Murata Manufacturing Co., Ltd. 複合型電子部品及びその製造方法
US20140247570A1 (en) * 2013-03-01 2014-09-04 Unimicron Technology Corporation Circuit board structure having electronic components embedded therein and method of fabricating the same
WO2014162478A1 (ja) * 2013-04-01 2014-10-09 株式会社メイコー 部品内蔵基板及びその製造方法
US20160113139A1 (en) * 2014-10-16 2016-04-21 The Charles Stark Draper Laboratory, Inc. Methods and devices for improved space utilization in wafer based modules
WO2017199825A1 (ja) * 2016-05-18 2017-11-23 株式会社村田製作所 部品内蔵基板、および、部品内蔵基板の製造方法
JP2019207978A (ja) * 2018-05-30 2019-12-05 イビデン株式会社 プリント配線板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004349672A (ja) * 2002-07-10 2004-12-09 Ngk Spark Plug Co Ltd 充填材及びそれを用いた多層配線基板並びに多層配線基板の製造方法
WO2006011508A1 (ja) * 2004-07-30 2006-02-02 Murata Manufacturing Co., Ltd. 複合型電子部品及びその製造方法
US20140247570A1 (en) * 2013-03-01 2014-09-04 Unimicron Technology Corporation Circuit board structure having electronic components embedded therein and method of fabricating the same
WO2014162478A1 (ja) * 2013-04-01 2014-10-09 株式会社メイコー 部品内蔵基板及びその製造方法
US20160113139A1 (en) * 2014-10-16 2016-04-21 The Charles Stark Draper Laboratory, Inc. Methods and devices for improved space utilization in wafer based modules
WO2017199825A1 (ja) * 2016-05-18 2017-11-23 株式会社村田製作所 部品内蔵基板、および、部品内蔵基板の製造方法
JP2019207978A (ja) * 2018-05-30 2019-12-05 イビデン株式会社 プリント配線板

Also Published As

Publication number Publication date
JP7537637B2 (ja) 2024-08-21
US20250056729A1 (en) 2025-02-13
WO2024004263A1 (ja) 2024-01-04
CN119032635A (zh) 2024-11-26

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